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KMK2U000VM-B604 PDF даташит

Спецификация KMK2U000VM-B604 изготовлена ​​​​«Samsung» и имеет функцию, называемую «32GB eMMC + 8Gb DDP LPDDR2-S4 SDRAM».

Детали детали

Номер произв KMK2U000VM-B604
Описание 32GB eMMC + 8Gb DDP LPDDR2-S4 SDRAM
Производители Samsung
логотип Samsung логотип 

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KMK2U000VM-B604 Даташит, Описание, Даташиты
Rev. 1.0, Jan. 2012
KMK2U000VM-B604
MCP Specification
32GB e·MMC
+ 8Gb DDP LPDDR2-S4 SDRAM
datasheet
SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND
SPECIFICATIONS WITHOUT NOTICE.
Products and specifications discussed herein are for reference purposes only. All information discussed
herein is provided on an "AS IS" basis, without warranties of any kind.
This document and all information discussed herein remain the sole and exclusive property of Samsung
Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property
right is granted by one party to the other party under this document, by implication, estoppel or other-
wise.
Samsung products are not intended for use in life support, critical care, medical, safety equipment, or
similar applications where product failure could result in loss of life or personal or physical harm, or any
military or defense application, or any governmental procurement to which special terms or provisions
may apply.
For updates or additional information about Samsung products, contact your nearest Samsung office.
All brand names, trademarks and registered trademarks belong to their respective owners.
2012 Samsung Electronics Co., Ltd. All rights reserved.
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KMK2U000VM-B604 Даташит, Описание, Даташиты
KMK2U000VM-B604
datasheet
Revision History
Revision No.
0.0
1.0
History
Initial issue.
- 32GB e·MMC A-die_ Ver 1.2
- 8Gb DDP LPDDR2-S4 SDRAM B-die_Ver 0.5
- Final datasheet.
Draft Date
Dec. 20, 2011
Jan. 12, 2012
Rev. 1.0
MCP Memory
Remark
Preliminary
Editor
K.N.Kang
Final
K.N.Kang
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KMK2U000VM-B604 Даташит, Описание, Даташиты
KMK2U000VM-B604
datasheet
Rev. 1.0
MCP Memory
1. FEATURES
<Common>
Operating Temperature : -25C ~ 85C
Package :186-ball FBGA Type - 12 x 16 x 1.4mmt, 0.5mm pitch
<e·MMC>
 MultiMediaCard System Specification Ver. 4.41 compatible. Detail
description is referenced by JEDEC Standard
SAMSUNG e·MMC supports below special features which are being dis-
cussed in JEDEC
- High Priority Interrupt scheme is supported
- Back ground operation is supported.
Full backward compatibility with previous MultiMediaCard system ( 1bit
data bus, multi-e·MMC systems)
Data bus width : 1bit (Default) , 4bit and 8bit
MMC I/F Clock Frequency : 0 ~ 52MHz
MMC I/F Boot Frequency : 0 ~ 52MHz
Power : Interface power VDD = VCCQm(1.70V ~ 1.95V or 2.7V ~
3.6V) , Memory power VDDF = VCCm(2.7V ~ 3.6V)
<LPDDR2>
• Double-data rate architecture; two data transfers per clock cycle
• Bidirectional data strobes (DQS, DQS), These are transmitted/
received with data to be used in capturing data at the receiver
• Differential clock inputs (CK and CK)
• Differential data strobes (DQS and DQS)
• Commands & addresses entered on both positive and negative CK
edges; data and data mask referenced to both edges of DQS
• 8 internal banks for concurrent operation
• Data mask (DM) for write data
• Burst Length: 4 (default), 8 or 16
• Burst Type: Sequential or Interleave
• Read & Write latency : Refer to Table 47 LPDDR2 AC Timing Table
• Auto Precharge option for each burst access
• Configurable Drive Strength
• Auto Refresh and Self Refresh Modes
• Partial Array Self Refresh and Temperature Compensated Self
Refresh
• Deep Power Down Mode
• HSUL_12 compatible inputs
• VDD1/VDD2/VDDQ/VDDCA
: 1.8V/1.2V/1.2V/1.2V
• No DLL : CK to DQS is not synchronized
• Edge aligned data output, center aligned data input
• Auto refresh duty cycle : 3.9us
• 2/CS, 2CKE
•ORDERING INFORMATION
Org.
x32
Max Frequency
1066Mbps (tCK=1.875ns)
Interface
HSUL_12
• LPDDR2 SDRAM ADDRESSING
Items
Device Type
Number of Banks
Bank Addresses
tREFI(us)*2
x32 Row Addresses
Column Addresses*1
4Gb
S4
8
BA0-BA2
3.9
R0-R13
C0-C9
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