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PDF CPC9909 Data sheet ( Hoja de datos )
| Número de pieza | CPC9909 | |
| Descripción | High Brightness LED Driver | |
| Fabricantes | IXYS | |
| Logotipo |  |
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INTEGRATED CIRCUITS DIVISION
CPC9909
High Efficiency, Off-Line,
High Brightness LED Driver
Features
• 8VDC to 550VDC Input Voltage Range
• >90% Efficiency
• Stable Operation at >50% Duty Cycle
• Drives Multiple LEDs in Series/Parallel
• Regulated LED Current
• Linear or PWM Brightness Control Inputs
• Resistor-Programmable Minimum Off-Time
• SOIC-8 RoHS Compliant Package
• Buck or Boost Configuration
Applications
• Flat-Panel Display RGB Backlighting
• Signage and Decorative LED Lighting
• DC/DC or AC/DC LED Driver Applications
Pb e3
CPC9909 Block Diagram
VDD
VIN
RT
LD
PW MD
Voltage
Regulator
Voltage
Reference
-
+
-
+
Description
The CPC9909 is a low cost, high-efficiency, offline,
high-brightness (HB) LED driver manufactured using
IXYS Integrated Circuits Division’s high voltage
BCDMOS on SOI process. This driver has an internal
regulator that allows it to operate from 8VDC to
550VDC . This wide input operating voltage range
enables the driver to be used in a broad range of HB
LED applications.
The CPC9909 features pulse frequency modulation
(PFM) with a constant peak-current control scheme.
This regulation scheme is inherently stable, allowing
the driver to be operated above 50% duty cycle
without open loop instability or sub-harmonic
oscillations. LED dimming can be implemented by
applying a small DC voltage to the LD pin, or by
applying a low frequency PWM signal to the PWMD
pin.
The CPC9909 is available in a standard 8-lead SOIC
package and a thermally enhanced 8-lead SOIC
package with an exposed thermal pad (EP).
Ordering Information
Part
CPC9909N
CPC9909NTR
CPC9909NE
CPC9909NETR
Description
SOIC-8 (100/Tube)
SOIC-8 Tape & Reel (2000/Reel)
SOIC-8 EP (Exposed Pad) (100/Tube)
SOIC-8 EP (Exposed Pad)Tape & Reel
(2000/Reel)
RT Minimum Off-Time
Q One Shot TRIG
SQ
R
GATE
CS
DS-CPC9909-R03
www.ixysic.com
GND
1
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1 page  
INTEGRATED CIRCUITS DIVISION
CPC9909
1.4 Recommended Operating
Parameter
Input Voltage Range
PWMD Frequency
Operating Temperature
Symbol
VIN
fPWMD
TA
Minimum
12
-
-40
Conditions
Typical
-
500
-
Maximum
550
-
+85
Unit
VDC
Hz
°C
1.5 Electrical Characteristics
Unless otherwise specified, all electrical specifications are provided for TA=25C.
Parameter
Input
Input Voltage Range
Shut-Down Mode Supply Current
Regulator
Voltage Regulator Output
VDD Current Available
for External Circuitry
VDD Load Regulation
PWM Dimming
PWMD Input Low Voltage
PWMD Input High Voltage
PWMD Pull-Down Resistance
Current Sense Comparator
Current Sense Input Current
Input Low
Input High
Current Sense Threshold Voltage
Current Sense Blanking Interval
Delay from CS Trip to Gate Low
Minimum Off-Time One-Shot
Minimum Off-Time
Gate Driver
Gate High Output Voltage
Gate Low Output Voltage
Gate Output Rise Time
Gate Output Fall Time
Conditions
Symbol
DC Input Voltage
VIN=8 to 550V, PWMD to GND
VIN
IIN
VIN=15V to 550V, IDD=0, IGATE=0
-
VIN=15V, IDD=1mA
VDD
IDD
VDD
VIN=8V to 550V
VIN=8V to 550V
-
VPWMD(low)
VPWMD(high)
RPWMD
CS=0V
CS=VDD
-40°C < TA < 85°C, VIN=15V to 550V
-55°C < TA < -40°C, VIN=15V to 550V
RT=400k
RT=400k
IIL
IIH
VCS(high)
tBLANK
tDELAY
RT=400k
toff
IOUT=-10mA
IOUT=+10mA
CGATE=500pF
CGATE=500pF
VGATE(high)
VGATE(low)
tRISE
tFALL
Minimum
8
-
7.2
-
-
-
2.4
80
-5
-5
200
180
-
-
6
VDD-0.3
-
-
-
Typical Maximum
- 550
0.3 0.6
7.8 8.4
-2
150 200
- 0.5
--
115 150
-5
05
250 300
- 300
400 -
300 -
-8
VDD-0.06
0.03
16
7
-
0.3
-
-
Unit
VDC
mA
VDC
mA
mV
V
k
A
mV
ns
ns
s
V
ns
1.6 Thermal Characteristics
Parameter
Package
Symbol Minimum Typical
Thermal Resistance,
Junction-to-Ambient
SOIC-8 With Thermal Pad (NE) 1
SOIC-8 W/O Thermal Pad (N)
RJA
-
-
50
128
1 Use of a four-layer PCB can improve thermal dissipation (reference EIA/JEDEC JESD51-5).
Maximum
-
-
Unit
°C/W
R03
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5
Free Datasheet http://www.datasheet4u.com/
5 Page 
INTEGRATED CIRCUITS DIVISION
3.5 Mechanical Dimensions
3.5.1 8-Pin SOIC Package
Pin 8
1.270 REF
(0.050)
5.994 ± 0.254
(0.236 ± 0.010)
3.937 ± 0.254
(0.155 ± 0.010)
Pin 1
0.406 ± 0.076
(0.016 ± 0.003)
4.928 ± 0.254
(0.194 ± 0.010)
1.346 ± 0.076
(0.053 ± 0.003)
0.762 ± 0.254
(0.030 ± 0.010)
0.559 ± 0.254
(0.022 ± 0.010)
0.051 MIN - 0.254 MAX
(0.002 MIN - 0.010 MAX)
CPC9909
PCB Land Pattern
0.60
(0.024)
5.40
(0.213)
1.55
(0.061)
1.27
(0.050)
Dimensions
mm
(inches)
3.5.2 8-Pin SOIC EP Package
3.80
(0.150)
5.994 ± 0.254
(0.236 ± 0.010)
3.937 ± 0.254
(0.155 ± 0.010)
0.762 ± 0.254
(0.030 ± 0.010)
5.40 2.75
(0.209) (0.108)
1.55
(0.061)
Pin 1
0.406 ± 0.076
(0.016 ± 0.003)
1.270 REF
(0.050)
4.928 ± 0.254
(0.194 ± 0.010)
1.346 ± 0.076
(0.053 ± 0.003)
7º
1.27
(0.050)
0.60
(0.024)
Recommended PCB Land Pattern
2.540 ± 0.254
(0.100 ± 0.010)
0.051 MIN - 0.254 MAX
(0.002 MIN - 0.010 MAX)
3.556 ± 0.254
(0.140 ±0.010)
Dimensions
mm
(inches)
Note: Thermal pad should be electrically connected to GND, pin 3.
R03
www.ixysic.com
11
Free Datasheet http://www.datasheet4u.com/
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet CPC9909.PDF ] | |
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