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SPN4946 PDF даташит
Спецификация SPN4946 изготовлена «SYNC POWER» и имеет функцию, называемую «N-Channel Enhancement Mode MOSFET». |
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Детали детали
Номер произв | SPN4946 |
Описание | N-Channel Enhancement Mode MOSFET |
Производители | SYNC POWER |
логотип | ![]() |
9 Pages

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SPN4946
N-Channel Enhancement Mode MOSFET
DESCRIPTION
The SPN4946 is the Dual N-Channel logic enhancement
mode power field effect transistors are produced using
high cell density , DMOS trench technology.
This high density process is especially tailored to
minimize on-state resistance.
These devices are particularly suited for low voltage
application , notebook computer power management and
other battery powered circuits where high-side
switching .
FEATURES
60V/12A,RDS(ON)= 44mΩ@VGS= 10V
60V/ 8A,RDS(ON)= 50mΩ@VGS= 4.5V
Super high density cell design for extremely low
RDS (ON)
Exceptional on-resistance and maximum DC
current capability
SOP – 8P package design
APPLICATIONS
z Power Management in Note book
z Portable Equipment
z Battery Powered System
z DC/DC Converter
z Load Switch
z DSC
z LCD Display inverter
PIN CONFIGURATION(SOP – 8P)
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PART MARKING
2009/ 03/ 25 Ver.1
Page 1

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SPN4946
N-Channel Enhancement Mode MOSFET
PIN DESCRIPTION
Pin
1
2
3
4
5
6
7
8
Symbol
S1
G1
S2
G2
D2
D2
D1
D1
Description
Source 1
Gate 1
Source 2
Gate 2
Drain 2
Drain 2
Drain 1
Drain 1
ORDERING INFORMATION
Part Number
SPN4946S8RGB
Package
SOP- 8P
※ SPN4546S8RGB 13” Tape Reel ; Pb – Free ; Halogen – Free
Part Marking
SPN4946
ABSOULTE MAXIMUM RATINGS
(TA=25℃ Unless otherwise noted)
Parameter
Drain-Source Voltage
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Gate –Source Voltage
Continuous Drain Current(TJ=150℃)
Pulsed Drain Current
Avalanche Current
Power Dissipation
Operating Junction Temperature
Storage Temperature Range
Thermal Resistance-Junction to Ambient
TA=25℃
TA=70℃
TA=25℃
TA=70℃
Symbol
VDSS
VGSS
ID
IDM
IAS
PD
TJ
TSTG
RθJA
Typical
60
±20
8.0
6.0
30
11
2.5
1.6
-55/150
-55/150
80
Unit
V
V
A
A
A
W
℃
℃
℃/W
2009/ 03/ 25 Ver.1
Page 2

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SPN4946
N-Channel Enhancement Mode MOSFET
ELECTRICAL CHARACTERISTICS
(TA=25℃ Unless otherwise noted)
Parameter
Static
Drain-Source Breakdown Voltage
Gate Threshold Voltage
Gate Leakage Current
Zero Gate Voltage Drain Current
On-State Drain Current
Drain-Source On-Resistance
Forward Transconductance
Diode Forward Voltage
Dynamic
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Input Capacitance
Output Capacitance
wwwR.DeavtaeSrsheeeTt4rUa.ncsofmer Capacitance
Turn-On Time
Turn-Off Time
Symbol
Conditions
V(BR)DSS VGS=0V,ID=250uA
VGS(th) VDS=VGS,ID=250uA
IGSS VDS=0V,VGS=±20V
VDS=60V,VGS=0V
IDSS VDS=60V,VGS=0V
TJ=85℃
ID(on) VDS≥5V,VGS =10V
RDS(on)
VGS= 10V,ID=10A
VGS=4.5V,ID=6A
gfs VDS=15V,ID=5.3A
VSD IS=2.0A,VGS =0V
Qg
Qgs
Qgd
Ciss
Coss
Crss
td(on)
tr
td(off)
tf
VDS=30V,VGS=5V
ID= 5.3A
VDS=30V,VGS=0V
f=1MHz
VDD=30V,RL=6.8Ω
ID≡4.4A,VGEN=10V
RG=1Ω
Min. Typ Max. Unit
60 V
0.8 2.0
±100 nA
1
5 uA
30 A
0.038
0.042
24
0.044
0.050
Ω
S
0.8 1.2 V
10 15
3.5 nC
3.6
890
85 pF
48
10 15
12 20 nS
25 35
10 15
2009/ 03/ 25 Ver.1
Page 3

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