MSB709-RT1 PDF даташит

Спецификация MSB709-RT1 изготовлена «ON Semiconductor» и имеет функцию, называемую «Small Signal Plastic Pnp».

Детали детали

Номер произв	MSB709-RT1
Описание	Small Signal Plastic Pnp
Производители	ON Semiconductor
логотип

4 Pages

No Preview Available !

MSB709-RT1

Preferred Device

PNP General Purpose

Amplifier Transistor

Surface Mount

MAXIMUM RATINGS (TA = 25°C)

Rating

Collector–Base Voltage

Collector–Emitter Voltage

Emitter–Base Voltage

Collector Current – Continuous

Collector Current – Peak

THERMAL CHARACTERISTICS

Characteristic

Power Dissipation

Junction Temperature

Storage Temperature

Symbol

V(BR)CBO

V(BR)CEO

V(BR)EBO

IC(P)

Value

–60

–45

–7.0

–100

–200

Symbol

Tstg

Max

200

150

–55 ~ +150

Unit

Vdc

mAdc

Unit

°C

ELECTRICAL CHARACTERISTICS (TA = 25°C)

Characteristic

Symbol Min Max

Collector–Emitter Breakdown Voltage

(IC = –2.0 mAdc, IB = 0)

V(BR)CEO –45

–

Collector–Base Breakdown Voltage

(IC = –10 mAdc, IE = 0)

V(BR)CBO –60

–

Emitter–Base Breakdown Voltage

(IE = –10 mAdc, IE = 0)

www.DataSheet4U.com

Collector–Base Cutoff Current

(VCB = –45 Vdc, IE = 0)

V(BR)EBO –7.0 –

ICBO

– –0.1

Collector–Emitter Cutoff Current

(VCE = –10 Vdc, IB = 0)

ICEO

– –100

DC Current Gain (Note 1)

(VCE = –10 Vdc, IC = –2.0 mAdc)

hFE1

210 340

Collector–Emitter Saturation Voltage

(IC = –100 mAdc, IB = –10 mAdc)

VCE(sat) – –0.5

1. Pulse Test: Pulse Width ≤ 300 ms, D.C. ≤ 2%.

Unit

Vdc

mAdc

nAdc

–

Vdc

http://onsemi.com

COLLECTOR

BASE

EMITTER

SC–59

SUFFIX

CASE 318D

MARKING DIAGRAM

AR M

AR = Specific Device Code

M = Date Code

Preferred devices are recommended choices for future use

and best overall value.

May, 2002 – Rev. 5

Publication Order Number:

MSB709–RT1/D

No Preview Available !

MSB709–RT1

INFORMATION FOR USING THE SC–59 SURFACE MOUNT PACKAGE

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the total

design. The footprint for the semiconductor packages must

be the correct size to insure proper solder connection

interface between the board and the package. With the

correct pad geometry, the packages will self align when

subjected to a solder reflow process.

0.037

0.95

0.037

0.95

0.039

1.0

0.094

2.4

0.031

0.8

inches

SC–59 POWER DISSIPATION

The power dissipation of the SC–59 is a function of the

pad size. This can vary from the minimum pad size for sol-

dering to the pad size given for maximum power dissipa-

tion. Power dissipation for a surface mount device is deter-

mined by TJ(max), the maximum rated junction temperature

of the die, RqJA, the thermal resistance from the device

junction to ambient; and the operating temperature, TA. Us-

ing the values provided on the data sheet, PD can be calcu-

lated as follows.

PD =

TJ(max) – TA

RqJA

The values for the equation are found in the maximum

www.DatarSathienegts4Uta.cbolemon the data sheet. Substituting these values into

the equation for an ambient temperature TA of 25°C, one

can calculate the power dissipation of the device which in

this case is 338 milliwatts.

PD =

150°C – 25°C

370°C/W

= 338 milliwatts

The 370°C/W assumes the use of the recommended foot-

print on a glass epoxy printed circuit board to achieve a

power dissipation of 338 milliwatts. Another alternative

would be to use a ceramic substrate or an aluminum core

board such as Thermal Clad™. Using a board material such

as Thermal Clad, the power dissipation can be doubled us-

ing the same footprint.

SOLDERING PRECAUTIONS

The melting temperature of solder is higher than the rated

temperature of the device. When the entire device is heated

to a high temperature, failure to complete soldering within

a short time could result in device failure. Therefore, the

following items should always be observed in order to

minimize the thermal stress to which the devices are

subjected.

