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FDMS7672AS PDF даташит
Спецификация FDMS7672AS изготовлена «Fairchild Semiconductor» и имеет функцию, называемую «N-Channel MOSFET». |
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Детали детали
Номер произв | FDMS7672AS |
Описание | N-Channel MOSFET |
Производители | Fairchild Semiconductor |
логотип | ![]() |
8 Pages

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September 2009
FDMS7672AS
N-Channel PowerTrench® SyncFETTM
30 V, 42 A, 4 mΩ
Features
General Description
Max rDS(on) = 4.0 mΩ at VGS = 10 V, ID = 18 A
Max rDS(on) = 4.5 mΩ at VGS = 7 V, ID = 16 A
Advanced Package and Silicon combination for low rDS(on)
and high efficiency
SyncFET Schottky Body Diode
MSL1 robust package design
The FDMS7672AS has been designed to minimize losses in
power conversion application. Advancements in both silicon and
package technologies have been combined to offer the lowest
rDS(on) while maintaining excellent switching performance. This
device has the added benefit of an efficient monolithic Schottky
body diode.
Applications
100% UIL tested
Synchronous Rectifier for DC/DC Converters
RoHS Compliant
Notebook Vcore/ GPU low side switch
Networking Point of Load low side switch
Telecom secondary side rectification
Top
Bottom
Pin 1
S D5
4G
S
SG D 6
3S
Power 56
DDDD
D7
D8
2S
1S
MOSFET
www.DataSheet4U.com
Maximum
Ratings
TA
=
25
°C
unless
otherwise
noted
Symbol
VDS
VGS
ID
Parameter
Drain to Source Voltage
Gate to Source Voltage
Drain Current -Continuous (Package limited)
-Continuous (Silicon limited)
-Continuous
-Pulsed
TC = 25 °C
TC = 25 °C
TA = 25 °C
dv/dt
MOSFET dv/dt
EAS
PD
TJ, TSTG
Single Pulse Avalanche Energy
Power Dissipation
TC = 25 °C
Power Dissipation
TA = 25 °C
Operating and Storage Junction Temperature Range
Thermal Characteristics
(Note 4)
(Note 1a)
(Note 3)
(Note 1a)
Ratings
30
±20
42
83
19
90
2.6
60
46
2.5
-55 to +150
Units
V
V
A
V/ns
mJ
W
°C
RθJC
RθJA
Thermal Resistance, Junction to Case
Thermal Resistance, Junction to Ambient
Package Marking and Ordering Information
(Note 1a)
2.7
50
°C/W
Device Marking
FDMS7672AS
Device
FDMS7672AS
Package
Power 56
Reel Size
13 ’’
Tape Width
12 mm
Quantity
3000 units
©2009 Fairchild Semiconductor Corporation
FDMS7672AS Rev.C
1
www.fairchildsemi.com

