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S29GL256P PDF даташит

Спецификация S29GL256P изготовлена ​​​​«Cypress Semiconductor» и имеет функцию, называемую «Page Flash».

Детали детали

Номер произв S29GL256P
Описание Page Flash
Производители Cypress Semiconductor
логотип Cypress Semiconductor логотип 

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S29GL256P Даташит, Описание, Даташиты
S29GL01GP
S29GL512P
S29GL256P
S29GL128P
1 Gbit, 512, 256, 128 Mbit, 3 V, Page Flash
with 90 nm MirrorBit Process Technology
General Description
The Spansion S29GL01G/512/256/128P are Mirrorbit® Flash products fabricated on 90 nm process technology. These devices
offer a fast page access time of 25 ns with a corresponding random access time as fast as 90 ns. They feature a Write Buffer that
allows a maximum of 32 words/64 bytes to be programmed in one operation, resulting in faster effective programming time than
standard programming algorithms. This makes these devices ideal for today’s embedded applications that require higher density,
better performance and lower power consumption.
Distinctive Characteristics
Single 3V read/program/erase (2.7-3.6 V)
Enhanced VersatileI/O™ control
– All input levels (address, control, and DQ input levels) and
outputs are determined by voltage on VIO input. VIO range is 1.65
to VCC
90 nm MirrorBit process technology
8-word/16-byte page read buffer
32-word/64-byte write buffer reduces overall programming time for
multiple-word updates
Secured Silicon Sector region
– 128-word/256-byte sector for permanent, secure identification
through an 8-word/16-byte random Electronic Serial Number
– Can be programmed and locked at the factory or by the
customer
Uniform 64 Kword/128 Kbyte Sector Architecture
– S29GL01GP: One thousand twenty-four sectors
– S29GL512P: Five hundred twelve sectors
– S29GL256P: Two hundred fifty-six sectors
– S29GL128P: One hundred twenty-eight sectors
100,000 erase cycles per sector typical
20-year data retention typical
Offered Packages
– 56-pin TSOP
– 64-ball Fortified BGA
Suspend and Resume commands for Program and Erase
operations
Write operation status bits indicate program and erase operation
completion
Unlock Bypass Program command to reduce programming time
Support for CFI (Common Flash Interface)
Persistent and Password methods of Advanced Sector Protection
WP#/ACC input
– Accelerates programming time (when VHH is applied) for greater
throughput during system production
– Protects first or last sector regardless of sector protection
settings
Hardware reset input (RESET#) resets device
Ready/Busy# output (RY/BY#) detects program or erase cycle
completion
Cypress Semiconductor Corporation • 198 Champion Court
Document Number: 002-00886 Rev. *A
• San Jose, CA 95134-1709 • 408-943-2600
Revised December 16, 2015









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S29GL256P Даташит, Описание, Даташиты
S29GL01GP
S29GL512P
S29GL256P
S29GL128P
Performance Characteristics
Maximum Read Access Times (ns)
Density
128 & 256 Mb
512 Mb
1 Gb
Voltage Range (1)
Regulated VCC
Full VCC
VersatileIO VIO
Regulated VCC
Full VCC
VersatileIO VIO
Regulated VCC
Full VCC
VersatileIO VIO
Random Access
Time (tACC)
90
100/110
110
100
110
120
110
120
130
Page Access Time
(tPACC)
25
25
25
Notes
1. Access times are dependent on VCC and VIO operating ranges.
See Ordering Information page for further details.
Regulated VCC: VCC = 3.0–3.6 V.
Full VCC: VCC = VIO = 2.7–3.6 V.
VersatileIO VIO: VIO = 1.65–VCC, VCC = 2.7–3.6 V.
2. Contact a sales representative for availability.
CE# Access Time
(tCE)
90
100/110
110
100
110
120
110
120
130
OE# Access Time
(tOE)
25
25
25
Current Consumption (typical values)
Random Access Read (f = 5 MHz)
8-Word Page Read (f = 10 MHz)
Program/Erase
Standby
30 mA
1 mA
50 mA
1 µA
Program & Erase Times (typical values)
Single Word Programming
Effective Write Buffer Programming (VCC) Per Word
Effective Write Buffer Programming (VHH) Per Word
Sector Erase Time (64 Kword Sector)
60 µs
15 µs
13.5 µs
0.5 s
Document Number: 002-00886 Rev. *A
Page 2 of 82









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S29GL256P Даташит, Описание, Даташиты
S29GL01GP
S29GL512P
S29GL256P
S29GL128P
Contents
1. Ordering Information ................................................... 4
2. Input/Output Descriptions & Logic Symbol .............. 6
3. Block Diagram.............................................................. 7
4. Physical Dimensions/Connection Diagrams............. 7
4.1 Related Documents ....................................................... 7
4.2 Special Handling Instructions for BGA Package............ 7
4.3 LAA064—64 ball Fortified Ball Grid Array, 11 x 13 mm. 9
4.4 TS056—56-Pin Standard Thin Small Outline Package
(TSOP)......................................................................... 10
5. Additional Resources ................................................ 12
5.1 Application Notes ......................................................... 12
5.2 Specification Bulletins .................................................. 12
5.3 Hardware and Software Support.................................. 12
5.4 Contacting Spansion.................................................... 12
6. Product Overview ...................................................... 13
6.1 Memory Map ................................................................ 13
7. Device Operations ..................................................... 14
7.1 Device Operation Table ............................................... 14
7.2 Word/Byte Configuration.............................................. 15
7.3 VersatileIOTM (VIO) Control .......................................... 15
7.4 Read ............................................................................ 15
7.5 Page Read Mode ......................................................... 15
7.6 Autoselect .................................................................... 16
7.7 Program/Erase Operations .......................................... 19
7.8 Write Operation Status................................................. 31
7.9 Writing Commands/Command Sequences.................. 35
8. Advanced Sector Protection/Unprotection ............. 37
8.1 Lock Register ............................................................... 38
8.2 Persistent Protection Bits............................................. 38
8.3 Persistent Protection Bit Lock Bit................................. 40
8.4 Password Protection Method ....................................... 40
8.5 Advanced Sector Protection Software Examples ........ 43
8.6 Hardware Data Protection Methods............................. 43
9. Power Conservation Modes...................................... 44
9.1 Standby Mode.............................................................. 44
9.2 Automatic Sleep Mode................................................. 44
9.3 Hardware RESET# Input Operation............................. 44
9.4 Output Disable (OE#)................................................... 44
10. Secured Silicon Sector Flash Memory Region ....... 45
10.1 Factory Locked Secured Silicon Sector ....................... 45
10.2 Customer Lockable Secured Silicon Sector................. 46
10.3 Secured Silicon Sector Entry/Exit Command
Sequences ................................................................... 46
11. Electrical Specifications............................................ 48
11.1 Absolute Maximum Ratings ......................................... 48
11.2 Operating Ranges........................................................ 49
11.3 Test Conditions ............................................................ 49
11.4 Key to Switching Waveforms ....................................... 49
11.5 Switching Waveforms .................................................. 50
11.6 DC Characteristics ....................................................... 51
11.7 AC Characteristics ........................................................ 52
12. Appendix ..................................................................... 63
12.1 Command Definitions.................................................... 63
12.2 Common Flash Memory Interface................................. 69
13. Advance Information on S29GL-S Eclipse 65 nm
Mirror Bit Power-On and Warm Reset Timing .......... 73
14. Revision History.......................................................... 75
Document Number: 002-00886 Rev. *A
Page 3 of 82










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