MCH6344 PDF даташит
Спецификация MCH6344 изготовлена «ON Semiconductor» и имеет функцию, называемую «Power MOSFET ( Transistor )». |
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Детали детали
Номер произв | MCH6344 |
Описание | Power MOSFET ( Transistor ) |
Производители | ON Semiconductor |
логотип |
5 Pages
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MCH6344
Power MOSFET
–30V, 150mΩ, –2A, Single P-Channel
This Power MOSFET is produced using ON Semiconductor’s trench
technology, which is specifically designed to minimize gate charge and low
on resistance. This device is suitable for applications with low gate charge
driving or low on resistance requirements.
Features
• Low On-Resistance
• 4V drive
• Pb-Free, Halogen Free and RoHS compliance
Typical Applications
• Load Switch
SPECIFICATIONS
ABSOLUTE MAXIMUM RATING at Ta = 25°C (Note 1, 2)
Parameter
Symbol
Value
Unit
Drain to Source Voltage
VDSS
−30 V
Gate to Source Voltage
VGSS
±20 V
Drain Current (DC)
ID −2 A
Drain Current (Pulse)
PW ≤ 10μs, duty cycle ≤ 1%
IDP
−8 A
Power Dissipation
When mounted on ceramic substrate
(900mm2 × 0.8mm)
PD
0.8 W
Junction Temperature
Tj 150 °C
Storage Temperature
Tstg
−55 to +150
°C
Note 1 : Stresses exceeding those listed in the Maximum Ratings table may damage
the device. If any of these limits are exceeded, device functionality should not
be assumed, damage may occur and reliability may be affected.
2 : This product is designed to “ESD immunity<200V*”, so please take care when
handling.
*Machine Model
THERMAL RESISTANCE RATINGS
Parameter
Junction to Ambient
When mounted on ceramic substrate
(900mm2 × 0.8mm)
Symbol
RθJA
Value
Unit
156.2 °C/W
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VDSS
−30V
RDS(on) Max
150mΩ@ −10V
255mΩ@ −4.5V
292mΩ@ −4V
ID Max
−2A
ELECTRICAL CONNECTION
P-Channel
1, 2, 5, 6
1 : Drain
3
2 : Drain
3 : Gate
4 : Source
5 : Drain
6 : Drain
4
PACKING TYPE : TL
MARKING
YT
TL
ORDERING INFORMATION
See detailed ordering and shipping
information on page 5 of this data sheet.
© Semiconductor Components Industries, LLC, 2015
June 2015 - Rev. 3
1
Publication Order Number :
MCH6344/D
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MCH6344
ELECTRICAL CHARACTERISTICS at Ta = 25°C (Note 3)
Parameter
Symbol
Conditions
Value
Unit
min typ max
Drain to Source Breakdown Voltage
Zero-Gate Voltage Drain Current
Gate to Source Leakage Current
Gate Threshold Voltage
Forward Transconductance
Static Drain to Source On-State
Resistance
Input Capacitance
V(BR)DSS
IDSS
IGSS
VGS(th)
gFS
RDS(on)1
RDS(on)2
RDS(on)3
Ciss
ID=−1mA, VGS=0V
VDS=−30V, VGS=0V
VGS=±16V, VDS=0V
VDS=−10V, ID=−1mA
VDS=−10V, ID=−1A
ID=−1A, VGS=−10V
ID=−0.5A, VGS=−4.5V
ID=−0.5A, VGS=−4V
−30 V
−1 μA
±10 μA
−1.2 −2.6 V
1.9 S
115 150 mΩ
182 255 mΩ
208 292 mΩ
172 pF
Output Capacitance
Reverse Transfer Capacitance
Coss
Crss
VDS=−10V, f=1MHz
51 pF
36 pF
Turn-ON Delay Time
Rise Time
Turn-OFF Delay Time
Fall Time
Total Gate Charge
td(on)
tr
td(off)
tf
Qg
See specified Test Circuit
4.5
4.2
20
10.6
3.9
ns
ns
ns
ns
nC
Gate to Source Charge
Gate to Drain “Miller” Charge
Qgs VDS=−15V, VGS=−10V, ID=−2A
Qgd
0.6 nC
0.8 nC
Forward Diode Voltage
VSD
IS=−2A, VGS=0V
−0.86
−1.5 V
Note 3 : Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted.
Product performance may not be indicated by the Electrical Characteristics if operated under different conditions.
Switching Time Test Circuit
VIN
0V
--10V
VIN
PW=10μs
D.C.≤1%
G
VDD= --15V
ID= --1A
RL=15Ω
D VOUT
MCH6344
P.G 50Ω S
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MCH6344
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MCH6344 | Power MOSFET ( Transistor ) | ON Semiconductor |
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