MSB709-RT1 PDF даташит

Спецификация MSB709-RT1 изготовлена «Motorola Semiconductor Products» и имеет функцию, называемую «Small Signal Plastic Pnp».

Детали детали

Номер произв	MSB709-RT1
Описание	Small Signal Plastic Pnp
Производители	Motorola Semiconductor Products
логотип

4 Pages

No Preview Available !

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Order this document

by MSB709–RT1/D

PNP General Purpose Amplifier

Transistor Surface Mount

COLLECTOR

MSB709-RT1

Motorola Preferred Device

MAXIMUM RATINGS (TA = 25°C)

Rating

Symbol

Collector–Base Voltage

V(BR)CBO

Collector–Emitter Voltage

V(BR)CEO

Emitter–Base Voltage

V(BR)EBO

Collector Current — Continuous

Collector Current — Peak

IC(P)

THERMAL CHARACTERISTICS

Characteristic

Symbol

Power Dissipation

Junction Temperature

Storage Temperature

Tstg

ELECTRICAL CHARACTERISTICS (TA = 25°C)

Characteristic

Collector–Emitter Breakdown Voltage (IC = – 2.0 mAdc, IB = 0)

Collector–Base Breakdown Voltage (IC = –10 µAdc, IE = 0)

www.DataSEhmeeittte4rU–.Bcaosme Breakdown Voltage (IE = –10 µAdc, IE = 0)

Collector–Base Cutoff Current (VCB = –45 Vdc, IE = 0)

Collector–Emitter Cutoff Current (VCE = –10 Vdc, IB = 0)

DC Current Gain(1)

(VCE = –10 Vdc, IC = – 2.0 mAdc)

Collector–Emitter Saturation Voltage

(IC = –100 mAdc, IB = –10 mAdc)

1. Pulse Test: Pulse Width ≤ 300 µs, D.C. ≤ 2%.

BASE

Value

– 60

– 45

– 7.0

–100

– 200

EMITTER

Unit

Vdc

mAdc

Max

200

150

– 55 ~ +150

Unit

°C

Symbol

V(BR)CEO

V(BR)CBO

V(BR)EBO

ICBO

ICEO

hFE1

VCE(sat)

DEVICE MARKING

CASE 318D–03, STYLE 1

SC–59

Min

– 45

– 60

– 7.0

—

210

—

Max

—

– 0.1

–100

340

– 0.5

Unit

Vdc

µAdc

nAdc

—

Vdc

Marking Symbol

ARX

The “X” represents a smaller alpha digit Date Code. The Date Code indicates the actual month

in which the part was manufactured.

Thermal Clad is a trademark of the Bergquist Company

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 3

Motorola Small–Signal Transistors, FETs and Diodes Device Data

No Preview Available !

MSB709-RT1

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the total

design. The footprint for the semiconductor packages must

be the correct size to insure proper solder connection

interface between the board and the package. With the

correct pad geometry, the packages will self align when

subjected to a solder reflow process.

0.037

0.95

0.037

0.95

0.039

1.0

0.031

0.8

0.098–0.118

2.5–3.0

0.094

2.4

inches

SC–59 POWER DISSIPATION

The power dissipation of the SC–59 is a function of the pad

size. This can vary from the minimum pad size for soldering

to the pad size given for maximum power dissipation. Power

dissipation for a surface mount device is determined by

TJ(max), the maximum rated junction temperature of the die,

RθJA, the thermal resistance from the device junction to

ambient; and the operating temperature, TA. Using the

values provided on the data sheet, PD can be calculated as

follows:

TJ(max) – TA

PD =

RθJA

The values for the equation are found in the maximum

ratings table on the data sheet. Substituting these values into

the equation for an ambient temperature TA of 25°C, one can

calculate the power dissipation of the device which in this

case is 200 milliwatts.

150°C – 25°C

PD = 625°C/W = 200 milliwatts

The 625°C/W assumes the use of the recommended

footprint on a glass epoxy printed circuit board to achieve a

power dissipation of 200 milliwatts. Another alternative would

be to use a ceramic substrate or an aluminum core board

such as Thermal Clad™. Using a board material such as

Thermal Clad, a power dissipation of 400 milliwatts can be

achieved using the same footprint.

SOLDERING PRECAUTIONS

The melting temperature of solder is higher than the rated

www.DattaeSmhpeetr4aUtu.croemof the device. When the entire device is heated

to a high temperature, failure to complete soldering within a

short time could result in device failure. Therefore, the

following items should always be observed in order to

minimize the thermal stress to which the devices are

subjected.

