MS7907 PDF даташит
Спецификация MS7907 изготовлена «Intersema» и имеет функцию, называемую «PRESSURE SENSOR DIE». |
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Детали детали
Номер произв | MS7907 |
Описание | PRESSURE SENSOR DIE |
Производители | Intersema |
логотип |
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MS7907
PRESSURE SENSOR DIE (0-7 BAR)
• 0 to 700 kPa range (7 bar or 102 PSI)
• Absolute/differential pressure sensors
• High linearity, small size
• RoHS-compatible & Pb-free1
DESCRIPTION
The sensor element of the MS7907 consists of a silicon micro-machined membrane. Implanted resistors make
use of the piezo-resistive effect to sense the membrane deflection and transform it in an electrical signal. This
sensor, which has outstanding linearity and span values, is available in various configurations. The absolute
pressure sensor employs a sealed vacuum reference cavity underneath the membrane. The Pyrex glass wafer
used for this sealing has a thickness of 0.2 mm (MS7907-A_0.2) or 0.5 mm (MS7907-A_0.5). There are two
gauge versions available: one with a drilled Pyrex glass (MS7907-D) and the other without Pyrex glass
(MS7907-S).
FEATURES
• Uncompensated pressure sensor die
• Output Span 150mV @ 5V
• Temperature Range -40°…+125°C
• Linearity 0.05% (typical)
• Small Die Size 1.72 x 1.58mm (MS7907-A)
• Low Cost, High reliability
APPLICATION
• For absolute or differential pressure sensor systems
• Engine controls
• Dive computers
ELECTRICAL CONNECTIONS
Positive output for pressure applied topside
Vs+ EPI
Out+
Out-
Vs+ : Supply voltage of Wheatstone bridge
Epi : Connection of epitaxial layer (membrane)
Out- : Negative output
Out+ : Positive output
GND1 : Ground
GND2 : Ground
GND1 GND2
1 The European RoHS directive 2002/95/EC (Restriction of the use of certain Hazardous Substances in electrical and electronic equipment)
bans the use of lead, mercury, cadmium, hexavalent chromium and polybrominated biphenyls (PBB) or polybrominated diphenyl ethers
(PBDE).
DA7907_002.doc
000079071388
ECN 1186
March 16, 2009
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BOND PAD CONFIGURATION
Vs+ Epi Out-
Out+ GND1 GND2
LAYOUT (Absolute sensors)
MS7907-A_0.2
Important remarks:
As the sensing elements are diffused resistances, the voltage
applied on the ground pads (GND1 and GND2) has to be lower
than the voltage applied on supply voltage pad (Vs+).
The epitaxial layer is connected to the Vs+ pin on the die.
Gold ball bonding or aluminium wedge bonding can be used to
wire-bond the sensor. The quality of the wire-bonding is equipment
and process dependant. For this reason, it is strongly
recommended that a thorough wire-bonding qualification is made
by the end user if the sensor is going to be operated over an
extended temperature range.
MS7907-A_0.5
DA7907_002.doc
000079071388
ECN 1186
Pad opening in passivation is 100 µm
March 16, 2009
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LAYOUT (Gauge sensors)
MS7907-D
MS7907-S
FULL SCALE PRESSURE
Pad opening in passivation is 100 µm
kPa bar mbar PSI
700
7
7000
102
atm mm Hg
6.9 5250
ABSOLUTE MAXIMUM RATINGS
Parameter
Supply voltage
Storage temperature
Pressure overload
Symbol
VS+
TS
Conditions
Ta = 25 oC
m H2O
71
Inches H2O
2810
Min Max Unit
20 V
-40 +150 oC
21 Bar
DA7907_002.doc
000079071388
ECN 1186
March 16, 2009
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