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PDF AMMC-3040 Data sheet ( Hoja de datos )
| Número de pieza | AMMC-3040 | |
| Descripción | 18-36 GHz Double-Balanced Mixer | |
| Fabricantes | Hewlett-Packard | |
| Logotipo |  |
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Agilent AMMC-3040
18-36 GHz Double-Balanced Mixer
with Integrated LO Amplifier/
Multiplier
Data Sheet
Features
• High IIP3 : +23 dBm
• Wide Bandwidth
• RF: 18-36 GHz
• LO: 18-36 GHz
• IF: DC-3 GHz
Chip Size:
Chip Size Tolerance:
Chip Thickness:
Pad Dimensions:
2520 x 760 µm (99.2 x 29.9 mils)
± 10 µm (± 0.4 mils)
100 ± 10 µm (4 ± 0.4 mils)
75 x 75 µm (3 ± 0.4 mils)
• Fundamental or Sub-Harmonic
Mixing
• Up or Down Converter
• Conversion Loss: 9.5dB
• P1dB : +17 dBm
Description
• Low LO Drive Power: + 2 dBm
• Usable to 42 GHz
The AMMC- 3040 is a broadband
Double- Balanced Mixer (DBM)
with an integrated high- gain LO
amplifier. This MMIC can be
used as either an up converter
or down converter in microwave
or millimeter wave applications.
If desired, the LO amplifier can
be biased to function as a
frequency multiplier to enable
second harmonic mixing of the
LO input. The mixer section
ofthe AMMC- 3040 is fabricated
using a suspended metal system
to create a unique, broadside-
coupled balun structure (patent
pending) to achieve exceptional
bandwidth. The MMIC provides
repeatable conversion loss
without tuning, making it highly
suitable for automated assembly
processes.
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Applications
• Point-to-Point Radio
• LMDS
• SATCOM
AMMC-3040 Absolute Maximum Ratings[1]
Symbol Parameters/Conditions
Units Min. Max.
VD1, 2, 3, 4 Positive Drain Voltage
V5
VG1, 2, 3, 4 Gate Voltage
V -3.0 0.5
Idd Total Drain Current
mA 550
Tch Operating Channel Temp. °C +160
Tb Operating Backside Temp.
°C -55
Tstg Storage Case Temp.
°C -65 +165
Tmax Maximum Assembly Temp (60 sec max) °C
+300
Note:
1. Operation in excess of any one of these conditions may result in permanent damage to this device.
DataShee
Note: These devices are ESD sensitive. The following precautions are strongly recommended:
Ensure that an ESD approved carrier is used when dice are transported from one destination to another.
Personal grounding is to be worn at all times when handling these devices.
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To VDD DC Drain
Supply Feed
Gold Plated Shim
(optional)
100 pF
Cb
LO
IF
0.6 pF
~500 µm long
wire
To VDD DC Drain
Supply Feed
100 pF
Gold Plated Shim
(optional)
Cb
LO
RF
IF
0.6 pF
~500 µm long
wire
RF
100 pF
100 pF
100 pF
Cb To VGG DC Gate
Supply Feed
To VGG DC Gate
Supply Feed
Cb
Cb To VGG DC Gate
Supply Feed
(a) Fundamental LO. Single drain and single gate supply assembly for using (b) Sub-harmonic LO. Separate first-stage gate bias supply to use the LO
the LO amplifier in fundamental frequency mixer applications.
amplifier as a multiplier for application as a sub-harmonic mixer.
(Note: To assure stable operation bias supply feeds should be bypassed to ground with a capacitor, Cb > 100 pF typical)
Figure 16. AMMC-3040 Assembly diagram.
et4U.com
Biasing for Fundamental Mixing
The recommended DC bias
condition for the AMMC- 3040
LO amplifier when used as a
fundamental frequency mixer is
with all four drains connected
to a single 3.5 to 4.5V supply
and all four gates connected to
an adjustable negative supply
voltage as shown in Figure 16
(a). The gate voltage is adjusted
for a total drain supply current
of typically 150 to 250 mA.
The second, third, and fourth
stage DC drain bias lines are
connected internally and
therefore require only a single
bond wire. A separate bond
wire is needed for the first
stage DC drain bias, Vd1.
The third and fourth stage DC
gate bias lines are connected
internally. A total of three DC
gate bond wires are required:
one for Vg1, one for Vg2, and
one for the Vg3 / Vg4 connection.
The internal matching circuitry
at the RF input creates a 50-
ohm DC and RF path to ground.
Any DC voltage applied to the
RF input must be maintained
below 1 volt, otherwise, a
DataSheet4Ub.lcoocmking capacitor should be
used. The RF output is AC
coupled.
No ground bond wires are
needed since the ground
connection is made by means of
plated through via holes to the
backside of the chip.
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Biasing for Sub-Harmonic Mixing
The LO amplifier in the AMMC-
3040 can also be used as a
frequency doubler. Optimum
conversion efficiency as a
doubler is obtained with an
input power level of 3 to 8
dBm.
Frequency multiplication is
achieved by reducing the bias
on the first stage FET to
efficiently generate harmonics.
The remaining three stages are
then used to provide
amplification.
While many bias methods could
be used to generate and amplify
the desired harmonics within
the AMMC- 3040’s LO amplifier,
the following information is
suggested as a starting point for
sub- harmonic mixing
applications.
Frequency doubling is
accomplished by biasing the
first stage FET at pinch- off by
setting Vg1 = Vp ≈ –1.1 volts.
The remaining three stages are
biased for normal amplification,
e.g., Vgg is adjusted such that
Id2 + Id3 + Id4 ≈ 250 mA. The
drain voltage, Vdd, for all four
stages should be 3.5 to 4.5 volts.
The assembly diagram shown in
Figure 16 (b) can be used as a
guideline.
In all cases, Cb > 100 pF to
assure stability.
IF Output Port
The IF output port is located
near the middle of the die,
allowing this connection to be
made from either side of the
chip for maximum layout
flexibility.
The LO and RF signals are
reflectively terminating at the IF
port by connecting a 20- mil
(500 um) long bond wire from
the IF output pad on the MMIC
to a shunt 0.6 pF chip capacitor
mounted off- chip as indicated
in Figure 16.
5
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