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PDF TS83102G0BMGS Data sheet ( Hoja de datos )
| Número de pieza | TS83102G0BMGS | |
| Descripción | 10-bit 2 Gsps ADC MIL | |
| Fabricantes | ATMEL Corporation | |
| Logotipo |  |
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Features
• Up to 2 Gsps Sampling Rate
• Power Consumption: 4.6W
• 500 mVpp Differential 100Ω or Single-ended 50Ω (±2 %) Analog Inputs
• Differential 100Ω or Single-ended 50Ω Clock Inputs
• ECL or LVDS Output Compatibility
• 50Ω Differential Outputs with Common Mode not Dependent on Temperature
• ADC Gain Adjust
• Sampling Delay Adjust
• Offset Control Capability
• Data Ready Output with Asynchronous Reset
• Out-of-range Output Bit
• Selectable Decimation by 32-function
• Gray or Binary Selectable Output Data; NRZ Output Mode
• Pattern Generator Output (for Acquisition System Monitoring)
• Radiation Tolerance Oriented Design (More Than 100 Krad (Si) Expected)
• CI-CGA152 Cavity Down Hermetic Package
• CBGA 152 Package Evaluation Board TSEV83102G0BGL
• Companion Device: DMUX 8-/10-bit 1:4/1:8 2 Gsps TS81102G0
10-bit 2 Gsps
ADC MIL
TS83102G0BMGS
Performance
• 3.3 GHz Full Power Input Bandwidth (-3 dB)
• Gain Flatness: ± 0.2 dB (from DC up to 1.5 GHz)
• Low Input VSWR: 1.2 Max from DC to 2.5 GHz
• SFDR = -59 dBc; 7.6 Effective Bits at FS = 1.4 Gsps, FIN = 700 MHz [-1 dBFS]
• SFDR = -53 dBc; 7.1 Effective Bits at Fs = 1.4 Gsps, FIN = 1950 MHz [-1 dBFS]
• SFDR = -54 dBc; 6.5 Effective Bits at FS = 2 Gsps, FIN = 2 GHz [-1 dBFS]
• Low Bit Error Rate (10-12) at 2 Gsps
Summary
For more information, please
contact
Application
• Direct RF Down Conversion
• Wide Band Satellite Receiver
• High-speed Instrumentation
• High-speed Acquisition Systems
• High-energy Physics
• Automatic Test Equipment
• Radar
Screening
• Temperature Range for Packaged Device:
– “M” Grade: -40° C < TC; TJ < 125° C
• Standard Die Flow (upon Request)
Description
The TS83102G0BMGS is a monolithic 10-bit analog-to-digital converter, designed for
digitizing wide bandwidth analog signals at very high sampling rates of up to 2 Gsps. It
uses an innovative architecture, including an on-chip Sample and Hold (S/H). The
3.3 GHz full power input bandwidth and band flatness performances enable the digitiz-
ing of high IF and large bandwidth signals.
5360AS–BDC–08/04
This is a summary document only. A complete document is not avail-
able at this time. For more information, please contact your local
Atmel sales office.
1 page  
Figure 2. Pinout
OR
ORB
TS83102G0BMGS
DDIEOCDBE/
PGEB
TS83102G0BMGS
CI-CGA 152
BOTTOM VIEW
Notes:
1. To simplify PCB routing, the 4 NC columns can be electrically connected to the GND
columns.
2. The pinout is shown from the bottom. The columns and rows are defined differently from the
JEDEC standard.
5360AS–BDC–08/04
5
5 Page 
Figure 7. Cross Section
CuW heat spreader
AI203 plate
brazed on CuW
This side has
no metalization
TS83102G0BMGS
High To solder coloumns
(Pb90Sn10)
152 columns in 3 external rows
minus 4 corners
Combo lid
soldered
9.27 mm sq
0.254 mm thick
5360AS–BDC–08/04
All units in mm
(0.300)
(0.500)
(0.150)
1.62 +/- 0.075
0.80 +/- 0.09 1.55 +/- 0.16 (0.30 +/- 0.05)
4.42 +/- 0.40
11
11 Page | ||
| Páginas | Total 13 Páginas | |
| PDF Descargar | [ Datasheet TS83102G0BMGS.PDF ] | |
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