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Datasheet 2211-100D Equivalent ( PDF ) |
| N.º | Número de pieza | Descripción | Fabricantes | Category |
| 1 | 2211-100D | FIXEDDIPDELAYLINE 2211
FIXED DIP DELAY LINE TD/TR = 10 (SERIES 2211)
FEATURES
• • • • High bandwidth (TD/TR =10) Low profile Epoxy encapsulated Meets or exceeds MIL-D-23859C
N/C IN N/C N/C N/C N/C N/C N/C N/C N/C N/C GND 1 2 3 4 5 6 7 8 9 10 11 12 24 23 22 21 20 19 18 17 16 15 14 13 N/C OUT N/C N/C N/C N/C N |  ETC | data |
221 Datasheet ( Hoja de datos ) - resultados coincidentes |
| N.º | Número de pieza | Descripción | Fabricantes | Catagory |
| 1 | 2211 | FIXEDDIPDELAYLINE 2211
FIXED DIP DELAY LINE TD/TR = 10 (SERIES 2211)
FEATURES
• • • • High bandwidth (TD/TR =10) Low profile Epoxy encapsulated Meets or exceeds MIL-D-23859C
N/C IN N/C N/C N/C N/C N/C N/C N/C N/C N/C GND 1 2 3 4 5 6 7 8 9 10 11 12 24 23 22 21 20 19 18 17 16 15 14 13 N/C OUT N/C N/C N/C N/C N ETC data | | |
| 2 | 2211-05-301 | Reed Relays BACK
NEXT
MICROMINIATURE REED RELAY
Specifications:
COTO Reed Relays
DIMENSIONS: in. (mm) A
.210 (5.33) .810 (20.57) .125 (3.18)
B
.280 (7.11)
.250 (6.35) .820 (20.82) .125 (3.18)
• • • •
Storage Temp: -35°C to +100°C Operating Temp: -20° to +85°C Solder Temp:  COTO relay | | |
| 3 | 2211-05-301 | Reed Relays Reed Relays
Fig. 1
SPECIFICATIONS: • Life Expectancy: Varies with each series from a minimum of 100 x 106 operations to 1000 x 106 operations • Insulation Resistance: 1012Ω • Storage Temperature: -35°C ~ 100°C • Operating Temperature: -20°C ~ 85°C • Vibration: 20 ETC relay | | |
| 4 | 2211-1000D | FIXEDDIPDELAYLINE 2211
FIXED DIP DELAY LINE TD/TR = 10 (SERIES 2211)
FEATURES
• • • • High bandwidth (TD/TR =10) Low profile Epoxy encapsulated Meets or exceeds MIL-D-23859C
N/C IN N/C N/C N/C N/C N/C N/C N/C N/C N/C GND 1 2 3 4 5 6 7 8 9 10 11 12 24 23 22 21 20 19 18 17 16 15 14 13 N/C OUT N/C N/C N/C N/C N ETC data | | |
| 5 | 2211-1000G | FIXEDDIPDELAYLINE 2211
FIXED DIP DELAY LINE TD/TR = 10 (SERIES 2211)
FEATURES
• • • • High bandwidth (TD/TR =10) Low profile Epoxy encapsulated Meets or exceeds MIL-D-23859C
N/C IN N/C N/C N/C N/C N/C N/C N/C N/C N/C GND 1 2 3 4 5 6 7 8 9 10 11 12 24 23 22 21 20 19 18 17 16 15 14 13 N/C OUT N/C N/C N/C N/C N ETC data | | |
| 6 | 2211-100A | FIXEDDIPDELAYLINE 2211
FIXED DIP DELAY LINE TD/TR = 10 (SERIES 2211)
FEATURES
• • • • High bandwidth (TD/TR =10) Low profile Epoxy encapsulated Meets or exceeds MIL-D-23859C
N/C IN N/C N/C N/C N/C N/C N/C N/C N/C N/C GND 1 2 3 4 5 6 7 8 9 10 11 12 24 23 22 21 20 19 18 17 16 15 14 13 N/C OUT N/C N/C N/C N/C N ETC data | | |
| 7 | 2211-100B | FIXEDDIPDELAYLINE 2211
FIXED DIP DELAY LINE TD/TR = 10 (SERIES 2211)
FEATURES
• • • • High bandwidth (TD/TR =10) Low profile Epoxy encapsulated Meets or exceeds MIL-D-23859C
N/C IN N/C N/C N/C N/C N/C N/C N/C N/C N/C GND 1 2 3 4 5 6 7 8 9 10 11 12 24 23 22 21 20 19 18 17 16 15 14 13 N/C OUT N/C N/C N/C N/C N ETC data | |
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