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PDF HPND-4028 Data sheet ( Hoja de datos )
| Número de pieza | HPND-4028 | |
| Descripción | Beam Lead PIN Diodes | |
| Fabricantes | AVAGO | |
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HPND-4028, HPND-4038
Beam Lead PIN Diodes for Phased Arrays and Switches
Data Sheet
Description
The HPND-4028 and 4038 beam lead PIN diodes are
designed for low capacitance, low resistance, and fast
switching at microwave frequencies. These character-
istics are achieved at low bias levels for minimal power
consumption. Advanced processing techniques ensure
uniform and consistent electrical performance, allowing
guaranteed capacitance windows. This translates to
improved performance in phased array applications.
Rugged construction and strong beams ensure high
assembly yields while nitride passivation and polyimide
coating ensure reliability.
Features
• Low Capacitance
0.025 pF Maximum at 1 MHz Guaranteed Min./Max.
• Fast Switching
2.0 nsec
• Low Resistance at Low Bias
1.5 Ω at IF = 10 mA (Typical)
• Rugged Construction
Typical 10 Gram Lead Pull
• Silicon Nitride Passivation
Applications
These beam lead PIN diodes are designed for use in
stripline, coplanar waveguide, or microstrip circuits. Ap-
plications include phase shifting and switching. The
guaranteed capacitance windows ensure uniform per
formance in phased array radar. The low capacitance
makes them ideal for circuits requiring high isolation in
the series configuration. These devices have been fully
characterized and S-parameters have been provided.
Outline 83
220 (9)
180 (7)
690 (27)
650 (26)
330 (13)
260 (10)
180 (7)
160 (6)
Maximum Ratings
Operating Temperature
Storage Temperature
P ow(DererDaitsesilpinaetiaornlyattoTCzAeSrEo=at2155°0C°C.)
Minimum Lead Strength
-65°C to +150°C
-65°C to +200°C
250 mW
4 grams pull on either lead
per MIL-S-19500, LTPD = 20
110 (4.5)
90 (3.5)
280 (11)
240 (9)
8 (0.3) Min.
60 (2.4)
40 (1.6)
DIMENSIONS IN µM (1/1000 INCH)
1 page  
Bonding and Handling Procedures for Beam Lead Diodes
1. Storage
Under normal circumstances, storage of beam lead
diodes in Avago supplied waffle/gel packs is sufficient.
In particularly dusty or chemically hazardous environ-
ments, storage in an inert atmosphere desiccator is
advised.
2. Handling
In order to avoid damage to beam lead devices, par-
ticular care must be exercised during inspection,
testing, and assembly. Although the beam lead diode
is designed to have exceptional lead strength, its small
size and delicate nature requires that special handling
techniques be observed so that the devices will not be
mechanically or electrically damaged. A vacuum pickup
is recommended for picking up beam lead devices, par-
ticularly larger ones, e.g., quads. Care must be exercised
to assure that the vacuum opening of the needle is suf-
ficiently small to avoid passage of the device through
the opening. A #27 tip is recommended for picking up
single beam lead devices. A 20X magnification is needed
for precise positioning of the tip on the device. Where a
vacuum pickup is not used, a sharpened wooden Q-tip
dipped in isopropyl alcohol is very commonly used to
handle beam lead devices.
3. Cleaning
For organic contamination use a warm rinse of trichlo-
roethane, or its locally approved equivalent, followed by
a cold rinse in acetone and methanol. Dry under infrared
heat lamp for 5–10 minutes on clean filter paper. Freon
degreaser, or its locally approved equivalent, may
replace trichloroethane for light organic contamination.
• Ultrasonic cleaning is not recommended.
• Acid solvents should not be used.
4. Bonding
Thermocompression: See Application Note 979 “The
Handling and Bonding of Beam Lead Devices Made
Easy”. This method is good for hard substrates only.
Wobble: This method picks up the device, places it on
the substrate and forms a thermo-compression bond all
in one operation. This is described in the latest version
of MIL-STD-883, Method 2017, and is intended for hard
substrates only.
Resistance Welding or Parallel-GAP Welding: To make
welding on soft substrates easier, a low pressure welding
head is recommended. Suitable equipment is available
from HUGHES, Industrial Products Division in Carlsbad,
CA.
Epoxy: With solvent free, low resistivity epoxies
(available from ABLESTIK and improvements in dispens-
ing equipment, the quality of epoxy bonds is sufficient
for many applications.
5. Lead Stress
In the process of bonding a beam lead diode, a certain
amount of “bugging” occurs. The term bugging refers
to the chip lifting away from the substrate during the
bonding process due to the deformation of the beam by
the bonding tool. This effect is beneficial as it provides
stress relief for the diode during thermal cycling of the
substrate. The coefficient of expansion of some substrate
materials, specifically soft substrates, is such that some
bugging is essential if the circuit is to be operated over
wide temperature extremes.
Thick metal clad ground planes restrict the thermal
expansion of the dielectric substrates in the X-Y axis.
The expansion of the dielectric will then be mainly
in the Z axis, which does not affect the beam lead
device. An alternate solution to the problem of dielec-
tric ground plane expansion is to heat the substrate to
the maximum required operating temperature during
the beam lead attachment. Thus, the substrate is at
maximum expansion when the device is bonded. Sub-
sequent cooling of the substrate will cause bugging,
similar to bugging in thermocompression bonding or
epoxy bonding. Other methods of bugging are pre-
forming the leads during assembly or prestressing the
substrate.
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| PDF Descargar | [ Datasheet HPND-4028.PDF ] | |
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