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PDF SS22 Data sheet ( Hoja de datos )
| Número de pieza | SS22 | |
| Descripción | Surface Mount Schottky Power Rectifier | |
| Fabricantes | ON Semiconductor | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de SS22 (archivo pdf) en la parte inferior de esta página. Total 6 Páginas | ||
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SS22, SS24
Surface Mount
Schottky Power Rectifier
SMB Power Surface Mount Package
These devices employ the Schottky Barrier principle in a
metal−to−silicon power rectifier. Features epitaxial construction with
oxide passivation and metal overlay contact. Ideally suited for low
voltage, high frequency switching power supplies; free wheeling
diodes and polarity protection diodes.
Features
• Compact Package with J−Bend Leads Ideal for Automated Handling
• Highly Stable Oxide Passivated Junction
• Guardring for Over−Voltage Protection
• Low Forward Voltage Drop
• Pb−Free Package is Available
Mechanical Characteristics
• Case: Molded Epoxy
• Epoxy Meets UL 94 V−0 @ 0.125 in
• Weight: 95 mg (approximately)
• Cathode Polarity Band
• Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
• Available in 12 mm Tape, 2500 Units per 13 in Reel, Add “T3”
Suffix to Part Number
• Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
• ESD Ratings: Machine Model = C
ESD Ratings: Human Body Model = 3B
http://onsemi.com
SCHOTTKY BARRIER
RECTIFIER
2 AMPERES
20, 40 VOLTS
SMB
CASE 403A
PLASTIC
MARKING DIAGRAM
AYWW
SS2xG
G
SS2x = Specific Device Code
x = 2 or 4
A = Assembly Location
Y = Year
WW = Work Week
G = Pb−Free Package
(Note: Microdot may be in either location)
© Semiconductor Components Industries, LLC, 2005
July, 2005 − Rev. 2
ORDERING INFORMATION
Device
Package
Shipping†
SS22T3
SMB
2500/Tape & Reel
SS24T3
SMB
2500/Tape & Reel
SS24T3G
SMB
(Pb−Free)
2500/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
1 Publication Order Number:
SS24/D
1 page  
HE
E
L
SS22, SS24
PACKAGE DIMENSIONS
SMB
CASE 403A−03
ISSUE E
bD
L1 c
A1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P.
MILLIMETERS
DIM MIN
NOM MAX
A 1.90 2.13 2.41
A1 0.05
0.10
0.15
b 1.96 2.03 2.11
c 0.15 0.23 0.30
D 3.30 3.56 3.81
E 4.06 4.32 4.57
H E 5.21 5.44 5.59
L 0.76 1.02 1.27
L1 0.51 REF
MIN
0.075
0.002
0.077
0.006
0.130
0.160
0.205
0.030
INCHES
NOM
0.084
0.004
0.080
0.009
0.140
0.170
0.214
0.040
0.020 REF
MAX
0.095
0.006
0.083
0.012
0.150
0.180
0.220
0.050
A
SOLDERING FOOTPRINT*
2.261
0.089
2.743
0.108
2.159
0.085
ǒ ǓSCALE 8:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
5
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet SS22.PDF ] | |
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