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PDF ERM2002-1 Data sheet ( Hoja de datos )
| Número de pieza | ERM2002-1 | |
| Descripción | Character Module User Manual | |
| Fabricantes | EastRising | |
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Hay una vista previa y un enlace de descarga de ERM2002-1 (archivo pdf) en la parte inferior de esta página. Total 20 Páginas | ||
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EastRisingw w w . l c d - c h i n a . c o mEA Character Module User Manual ERM2002-1 Series
ERM2002-1 Series
Character Module User Manual
EastRising Technology Co., Limited
Attention:
A. Click” CONTENTS” list could be directed to the detail page. Click “Return to CONTENTS” could be directed to CONTENTS Page.
B. Some specifications of IC are not listed in this manual. Please refer to the IC manual for more details.
C. The drawing for related touch panel, schematic drawing, demo code is all available, please contact with our sales if you need.
D. Please pay more attention to “INSPECTION CRITERIA” in this manual. We assume you already agree with these criterions when you place an
order with us. No more recommendations.
REV DESCRIPTION
1.0 Preliminary Release
RELEASE DATE
July-17-2012
URL: www.lcd-china.com
Document Name: ERM2002-1 Series Manual-Rev1.0
Page: 1 of 20
Free Datasheet http://www.datasheet4u.com/
1 page  
EastRisingw w w . l c d - c h i n a . c o mEA Character Module User Manual ERM2002-1 Series
1.2 ERM2002-1 Series Image
>>Return to CONTENTS
*The number of series image is in accordance with number of the above series table 1.1.
12 34
56 78
9 10 11 12
13 14
15
URL: www.lcd-china.com
Document Name: ERM2002-1 Series Manual-Rev1.0
Page: 5 of 20
Free Datasheet http://www.datasheet4u.com/
5 Page 
EastRisingw w w . l c d - c h i n a . c o mEA Character Module User Manual ERM2002-1 Series
5.4 Module Cosmetic Criteria
>>Return to CONTENTS
NO. Item
Judgment Criterion
1 Difference in Spec.
None allowed
2 Pattern Peeling
No substrate pattern peeling and floating
3 Soldering defects
No soldering missing
No soldering bridge
No cold soldering
4 Resist flaw on substrate Invisible copper foil(￠0.5mm or more)on substrate pattern
5 Accretion of metallic
Foreign matter
No soldering dust
No accretion of metallic foreign matters(Not exceed￠0.2mm)
6 Stain
No stain to spoil cosmetic badly
7 Plate discoloring
No plate fading,rusting and discoloring
8 Solder amount
a. Soldering side of PCB
Partition
Major
Major
Major
Major
Minor
Minor
Minor
Minor
Minor
Minor
1.Lead parts
Solder to form a’Filet’
all around the lead.
Solder should not hide the
lead form perfectly.(too much)
b.Components side
(In case of ‘Through Hole PCB’)
Solder to reach the Components side of PCB
2.Flat packages
Either ‘toe’(A) or ‘heal’ (B) of
the lead to be covered by ‘Filet’.
Lead form to be assume over
Solder.
A
B
Minor
3.Chips
(3/2) H≧h≧(1/2)H
hH
Minor
URL: www.lcd-china.com
Document Name: ERM2002-1 Series Manual-Rev1.0
Page: 11 of 20
Free Datasheet http://www.datasheet4u.com/
11 Page | ||
| Páginas | Total 20 Páginas | |
| PDF Descargar | [ Datasheet ERM2002-1.PDF ] | |
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