• Always preheat the device.

• The delta temperature between the preheat and

soldering should be 100°C or less.*

• When preheating and soldering, the temperature of the

leads and the case must not exceed the maximum

temperature ratings as shown on the data sheet. When

using infrared heating with the reflow soldering method,

the difference should be a maximum of 10°C.

• The soldering temperature and time should not exceed

260°C for more than 10 seconds.

• When shifting from preheating to soldering, the

maximum temperature gradient should be 5°C or less.

• After soldering has been completed, the device should

be allowed to cool naturally for at least three minutes.

Gradual cooling should be used as the use of forced

cooling will increase the temperature gradient and result

in latent failure due to mechanical stress.

• Mechanical stress or shock should not be applied during

cooling

* Soldering a device without preheating can cause excessive

thermal shock and stress which can result in damage to the

device.

2 Motorola Small–Signal Transistors, FETs and Diodes Device Data

No Preview Available !

MSB709-RT1

SOLDER STENCIL GUIDELINES

Prior to placing surface mount components onto a printed

circuit board, solder paste must be applied to the pads. A

solder stencil is required to screen the optimum amount of

solder paste onto the footprint. The stencil is made of brass

or stainless steel with a typical thickness of 0.008 inches.

The stencil opening size for the SC–59 package should be

the same as the pad size on the printed circuit board, i.e., a

1:1 registration.

TYPICAL SOLDER HEATING PROFILE

For any given circuit board, there will be a group of control

settings that will give the desired heat pattern. The operator

must set temperatures for several heating zones, and a

figure for belt speed. Taken together, these control settings

make up a heating “profile” for that particular circuit board.

On machines controlled by a computer, the computer

remembers these profiles from one operating session to the

next. Figure 1 shows a typical heating profile for use when

soldering a surface mount device to a printed circuit board.

This profile will vary among soldering systems but it is a good

starting point. Factors that can affect the profile include the

type of soldering system in use, density and types of

components on the board, type of solder used, and the type

of board or substrate material being used. This profile shows

temperature versus time. The line on the graph shows the

actual temperature that might be experienced on the surface

of a test board at or near a central solder joint. The two

profiles are based on a high density and a low density board.

The Vitronics SMD310 convection/infrared reflow soldering

system was used to generate this profile. The type of solder

used was 62/36/2 Tin Lead Silver with a melting point

between 177 –189°C. When this type of furnace is used for

solder reflow work, the circuit boards and solder joints tend to

heat first. The components on the board are then heated by

conduction. The circuit board, because it has a large surface

area, absorbs the thermal energy more efficiently, then

distributes this energy to the components. Because of this

effect, the main body of a component may be up to 30

degrees cooler than the adjacent solder joints.

www.DataSheet4U.com

200°C

STEP 1 STEP 2 STEP 3

STEP 4

STEP 5 STEP 6 STEP 7

PREHEAT VENT HEATING

HEATING HEATING VENT COOLING

ZONE 1

“RAMP”

“SOAK” ZONES 2 & 5 ZONES 3 & 6 ZONES 4 & 7

“RAMP”

“SOAK”

“SPIKE”

DESIRED CURVE FOR HIGH

MASS ASSEMBLIES

160°C

170°C

205° TO 219°C

PEAK AT

SOLDER JOINT

150°C

100°C

140°C

SOLDER IS LIQUID FOR

40 TO 80 SECONDS

(DEPENDING ON

MASS OF ASSEMBLY)

DESIRED CURVE FOR LOW

MASS ASSEMBLIES

50°C

TIME (3 TO 7 MINUTES TOTAL)

TMAX

Figure 1. Typical Solder Heating Profile

Motorola Small–Signal Transistors, FETs and Diodes Device Data

Скачать PDF:

[ MSB709-RT1.PDF Даташит ]

Номер в каталоге	Описание	Производители
MSB709-RT1	PNP General Purpose Amplifier Transistor Surface Mount	LRC
MSB709-RT1	Small Signal Plastic Pnp	ON Semiconductor
MSB709-RT1	Small Signal Plastic Pnp	Motorola Semiconductor Products

Номер в каталоге	Описание	Производители
TL431	100 мА, регулируемый прецизионный шунтирующий регулятор	Unisonic Technologies
IRF840	8 А, 500 В, N-канальный МОП-транзистор	Vishay
LM317	Линейный стабилизатор напряжения, 1,5 А	STMicroelectronics

DataSheet26.com | 2020 |

Контакты | Поиск