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PDF AMMP-6546 Data sheet ( Hoja de datos )
| Número de pieza | AMMP-6546 | |
| Descripción | 18 to 40 GHz GaAs MMIC Sub-Harmonic Mixer | |
| Fabricantes | AVAGO | |
| Logotipo |  |
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AMMP-6546
18 to 40 GHz GaAs MMIC Sub-Harmonic Mixer
In SMT Package
Data Sheet
Description/Applications
Avago’s AMMP-6546 is an easy-to-use broadband sub-
harmonic mixer, with the LO injected at half of the
frequency of that required by a conventional mixer.
AMMP-6546 is similar to AMMP-6545 except that the
layout is a mirror image designed to ease integration into
transmitter or receiver designs. The MMIC includes an 180°
balanced diode based mixer. The MMIC is fabricated using
PHEMT technology. The surface mount package allows
elimination of “chip & wire” assembly for lower cost. This
MMIC is a cost effective alternative to multi-chip solution
that have higher loss and complex assembly.
Package Marking & Orientation
NC NC
12
LO 8
x2
76
NC NC
TOP VIEW
PACKAGE BASE: GND
NC
3
4 RF
PIN FUNCTION
1 NC
2 NC
3 NC
4 RF
5 IF
6 NC
7 NC
8 LO
5
IF
Attention: Observe precautions for
handling electrostatic sensitive devices.
ESD Machine Model = 30 V
ESD Human Body Model = 150 V
Refer to Avago Application Note A004R:
Electrostatic Discharge, Damage and Control.
Features
x RF Frequency : 18-40 GHz
x LO Frequency : 9-20 GHz
x IF Frequency : DC-3.5 GHz
x 5x5 mm Surface Mount Package
x Suitable for Up and Down Conversion
x Diode Mixer
x Typical Performance at RF= 21GHz
Conversion Loss : 11 dB
IIP3 : +12 dBm
2LO-R Leakage : -44 dBm
2LO-I Leakage : -61 dBm
x Typical Performance at RF= 23GHz
Conversion Loss : 10 dB
IIP3 : +11.7 dBm
2LO-R Leakage : -40 dBm
2LO-I Leakage : -64 dBm
x Typical Performance at RF= 26GHz
Conversion Loss : 11 dB
IIP3 : +11.8 dBm
2LO-R Leakage : -42 dBm
2LO-I Leakage : -60 dBm
Applications
x Microwave radio systems
x Satellite VSAT, DBS up/down link
x LMDS & Pt-Pt mmW long haul
x Broadband wireless access (including 802.16 and
802.20 WiMax)
x WLL and MMDS loops
1 page  
Recommended SMT Attachment for 5x5 Package
The AMMP Packaged Devices are compatible with high
volume surface mount PCB assembly processes.
The PCB material and mounting pattern, as defined in
the data sheet, optimizes RF performance and is strongly
recommended. An electronic drawing of the landpattern
is available upon request from Avago Sales & Application
Engineering.
0.0100 [0.25]
0.0180 [0.46]
0.0110 [0.28]
0.114 [2.89]
0.0160 [0.41]
0.0095 [0.24]
0.1260 0.0590 0.0200
[3.2] [1.5] [0.51]
0.0160 [0.41]
0.0120 [0.3]
Figure 13a. PCB land pattern
0.0180 [0.46]
0.0935 [2.37]
1.04 0.72
2.49
0.56
0.38
0.0095 [0.24]
0.36
0.3
0.1 0.39
Figure 13b. PCB stencil layouts
Figure 13c. PCB land pattern with stencil layouts
5
5 Page | ||
| Páginas | Total 7 Páginas | |
| PDF Descargar | [ Datasheet AMMP-6546.PDF ] | |
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