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MX25L1635D PDF даташит
| Спецификация MX25L1635D изготовлена «Macronix International» и имеет функцию, называемую «16M-BIT [x 1/x 2/x 4] CMOS SERIAL FLASH». |
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Детали детали
| Номер произв | MX25L1635D |
| Описание | 16M-BIT [x 1/x 2/x 4] CMOS SERIAL FLASH |
| Производители | Macronix International |
| логотип |  |
30 Pages
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MX25L1635D
www.DataSheet4U.com
MX25L1635D
DATASHEET
P/N: PM1374
REV. 1.5, OCT. 01, 2008
1
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MX25L1635D
Contents
FEATURES ................................................................................................................................................................. 5
GENERAL DESCRIPTION ........................................................................................................................................ 7
Table 1. Additional Feature Comparison ............................................................................................................. 7
PIN CONFIGURATIONS ............................................................................................................................................. 8
PIN DESCRIPTION .................................................................................................................................................... 8
BLOCK DIAGRAM ...................................................................................................................................................... 9
DATA PROTECTION .................................................................................................................................................. 10
Table 2. Protected Area Sizes .......................................................................................................................... 11
Table 3. 512-bit Secured OTP Definition ........................................................................................................... 11
Memory Organization .............................................................................................................................................. 12
Table 4. Memory Organization (16Mb) .............................................................................................................. 12
DEVICE OPERATION ................................................................................................................................................ 13
Figure 1. Serial Modes Supported ..................................................................................................................... 13
COMMAND DESCRIPTION ....................................................................................................................................... 14
Table 5. Command Set ..................................................................................................................................... 14
(1) Write Enable (WREN) .................................................................................................................................. 15
www.DataSheet4(2U).cWomrite Disable (WRDI) .................................................................................................................................. 15
(3) Read Identification (RDID) ........................................................................................................................... 15
(4) Read Status Register (RDSR) ..................................................................................................................... 16
(5) Write Status Register (WRSR) .................................................................................................................... 17
Table 6. Protection Modes ................................................................................................................................. 17
(6) Read Data Bytes (READ) ............................................................................................................................ 18
(7) Read Data Bytes at Higher Speed (FAST_READ) ....................................................................................... 18
(8) 2 x I/O Read Mode (2READ) ....................................................................................................................... 18
(9) 4 x I/O Read Mode (4READ) ....................................................................................................................... 19
(10) Sector Erase (SE) ..................................................................................................................................... 19
(11) Block Erase (BE) ...................................................................................................................................... 19
(12) Chip Erase (CE) ........................................................................................................................................ 20
(13) Page Program (PP) ................................................................................................................................... 20
(14) 4 x I/O Page Program (4PP) ...................................................................................................................... 21
(15) Continuously program mode (CP mode) ..................................................................................................... 21
(16) Deep Power-down (DP) ............................................................................................................................. 21
P/N: PM1374
REV. 1.5, OCT. 01, 2008
2
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MX25L1635D
(17) Release from Deep Power-down (RDP), Read Electronic Signature (RES) ................................................. 22
(18) Read Electronic Manufacturer ID & Device ID (REMS), (REMS2), (REMS4) ............................................. 22
Table 7. ID Definitions ....................................................................................................................................... 23
(19) Enter Secured OTP (ENSO) ...................................................................................................................... 23
(20) Exit Secured OTP (EXSO) ........................................................................................................................ 23
(21) Read Security Register (RDSCUR) ........................................................................................................... 23
(22) Write Security Register (WRSCUR) ........................................................................................................... 24
Table 8. Security Register Definition ................................................................................................................. 24
POWER-ON STATE ................................................................................................................................................... 25
ELECTRICAL SPECIFICATIONS .............................................................................................................................. 26
Figure 2.Maximum Negative Overshoot Waveform ............................................................................................ 26
ABSOLUTE MAXIMUM RATINGS ................................................................................................................... 26
CAPACITANCE TA = 25° C, f = 1.0 MHz ........................................................................................................... 26
Figure 3. Maximum Positive Overshoot Waveform ............................................................................................ 26
Figure 5. OUTPUT LOADING .......................................................................................................................... 27
Figure 4. INPUT TEST WAVEFORMS AND MEASUREMENT LEVEL ............................................................. 27
Table 9. DC CHARACTERISTICS (Temperature = -40° C to 85° C for Industrial grade,VCC = 2.7V ~ 3.6V) ........ 28
Table 10. AC CHARACTERISTICS (Temperature = -40° C to 85° C for Industrial grade, VCC = 2.7V ~ 3.6V) .... 29
Figure 6. Serial Input Timing ............................................................................................................................. 30
Figure 7. Output Timing .................................................................................................................................... 30
Timing Analysis ....................................................................................................................................................... 30
Figure 8. WP# Setup Timing and Hold Timing during WRSR when SRWD=1 ..................................................... 31
www.DataSheet4FUig.cuorme 9.Write Enable (WREN) Sequence (Command 06) ................................................................................ 31
Figure 10.Write Disable (WRDI) Sequence (Command 04) ............................................................................... 31
Figure 11. Read Identification (RDID) Sequence (Command 9F) ....................................................................... 32
Figure 12. Read Status Register (RDSR) Sequence (Command 05) ................................................................. 32
Figure 13. Write Status Register (WRSR) Sequence (Command 01) ................................................................ 32
Figure 14. Read Data Bytes (READ) Sequence (Command 03) ....................................................................... 33
Figure 15. Read at Higher Speed (FAST_READ) Sequence (Command 0B) .................................................... 33
Figure 16. 2 x I/O Read Mode Sequence (Command BB) ................................................................................. 34
Figure 17. 4 x I/O Read Mode Sequence (Command EB) ................................................................................. 34
Figure 18. 4 x I/O Read enhance performance Mode Sequence (Command EB) ............................................... 35
Figure 19. Page Program (PP) Sequence (Command 02) ................................................................................. 36
Figure 20. 4 x I/O Page Program (4PP) Sequence (Command 38) ................................................................... 36
Figure 21. Continously Program (CP) Mode Sequence with Hardware Detection (Command AD) ....................... 37
Figure 22. Sector Erase (SE) Sequence (Command 20) .................................................................................. 37
Figure 23. Block Erase (BE) Sequence (Command D8) ................................................................................... 37
Figure 24. Chip Erase (CE) Sequence (Command 60 or C7) ............................................................................ 38
Figure 25. Deep Power-down (DP) Sequence (Command B9) .......................................................................... 38
P/N: PM1374
REV. 1.5, OCT. 01, 2008
3
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