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K60P100M100SF2V2 PDF даташит
| Спецификация K60P100M100SF2V2 изготовлена «Freescale» и имеет функцию, называемую «K60 Sub-Family». |
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Детали детали
| Номер произв | K60P100M100SF2V2 |
| Описание | K60 Sub-Family |
| Производители | Freescale |
| логотип |  |
30 Pages
No Preview Available ! |
Freescale Semiconductor
Data Sheet: Technical Data
Document Number: K60P100M100SF2V2
Rev. 3, 6/2013
K60 Sub-Family
Supports the following:
MK60DN256VLL10,
MK60DX256VLL10, MK60DN512VLL10
Features
• Operating Characteristics
– Voltage range: 1.71 to 3.6 V
– Flash write voltage range: 1.71 to 3.6 V
– Temperature range (ambient): -40 to 105°C
• Performance
– Up to 100 MHz ARM Cortex-M4 core with DSP
instructions delivering 1.25 Dhrystone MIPS per
MHz
• Memories and memory interfaces
– Up to 512 KB program flash memory on non-
FlexMemory devices
– Up to 256 KB program flash memory on
FlexMemory devices
– Up to 256 KB FlexNVM on FlexMemory devices
– 4 KB FlexRAM on FlexMemory devices
– Up to 128 KB RAM
– Serial programming interface (EzPort)
– FlexBus external bus interface
• Clocks
– 3 to 32 MHz crystal oscillator
– 32 kHz crystal oscillator
– Multi-purpose clock generator
• System peripherals
– Multiple low-power modes to provide power
optimization based on application requirements
– Memory protection unit with multi-master
protection
– 16-channel DMA controller, supporting up to 63
request sources
– External watchdog monitor
– Software watchdog
– Low-leakage wakeup unit
K60P100M100SF2V2
• Security and integrity modules
– Hardware CRC module to support fast cyclic
redundancy checks
– Hardware random-number generator
– Hardware encryption supporting DES, 3DES, AES,
MD5, SHA-1, and SHA-256 algorithms
– 128-bit unique identification (ID) number per chip
• Human-machine interface
– Low-power hardware touch sensor interface (TSI)
– General-purpose input/output
• Analog modules
– Two 16-bit SAR ADCs
– Programmable gain amplifier (PGA) (up to x64)
integrated into each ADC
– 12-bit DAC
– Two transimpedance amplifiers
– Three analog comparators (CMP) containing a 6-bit
DAC and programmable reference input
– Voltage reference
• Timers
– Programmable delay block
– Eight-channel motor control/general purpose/PWM
timer
– Two 2-channel quadrature decoder/general purpose
timers
– IEEE 1588 timers
– Periodic interrupt timers
– 16-bit low-power timer
– Carrier modulator transmitter
– Real-time clock
Freescale reserves the right to change the detail specifications as may be
required to permit improvements in the design of its products.
© 2012–2013 Freescale Semiconductor, Inc.
Free Datasheet http://www.datasheet4u.com/
No Preview Available ! |
• Communication interfaces
– Ethernet controller with MII and RMII interface to external PHY and hardware IEEE 1588 capability
– USB full-/low-speed On-the-Go controller with on-chip transceiver
– Two Controller Area Network (CAN) modules
– Three SPI modules
– Two I2C modules
– Five UART modules
– Secure Digital host controller (SDHC)
– I2S module
K60 Sub-Family Data Sheet, Rev. 3, 6/2013.
2 Freescale Semiconductor, Inc.
Free Datasheet http://www.datasheet4u.com/
No Preview Available ! |
Table of Contents
1 Ordering parts...........................................................................5
1.1 Determining valid orderable parts......................................5
2 Part identification......................................................................5
2.1 Description.........................................................................5
2.2 Format...............................................................................5
2.3 Fields.................................................................................5
2.4 Example............................................................................6
3 Terminology and guidelines......................................................6
3.1 Definition: Operating requirement......................................6
3.2 Definition: Operating behavior...........................................7
3.3 Definition: Attribute............................................................7
3.4 Definition: Rating...............................................................8
3.5 Result of exceeding a rating..............................................8
3.6 Relationship between ratings and operating
requirements......................................................................8
3.7 Guidelines for ratings and operating requirements............9
3.8 Definition: Typical value.....................................................9
3.9 Typical value conditions....................................................10
4 Ratings......................................................................................11
4.1 Thermal handling ratings...................................................11
4.2 Moisture handling ratings..................................................11
4.3 ESD handling ratings.........................................................11
4.4 Voltage and current operating ratings...............................11
5 General.....................................................................................12
5.1 AC electrical characteristics..............................................12
5.2 Nonswitching electrical specifications...............................12
5.2.1 Voltage and current operating requirements......13
5.2.2 LVD and POR operating requirements...............14
5.2.3 Voltage and current operating behaviors............14
5.2.4 Power mode transition operating behaviors.......16
5.2.5 Power consumption operating behaviors............17
5.2.6 EMC radiated emissions operating behaviors....20
5.2.7 Designing with radiated emissions in mind.........21
5.2.8 Capacitance attributes........................................21
5.3 Switching specifications.....................................................21
5.3.1 Device clock specifications.................................21
5.3.2 General switching specifications.........................22
5.4 Thermal specifications.......................................................23
5.4.1 Thermal operating requirements.........................23
5.4.2 Thermal attributes...............................................23
6 Peripheral operating requirements and behaviors....................24
6.1 Core modules....................................................................24
6.1.1 Debug trace timing specifications.......................24
6.1.2 JTAG electricals..................................................25
6.2 System modules................................................................28
6.3 Clock modules...................................................................28
6.3.1 MCG specifications.............................................28
6.3.2 Oscillator electrical specifications.......................30
6.3.3 32 kHz oscillator electrical characteristics..........33
6.4 Memories and memory interfaces.....................................33
6.4.1 Flash electrical specifications.............................33
6.4.2 EzPort switching specifications...........................38
6.4.3 Flexbus switching specifications.........................39
6.5 Security and integrity modules..........................................42
6.6 Analog...............................................................................42
6.6.1 ADC electrical specifications..............................42
6.6.2 CMP and 6-bit DAC electrical specifications......50
6.6.3 12-bit DAC electrical characteristics...................53
6.6.4 Voltage reference electrical specifications..........56
6.7 Timers................................................................................57
6.8 Communication interfaces.................................................57
6.8.1 Ethernet switching specifications........................57
6.8.2 USB electrical specifications...............................59
6.8.3 USB DCD electrical specifications......................59
6.8.4 USB VREG electrical specifications...................60
6.8.5 CAN switching specifications..............................60
6.8.6 DSPI switching specifications (limited voltage
range).................................................................61
6.8.7 DSPI switching specifications (full voltage
range).................................................................62
6.8.8 Inter-Integrated Circuit Interface (I2C) timing..... 64
6.8.9 UART switching specifications............................65
6.8.10 SDHC specifications...........................................65
6.8.11 I2S/SAI switching specifications.........................66
6.9 Human-machine interfaces (HMI)......................................72
6.9.1 TSI electrical specifications................................72
7 Dimensions...............................................................................73
7.1 Obtaining package dimensions.........................................73
Freescale Semiconductor, Inc.
K60 Sub-Family Data Sheet, Rev. 3, 6/2013.
3
Free Datasheet http://www.datasheet4u.com/
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| Номер в каталоге | Описание | Производители |
| K60P100M100SF2V2 | K60 Sub-Family | Freescale |
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