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PDF LTC4443-1 Data sheet ( Hoja de datos )
| Número de pieza | LTC4443-1 | |
| Descripción | High Speed Synchronous N-Channel MOSFET Drivers | |
| Fabricantes | Linear Technology | |
| Logotipo |  |
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FEATURES
n Integrated Schottky Diode
n Wide VCC Range: 6V to 9.5V
n 38V Maximum Input Supply Voltage
n Adaptive Shoot-Through Protection
n 2.4A Peak Pull-Up Current
n 5A Peak Pull-Down Current
n 8ns TG Fall Time Driving 3000pF Load
n 12ns TG Rise Time Driving 3000pF Load
n Separate Supply to Match PWM Controller
n Drives Dual N-Channel MOSFETs
n Undervoltage Lockout
n Low Profile (0.75mm) 3mm × 3mm DFN Package
APPLICATIONS
n Distributed Power Architectures
n High Density Power Modules
L, LT, LTC and LTM are registered trademarks of Linear Technology Corporation.
All other trademarks are the property of their respective owners.
TYPICAL APPLICATION
Synchronous Buck Converter Driver
VCC
6V
PWM
BOOST
VLOGIC
TG
VCC LTC4443 TS
IN BG
GND
VIN
32V
VOUT
4443 TA01a
LTC4443w/wLwT.DCataS4he4et44U.c3om-1
High Speed Synchronous
N-Channel MOSFET Drivers
DESCRIPTION
The LTC®4443 is a high frequency gate driver with integrated
bootstrap Schottky diode designed to drive two N-channel
MOSFETs in a synchronous buck DC/DC converter topology.
The powerful driver capability reduces switching losses
in MOSFETs with high gate capacitance.
The LTC4443 features a separate supply for the input logic
to match the signal swing of the controller IC. If the input
signal is not being driven, the LTC4443 activates a shutdown
mode that turns off both external MOSFETs. The input
logic signal is internally level-shifted to the bootstrapped
supply, which may function at up to 42V above ground.
The Schottky diode required for the bootstrapped supply
is integrated to simplify layout and reduce parts count.
The LTC4443 contains undervoltage lockout circuits on
both the driver and logic supplies that turn off the external
MOSFETs when an undervoltage condition is present.
The LTC4443 and LTC4443-1 have different undervoltage
lockout thresholds to accommodate a wide variety of ap-
plications. An adaptive shoot-through protection feature is
also built-in to prevent power loss resulting from MOSFET
cross-conduction current.
The LTC4443/LTC4443-1 are available in a tiny 3mm ×
3mm DFN package.
LTC4443 Driving 3000pF Capacitive Loads
INPUT (IN)
5V/DIV
BOTTOM
GATE (BG)
5V/DIV
TOP GATE
(TG-TS)
5V/DIV
10ns/DIV
4443 TA01b
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TYPICAL PERFORMANCE CHARACTERISTICS
LTC4443w/wLwT.DCataS4he4et44U.c3om-1
Undervoltage Lockout Threshold
Hysteresis vs Temperature
1000
900
800
LTC4443-1
VCC UVLO
700
600
500
400
300
200
100
0
–40
LTC4443
VCC UVLO
VLOGIC UVLO
–10 20 50 80
TEMPERATURE (°C)
110
4443 G10
Propagation Delay vs
VLOGIC Supply Voltage
40
35
30
NO LOAD
VCC = 7V
TS = GND
25 tPLH(TG)
20 tPLH(BG)
tPHL(TG)
15
10 tPHL(BG)
5
0
3 4 5 6 7 8 9 10
VLOGIC SUPPLY VOLTAGE (V)
4443 G13
Output High Voltage vs
VCC Supply Voltage
10
TS = GND
9
8
–10mA
7
–1mA
–100mA
6
5
4
3
2
1
0
4 5 6 7 8 9 10
VCC SUPPLY VOLTAGE (V)
4443 G16
Switching Supply Current
vs Input Frequency
7
NO LOAD
6
VLOGIC = 5V
VCC = 7V
TS = GND
5
4 IVCC
3
2
1 IVLOGIC
0
0 200k 400k 600k 800k 1M
FREQUENCY (Hz)
4443 G11
Propagation Delay vs
VCC Supply Voltage
35
30
25 tPLH(TG)
NO LOAD
VLOGIC = 5V
TS = GND
20 tPLH(BG)
tPHL(TG)
15
10 tPHL(BG)
5
0
45
67
8 9 10
VCC SUPPLY VOLTAGE (V)
4443 G14
Rise and Fall Time vs
VCC Supply Voltage
20
CLOAD = 3.3nF
TS = GND
15
tr(BG)
10 tr(TG)
tf(TG)
5 tf(BG)
0
4 5 6 7 8 9 10
VCC SUPPLY VOLTAGE (V)
4443 G17
Switching Supply Current
vs Load Capacitance
100
VLOGIC = 5V
VCC = 7V
TS = GND
ICC
fIN = 500kHz
10
ICC
fIN = 100kHz
1
ILOGIC
fIN = 500kHz
0
0.1
0.3 1 3 10 30
LOAD CAPACITANCE (nF)
4443 G12
Propagation Delay vs
Temperature
40
NO LOAD
35 VLOGIC = 5V
VCC = 7V
30 TS = GND
25
tPLH(TG)
20
15 tPHL(BG)
10 tPHL(TG)
tPLH(BG)
5
0
–40 –10 20 50 80
TEMPERATURE (°C)
110
4443 G15
Rise and Fall Time vs
Load Capacitance
100
VCC = 7V
TS = GND
tr(BG)
tr(TG)
tf(TG)
tf(BG)
10
1
13
10 30
LOAD CAPACITANCE (nF)
4443 G18
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PACKAGE DESCRIPTION
LTC4443w/wLwT.DCataS4he4et44U.c3om-1
1.19 ±0.05
0.93 ±0.05
DDMA Package
12-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1743 Rev A)
2.25 REF
0.70 ±0.05
0.57 ±0.05
3.50 ±0.05
0.81 ±0.05
2.38 ±0.05
1.35 ±0.05
2.10 ±0.05
1.07 ±0.05
PACKAGE
OUTLINE
0.25 ± 0.05
0.45 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
3.00 ±0.10
R = 0.115
TYP
7
0.40 ± 0.10
0.11 ± 0.05
12
PIN 1
TOP MARK
(SEE NOTE 6)
0.200 REF
3.00 ±0.10
0.75 ±0.05
0.81 ± 0.10
R = 0.05
TYP
2.38 ±0.10
1.35 ± 0.10
0.63 ± 0.05
PIN 1 NOTCH
R = 0.20 OR
0.25 × 45°
6 1 CHAMFER
0.23 ± 0.05
0.45 BSC
2.25 REF
(DD12MA) DFN 0507 REV A
BOTTOM VIEW—EXPOSED PAD
0.00 – 0.05
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD AND TIE BARS SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
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11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet LTC4443-1.PDF ] | |
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