• Always preheat the device.

• The delta temperature between the preheat and

soldering should be 100°C or less.*

• When preheating and soldering, the temperature of the

leads and the case must not exceed the maximum

temperature ratings as shown on the data sheet. When

using infrared heating with the reflow soldering

method, the difference should be a maximum of 10°C.

• The soldering temperature and time should not exceed

260°C for more than 10 seconds.

• When shifting from preheating to soldering, the

maximum temperature gradient should be 5°C or less.

• After soldering has been completed, the device should

be allowed to cool naturally for at least three minutes.

Gradual cooling should be used as the use of forced

cooling will increase the temperature gradient and

result in latent failure due to mechanical stress.

• Mechanical stress or shock should not be applied dur-

ing cooling

* Soldering a device without preheating can cause exces-

sive thermal shock and stress which can result in damage

to the device.

http://onsemi.com

No Preview Available !

MSB709–RT1

SOLDER STENCIL GUIDELINES

Prior to placing surface mount components onto a printed

circuit board, solder paste must be applied to the pads. A

solder stencil is required to screen the optimum amount of

solder paste onto the footprint. The stencil is made of brass

or stainless steel with a typical thickness of 0.008 inches.

The stencil opening size for the surface mounted package

should be the same as the pad size on the printed circuit

board, i.e., a 1:1 registration.

TYPICAL SOLDER HEATING PROFILE

For any given circuit board, there will be a group of

control settings that will give the desired heat pattern. The

operator must set temperatures for several heating zones,

and a figure for belt speed. Taken together, these control

settings make up a heating “profile” for that particular

circuit board. On machines controlled by a computer, the

computer remembers these profiles from one operating

session to the next. Figure 1 shows a typical heating profile

for use when soldering a surface mount device to a printed

circuit board. This profile will vary among soldering

systems but it is a good starting point. Factors that can

affect the profile include the type of soldering system in

use, density and types of components on the board, type of

solder used, and the type of board or substrate material

being used. This profile shows temperature versus time.

The line on the graph shows the actual temperature that

might be experienced on the surface of a test board at or

near a central solder joint. The two profiles are based on a

high density and a low density board. The Vitronics

SMD310 convection/infrared reflow soldering system was

used to generate this profile. The type of solder used was

62/36/2 Tin Lead Silver with a melting point between

177–189°C. When this type of furnace is used for solder

reflow work, the circuit boards and solder joints tend to

heat first. The components on the board are then heated by

conduction. The circuit board, because it has a large surface

area, absorbs the thermal energy more efficiently, then

distributes this energy to the components. Because of this

effect, the main body of a component may be up to 30

degrees cooler than the adjacent solder joints.

www.DataSheet4U.com

200°C

150°C

100°C

STEP 1

PREHEAT

ZONE 1

RAMP"

STEP 2

VENT

SOAK"

STEP 3

HEATING

ZONES 2 & 5

RAMP"

STEP 4

STEP 5

HEATING HEATING

ZONES 3 & 6 ZONES 4 & 7

SOAK"

SPIKE"

DESIRED CURVE FOR HIGH

MASS ASSEMBLIES

160°C

170°C

150°C

STEP 6 STEP 7

VENT COOLING

205° TO 219°C

PEAK AT

SOLDER JOINT

100°C

140°C

SOLDER IS LIQUID FOR

40 TO 80 SECONDS

(DEPENDING ON

MASS OF ASSEMBLY)

DESIRED CURVE FOR LOW

MASS ASSEMBLIES

50°C

TIME (3 TO 7 MINUTES TOTAL)

TMAX

Figure 1. Typical Solder Heating Profile

http://onsemi.com

Скачать PDF:

[ MSB709-RT1.PDF Даташит ]

Номер в каталоге	Описание	Производители
MSB709-RT1	PNP General Purpose Amplifier Transistor Surface Mount	LRC
MSB709-RT1	Small Signal Plastic Pnp	ON Semiconductor
MSB709-RT1	Small Signal Plastic Pnp	Motorola Semiconductor Products

Номер в каталоге	Описание	Производители
TL431	100 мА, регулируемый прецизионный шунтирующий регулятор	Unisonic Technologies
IRF840	8 А, 500 В, N-канальный МОП-транзистор	Vishay
LM317	Линейный стабилизатор напряжения, 1,5 А	STMicroelectronics

DataSheet26.com | 2020 |

Контакты | Поиск