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PDF MTDN9971Q8 Data sheet ( Hoja de datos )
| Número de pieza | MTDN9971Q8 | |
| Descripción | Dual N-Channel Enhancement Mode Power MOSFET | |
| Fabricantes | CYStech | |
| Logotipo |  |
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CYStech Electronics Corp.
Spec. No. : C415Q8
Issued Date : 2007.07.05
Revised Date :
Page No. : 1/5
Dual N-CHANNEL ENHANCEMENT MODE POWER MOSFET
MTDN9971Q8
Description
The MTDN9971Q8 provides the designer with the best combination of fast switching, ruggedized device
design, low on-resistance and cost effectiveness.
The SOP-8 package is universally preferred for all commercial-industrial surface mount applications and
suited for low voltage applications such as DC/DC converters.
Features
• RDS(ON)=60mΩ@VGS=4.5V, ID=2.5A
• Simple drive requirement
• Low on-resistance
• Fast switching speed
• Dual N-ch MOSFET package
• Pb-free package
Equivalent Circuit
MTDN9971Q8
Outline
SOP-8
G：Gate
S：Source
D：Drain
MTDN9971Q8
CYStek Product Specification
1 page  
SOP-8 Dimension
Top View
A
CYStech Electronics Corp.
Right side View
G
Marking:
Spec. No. : C415Q8
Issued Date : 2007.07.05
Revised Date :
Page No. : 5/5
I
Device Name
9971SS
Date Code
□□□□
B CH
D
Front View
Part A
E
F
J
K
Part A L
M
N
O
8-Lead SOP-8 Plastic Package
CYStek Package Code: Q8
DIM
Inches
Min. Max.
A 0.1909 0.2007
B 0.1515 0.1555
C 0.2283 0.2441
D 0.0480 0.0519
E 0.0145 0.0185
F 0.1472 0.1527
G 0.0570 0.0649
H 0.1889 0.2007
Millimeters
Min. Max.
4.85 5.10
3.85 3.95
5.80 6.20
1.22 1.32
0.37 0.47
3.74 3.88
1.45 1.65
4.80 5.10
DIM
Inches
Min. Max.
I 0.0019 0.0078
J 0.0118 0.0275
K 0.0074 0.0098
L 0.0145 0.0204
M 0.0118 0.0197
N 0.0031 0.0051
O 0.0000 0.0059
*: Typical
Millimeters
Min. Max.
0.05 0.20
0.30 0.70
0.19 0.25
0.37 0.52
0.30 0.50
0.08 0.13
0.00 0.15
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
MTDN9971Q8
CYStek Product Specification
5 Page | ||
| Páginas | Total 5 Páginas | |
| PDF Descargar | [ Datasheet MTDN9971Q8.PDF ] | |
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