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QM09N50F PDF даташит

Спецификация QM09N50F изготовлена ​​​​«UBIQ» и имеет функцию, называемую «N-Ch 500V Fast Switching MOSFETs».

Детали детали

Номер произв QM09N50F
Описание N-Ch 500V Fast Switching MOSFETs
Производители UBIQ
логотип UBIQ логотип 

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QM09N50F Даташит, Описание, Даташиты
QM09N50F
機密
1
2011-06-15 - 1 -
N-Ch 500V Fast Switching MOSFETs
General Description
The QM09N50F is the highest performance N-ch
MOSFETs with specialized high voltage
technology, which provide excellent RDSON and
gate charge for most of the SPS, Charger ,Adapter
and lighting applications .
The QM09N50F meet the RoHS and Green
Product requirement , 100% EAS guaranteed with
full function reliability approved.
Features
z Super Low Gate Charge
z Excellent CdV/dt effect decline
z 100% EAS Guaranteed
z Green Device Available
Product Summery
BVDSS
500V
RDSON
0.75
ID
9A
Applications
z High efficient switched mode power supplies
z Electronic lamp ballast
z LCD TV/ Monitor
z Adapter
TO220F Pin Configuration
Absolute Maximum Ratings
Symbol
VDS
VGS
ID@TC=25
ID@TC=100
IDM
EAS
IAS
PD@TC=25
TSTG
TJ
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current, VGS @ 10V1
Continuous Drain Current, VGS @ 10V1
Pulsed Drain Current2
Single Pulse Avalanche Energy3
Avalanche Current
Total Power Dissipation4
Storage Temperature Range
Operating Junction Temperature Range
S
GD
Rating
500
±30
9
5.7
18
32
8
30
-55 to 150
-55 to 150
Thermal Data
Symbol
RθJA
RθJC
Parameter
Thermal Resistance Junction-ambient (Steady State)1
Thermal Resistance Junction-Case1
Typ.
---
---
Max.
62
4.2
Units
V
V
A
A
A
mJ
A
W
Unit
/W
/W
Rev A.01 D052711
1









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QM09N50F Даташит, Описание, Даташиты
QM09N50F
機密
2
2011-06-15 - 2 -
N-Ch 500V Fast Switching MOSFETs
Electrical Characteristics (TJ=25 , unless otherwise noted)
Symbol
Parameter
BVDSS Drain-Source Breakdown Voltage
BVDSS/△TJ BVDSS Temperature Coefficient
RDS(ON) Static Drain-Source On-Resistance2
VGS(th)
VGS(th)
Gate Threshold Voltage
VGS(th) Temperature Coefficient
IDSS Drain-Source Leakage Current
IGSS Gate-Source Leakage Current
gfs Forward Transconductance
Qg Total Gate Charge (10V)
Qgs Gate-Source Charge
Qgd Gate-Drain Charge
Td(on)
Turn-On Delay Time
Tr Rise Time
Td(off)
Turn-Off Delay Time
Tf Fall Time
Ciss Input Capacitance
Coss Output Capacitance
Crss Reverse Transfer Capacitance
Conditions
VGS=0V , ID=250uA
Reference to 25, ID=1mA
VGS=10V , ID=4.5A
VGS=VDS , ID =250uA
VDS=400V , VGS=0V , TJ=25
VGS=±30V , VDS=0V
VDS=15V , ID=4.5A
VDS=400V , VGS=10V , ID=1A
VDD=250V , VGS=10V , RG=10Ω,
ID=1A
VDS=25V , VGS=0V , F=1MHz
Min.
500
---
---
2
---
---
---
---
---
---
---
---
---
---
---
---
---
---
Typ.
---
0.552
0.6
---
-8.52
---
---
10
34
10.9
8.9
18.2
19.2
56
37.6
1760
112
2.8
Max.
---
---
0.75
5
---
2
±100
---
47.6
15.3
12.5
36.4
35
112
75.2
2464
157
4
Unit
V
V/
Ω
V
mV/
uA
nA
S
nC
ns
pF
Guaranteed Avalanche Characteristics
Symbol
EAS
Parameter
Single Pulse Avalanche Energy5
Conditions
VDD=50V , L=1mH , IAS=3.5A
Min.
6.2
Typ.
---
Max.
---
Unit
mJ
Diode Characteristics
Symbol
Parameter
Conditions
Min.
IS Continuous Source Current1,6
ISM Pulsed Source Current2,6
VSD Diode Forward Voltage2
VG=VD=0V , Force Current
VGS=0V , IS=1A , TJ=25
---
---
---
trr Reverse Recovery Time
---
Qrr Reverse Recovery Charge
IF=1A , dI/dt=100A/µs , TJ=25---
Note :
1.The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper.
2.The data tested by pulsed , pulse width 300us , duty cycle 2%
3.The EAS data shows Max. rating . The test condition is VDD=50V,VGS=10V,L=1mH,IAS=8A
4.The power dissipation is limited by 150junction temperature
5.The Min. value is 100% EAS tested guarantee.
6.The data is theoretically the same as ID and IDM , in real applications , should be limited by total power dissipation.
Typ.
---
---
---
167
650
Max.
9
18
1
---
---
Unit
A
A
V
nS
nC
2









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QM09N50F Даташит, Описание, Даташиты
機密
3
Typical Characteristics
18
16
14
12
10
8
6
4
2
0
0
VGS=15V
VGS=10
VGS=8V
VGS=7V
VGS=6V
3 VDS 6, Drain-9to-Sou1rc2e Volt1a5ge (V)18
Fig.1 Typical Output Characteristics
18
16
14
12
10
8
6
4
2
0
0.0
TJ=150
TJ=25
0.3 0.6 0.9
VSD , Source-to-Drain Voltage (V)
21
1.2
Fig.3 Forward Characteristics of Reverse
Fig.5 Normalized VGS(th) vs. TJ
QM09N50F
2011-06-15 - 3 -
N-Ch 500V Fast Switching MOSFETs
1.1
ID=4.5A
1
0.9
0.8
0.7
0.6
5
7.5
V1G0S (V)
12.5
Fig.2 On-Resistance vs. G-S Voltage
15
Fig.4 Gate-Charge Characteristics
2.8
2.2
1.6
1.0
0.4
-50
0 50 100
TJ , Junction Temperature ()
Fig.6 Normalized RDSON vs. TJ
3
150










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