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Electrical Characteristics TJ = 25 °C unless otherwise noted
Symbol
Parameter
Test Conditions
Min Typ Max Units
Off Characteristics
BVDSS
∆BVDSS
∆TJ
IDSS
IGSS
Drain to Source Breakdown Voltage
Breakdown Voltage Temperature
Coefficient
Zero Gate Voltage Drain Current
Gate to Source Leakage Current, Forward
ID = 1 mA, VGS = 0 V
ID = 10 mA, referenced to 25 °C
VDS = 24 V, VGS = 0 V
VGS = 20 V, VDS = 0 V
30
V
18 mV/°C
500 µA
100 nA
On Characteristics (Note 2)
VGS(th)
∆VGS(th)
∆TJ
Gate to Source Threshold Voltage
Gate to Source Threshold Voltage
Temperature Coefficient
rDS(on)
Static Drain to Source On Resistance
gFS Forward Transconductance
VGS = VDS, ID = 1 mA
1.2 1.9 3.0
V
ID = 10 mA, referenced to 25 °C
-5 mV/°C
VGS = 10 V, ID = 18 A
VGS = 7 V, ID = 16 A
VGS = 4.5 V, ID = 14 A
VGS = 10 V, ID = 18 A, TJ = 125 °C
VDS = 5 V, ID = 18 A
3.2 4.0
3.5
4.3
4.5
5.2
mΩ
4.1 5.2
97 S
Dynamic Characteristics
Ciss
Coss
Crss
Rg
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
VDS = 15 V, VGS = 0 V,
f = 1 MHz
2120
735
90
1.1
2820
975
135
2.2
pF
pF
pF
Ω
Switching Characteristics
td(on)
Turn-On Delay Time
tr Rise Time
td(off)
Turn-Off Delay Time
tf Fall Time
Qg Total Gate Charge
Qg Total Gate Charge
Qgs Gate to Source Gate Charge
Qgd Gate to Drain “Miller” Charge
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Drain-Source Diode Characteristics
VDD = 15 V, ID = 18 A,
VGS = 10 V, RGEN = 6 Ω
VGS = 0 V to 10 V
VGS = 0 V to 4.5 V VDD = 15 V,
ID = 18 A
12 21 ns
5 10 ns
28 44 ns
4 10 ns
33 46 nC
15 22 nC
6.5 nC
4.0 nC
VSD
Source to Drain Diode Forward Voltage
VGS = 0 V, IS = 2 A
VGS = 0 V, IS = 18 A
(Note 2)
(Note 2)
0.48 0.9
0.80 1.3
V
trr Reverse Recovery Time
Qrr Reverse Recovery Charge
IF = 18 A, di/dt = 300 A/µs
26 42 ns
26 42 nC
Notes:
1. RθJA is determined with the device mounted on a 1in2 pad 2 oz copper pad on a 1.5 x 1.5 in. board of FR-4 material. RθJC is guaranteed by design while RθCA is determined by
the user's board design.
a. 50 °C/W when mounted on a
1 in2 pad of 2 oz copper.
b. 125 °C/W when mounted on a
minimum pad of 2 oz copper.
2. Pulse Test: Pulse Width < 300 µs, Duty cycle < 2.0%.
3. EAS of 60 mJ is based on starting TJ = 25 °C, L = 1 mH, IAS = 11 A, VDD = 27 V, VGS = 10 V. 100% test at L = 0.3 mH, IAS = 16 A.
4. As an N-ch device, the negative Vgs rating is for low duty cycle pulse occurrence only. No continuous rating is implied.
FDMS7672AS Rev.C
2
www.fairchildsemi.com

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Typical Characteristics TJ = 25 °C unless otherwise noted
90
PULSE DURATION = 80 µs
DUTY CYCLE = 0.5% MAX
60 VGS = 10 V
VGS = 4.5 V
VGS = 4 V
VGS = 3.5 V
30
VGS = 3 V
0
0.0 0.5 1.0 1.5
VDS, DRAIN TO SOURCE VOLTAGE (V)
Figure 1. On-Region Characteristics
2.0
12
VGS = 3 V
10
8
VGS = 3.5 V
6
PULSE DURATION = 80 µs
DUTY CYCLE = 0.5% MAX
4 VGS = 10 V
VGS = 4 V VGS = 4.5 V
2
0
0 30 60
ID, DRAIN CURRENT (A)
Figure 2. Normalized On-Resistance
vs Drain Current and Gate Voltage
90
1.5
1.4
ID = 18 A
VGS = 10 V
1.3
1.2
1.1
1.0
0.9
0.8
0.7
-75
-50 -25 0 25 50 75 100 125 150
TJ, JUNCTION TEMPERATURE (oC)
Figure 3. Normalized On- Resistance
vs Junction Temperature
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90
PULSE DURATION = 80 µs
DUTY CYCLE = 0.5% MAX
60 VDS = 5 V
TJ = 125 oC
30
0
1
TJ = 25 oC
TJ = -55 oC
23
VGS, GATE TO SOURCE VOLTAGE (V)
4
Figure 5. Transfer Characteristics
12
ID = 18 A
PULSE DURATION = 80 µs
DUTY CYCLE = 0.5% MAX
10
8
6
TJ = 125 oC
4
2 TJ = 25 oC
2468
VGS, GATE TO SOURCE VOLTAGE (V)
Figure 4. On-Resistance vs Gate to
Source Voltage
100
VGS = 0 V
10
TJ = 125 oC
1
10
0.1 TJ = 25 oC
0.01
TJ = -55 oC
0.001
0.0
0.2 0.4 0.6 0.8 1.0
VSD, BODY DIODE FORWARD VOLTAGE (V)
Figure 6. Source to Drain Diode
Forward Voltage vs Source Current
1.2
FDMS7672AS Rev.C
3 www.fairchildsemi.com

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