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Número de pieza | BSS138PS | |
Descripción | MOSFET ( Transistor ) | |
Fabricantes | NXP Semiconductors | |
Logotipo | ||
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No Preview Available ! BSS138PS
60 V, 320 mA dual N-channel Trench MOSFET
Rev. 1 — 2 November 2010
Product data sheet
1. Product profile
1.1 General description
Dual N-channel enhancement mode Field-Effect Transistor (FET) in a very small
SOT363 (SC-88) Surface-Mounted Device (SMD) plastic package using Trench MOSFET
technology.
1.2 Features and benefits
Logic-level compatible
Very fast switching
Trench MOSFET technology
AEC-Q101 qualified
1.3 Applications
Relay driver
High-speed line driver
Low-side loadswitch
Switching circuits
1.4 Quick reference data
Table 1. Quick reference data
Symbol Parameter
Per transistor
VDS drain-source voltage
VGS gate-source voltage
ID drain current
RDSon
drain-source on-state
resistance
Conditions
Tamb = 25 °C
Tamb = 25 °C
Tamb = 25 °C;
VGS = 10 V
Tj = 25 °C;
VGS = 10 V;
ID = 300 mA
Min Typ Max Unit
- - 60 V
- - ±20 V
[1] - - 320 mA
[2] -
0.9 1.6 Ω
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated, mounting pad
for drain 1 cm2.
[2] Pulse test: tp ≤ 300 μs; δ ≤ 0.01.
1 page NXP Semiconductors
BSS138PS
60 V, 320 mA dual N-channel Trench MOSFET
103
Zth(j-a)
(K/W)
102
duty cycle = 1
0.5
0.25
0.75
0.33
0.2
0.1 0.05
0 0.02
10 0.01
017aaa034
1
10−3
10−2
10−1
1
10 102 103
tp (s)
Fig 4.
FR4 PCB, standard footprint
Per transistor: Transient thermal impedance from junction to ambient as a function of pulse duration;
typical values
103
Zth(j-a)
(K/W)
102
duty cycle = 1
0.5
0.25
0.75
0.33
0.2
0.1 0.05
017aaa035
10
0
0.02
0.01
1
10−3
10−2
10−1
1
10 102 103
tp (s)
Fig 5.
FR4 PCB, mounting pad for drain 1 cm2
Per transistor: Transient thermal impedance from junction to ambient as a function of pulse duration;
typical values
BSS138PS
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 2 November 2010
© NXP B.V. 2010. All rights reserved.
5 of 16
5 Page NXP Semiconductors
9. Package outline
Plastic surface-mounted package; 6 leads
BSS138PS
60 V, 320 mA dual N-channel Trench MOSFET
SOT363
DB
E AX
y
6
54
pin 1
index
12
e1 bp
e
3
wM B
HE v M A
A
A1
Q
Lp
detail X
c
01
scale
2 mm
DIMENSIONS (mm are the original dimensions)
UNIT A
A1
max
bp
c
D
E
e
e1 HE Lp Q
v
w
y
mm
1.1
0.8
0.1
0.30 0.25
0.20 0.10
2.2
1.8
1.35
1.15
1.3
0.65
2.2
2.0
0.45 0.25
0.15 0.15
0.2
0.2
0.1
OUTLINE
VERSION
SOT363
IEC
REFERENCES
JEDEC
JEITA
SC-88
Fig 18. Package outline SOT363 (SC-88)
BSS138PS
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 2 November 2010
EUROPEAN
PROJECTION
ISSUE DATE
04-11-08
06-03-16
© NXP B.V. 2010. All rights reserved.
11 of 16
11 Page |
Páginas | Total 16 Páginas | |
PDF Descargar | [ Datasheet BSS138PS.PDF ] |
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