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PDF LR770D Data sheet ( Hoja de datos )
| Número de pieza | LR770D | |
| Descripción | Lamp LEDs | |
| Fabricantes | Seoul Semiconductor | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de LR770D (archivo pdf) en la parte inferior de esta página. Total 12 Páginas | ||
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Specification
LR770D
SSC
Drawn
Approval
Customer
Approval
Rev. 03
December 2010
www.seoulsemicon.com
서식번호 : SSC-QP-7-07-24 (Rev.00)
1 page  
4. Reliability Tests
Item
Condition
Note Failures
Life Test
High Temperature Operating
Low Temperature Operating
Thermal Shock
Resistance to soldering Heat
ESD
(Human Body Model)
High Temperature Storage
Low Temperature Storage
Temperature Humidity
Storage
Temperature Humidity
Operating
Ta = RT, IF = 30mA
Ta =100ºC, IF = 10mA
Ta = -40ºC, IF = 20mA
Ta = -50ºC (30min) ~ 105º (30min)
(Transfer time : 10sec, 1Cycle = 1hr)
Ts = 255 ± 5ºC, t = 10sec
1kV, 1.5kΩ ; 100pF
Ta = 105ºC
Ta = -50ºC
Ta = 85ºC, RH = 85%
Ta = 85ºC, RH = 85%, IF = 15mA
1000hrs
1000hrs
1000hrs
100
cycles
1 time
1 time
1000hrs
1000hrs
1000hrs
100hrs
0/22
0/22
0/22
0/40
0/22
0/22
0/22
0/22
0/22
0/22
< Judging Criteria For Reliability Tests >
VF
IR
Ф
V
Notes :
[1] USL : Upper Standard Level
[2] LSL : Lower Standard Level.
USL[1] X 1.2
USL X 2.0
LSL [2] X 0.7
Rev. 03
December 2010
www.seoulsemicon.com
서식번호 : SSC-QP-7-07-24 (Rev.00)
5 Page 
11. Precaution for Use
1) Storage
• Before opening the package
Avoid the absorption of moisture, we recommended to store Lamp LEDs in a dry
box(or desiccators) with a desiccant . Otherwise, store them in the following environment:
Temperature : 5℃~30℃ Humidity : 50% max.
• After opening the package
a. Soldering should be done right after opening the package(within 24Hrs).
b. Keeping of a fraction
- Sealing
- Temperature : 5 ~ 40℃, Humidity : less than 30%
c. If the package has been opened more than 1week or the color of desiccant changes,
Components should be dried for 10-12hr at 60±5℃
• Any mechanical force or any excess vibration shall not be accepted to apply during cooling
process to normal temp. after soldering.
• Avoid quick cooling
• Leadframes are silver plated SPCC. The silver plate surface may be affected by
environments which contains corrosive substances. Please avoid conditions which may cause
the LEDs to corrode, tarnish or discolor.
2) Lead Forming
• When the lead forming is required before soldering , care must be taken to avoid any bending
and mechanical stress. The stress to the base may damage the LEDs.
• When mounting the LEDs onto a PCB, the holes on the circuit board should be exactly
aligned with the leads of the LEDs.
• It is recommended that tooling made to precisely form and cut the leads to length rather than
rely on hand operating.
Rev. 03
December 2010
www.seoulsemicon.com
서식번호 : SSC-QP-7-07-24 (Rev.00)
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet LR770D.PDF ] | |
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