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PDF STGIPS30C60 Data sheet ( Hoja de datos )
| Número de pieza | STGIPS30C60 | |
| Descripción | 600V short-circuit rugged IGBT | |
| Fabricantes | STMicroelectronics | |
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STGIPS30C60
SLLIMM™ small low-loss intelligent molded module
IPM, 3-phase inverter - 30 A, 600 V short-circuit rugged IGBT
Datasheet - production data
Applications
• 3-phase inverters for motor drives
• Air conditioners
Description
SDIP-25L
Features
• IPM 30 A, 600 V 3-phase IGBT inverter bridge
including control ICs for gate driving and free-
wheeling diodes
• Short-circuit rugged IGBTs
• 3.3 V, 5 V, 15 V CMOS/TTL inputs
comparators with hysteresis and pull down /
pull up resistors
• Undervoltage lockout
• Internal bootstrap diode
• Interlocking function
• Smart shutdown function
• Comparator for fault protection against over
temperature and overcurrent
• DBC leading to low thermal resistance
• Isolation rating of 2500 Vrms/min
• UL recognized: UL1557 file E81734
This intelligent power module provides a
compact, high performance AC motor drive in a
simple, rugged design. Combining ST proprietary
control ICs with the most advanced short-circuit-
rugged IGBT system technology, this device is
ideal for 3-phase inverters in applications such as
motor drives and air conditioners. SLLIMM™ is a
trademark of STMicroelectronics.
Order code
STGIPS30C60
Table 1. Device summary
Marking
Package
GIPS30C60
SDIP-25L
Packaging
Tube
July 2013
This is information on a product in full production.
DocID022471 Rev 6
1/21
www.st.com
21
1 page  
STGIPS30C60
2 Electrical ratings
Electrical ratings
2.1
Absolute maximum ratings
Symbol
Table 3. Inverter part
Parameter
VPN Supply voltage applied between P - NU, NV, NW
VPN(surge)
Supply voltage (surge) applied between P - NU,
NV, NW
(1)
VCES Each IGBT collector emitter voltage (VIN = 0)
± IC
(2)
± ICP
Each IGBT continuous collector current
at TC = 25°C
Each IGBT pulsed collector current
PTOT Each IGBT total dissipation at TC = 25°C
Short circuit withstand time, VCE = 0.5 V(BR)CES
tscw TJ = 125 °C, VCC = Vboot= 15 V, VIN (1)= 0 - 5 V
1. Applied between HINi, LINi and GND for i = U, V, W
2. Pulse width limited by max junction temperature
Value
450
500
600
30
60
52
5
Unit
V
V
V
A
A
W
μs
Symbol
Table 4. Control part
Parameter
Value
VOUT
VCC
VCIN
Vboot
VIN
Output voltage applied between
OUTU, OUTV, OUTW - GND
Low voltage power supply
Comparator input voltage
Bootstrap voltage applied between
Vboot i - OUTi for i = U, V, W
Logic input voltage applied between HIN, LIN and
GND
VSD/OD Open drain voltage
dVOUT/dt Allowed output slew rate
Vboot - 21 to Vboot + 0.3
-0.3 to +21
-0.3 to VCC +0.3
-0.3 to 620
-0.3 to 15
-0.3 to 15
50
Unit
V
V
V
V
V
V
V/ns
Symbol
Table 5. Total system
Parameter
VISO
Tj
TC
Isolation withstand voltage applied between each
pin and heatsink plate (AC voltage, t = 60 sec.)
Power chips operating junction temperature
Module case operation temperature
Value
2500
-40 to 150
-40 to 125
Unit
V
°C
°C
DocID022471 Rev 6
5/21
5 Page 
STGIPS30C60
3.2 Waveforms definitions
Electrical characteristics
Figure 7. Dead time and interlocking waveforms definitions
LIN
CONTROL SIGNAL EDGES
OVERLAPPED:
INTERLOCKING + DEAD TIME
HIN
LVG
HVG
gate driver outputs OFF
(HALF-BRIDGE TRI-STATE)
DTLH
gate driver outputs OFF
(HALF-BRIDGE TRI-STATE)
DTHL
CONTROL SIGNALS EDGES
SYNCHRONOUS (*):
DEAD TIME
LIN
HIN
LVG
HVG
gate driver outputs OFF
(HALF-BRIDGE TRI-STATE)
DTLH
DTHL
gate driver outputs OFF
(HALF-BRIDGE TRI-STATE)
LIN
CONTROL SIGNALS EDGES
NOT OVERLAPPED,
BUT INSIDE THE DEAD TIME:
DEAD TIME
HIN
LVG
HVG
DTLH
gate driver outputs OFF
(HALF-BRIDGE TRI-STATE)
DTHL
gate driver outputs OFF
(HALF-BRIDGE TRI-STATE)
CONTROL SIGNALS EDGES
NOT OVERLAPPED,
OUTSIDE THE DEAD TIME:
DIRECT DRIVING
LIN
HIN
LVG
HVG
DTLH
gate driver outputs OFF
(HALF-BRIDGE TRI-STATE)
DTHL
gate driver outputs OFF
(HALF-BRIDGE TRI-STATE)
DocID022471 Rev 6
11/21
11 Page | ||
| Páginas | Total 21 Páginas | |
| PDF Descargar | [ Datasheet STGIPS30C60.PDF ] | |
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