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FDMF6700 PDF даташит
| Спецификация FDMF6700 изготовлена «Fairchild Semiconductor» и имеет функцию, называемую «Driver plus FET Multi-chip Module». |
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Детали детали
| Номер произв | FDMF6700 |
| Описание | Driver plus FET Multi-chip Module |
| Производители | Fairchild Semiconductor |
| логотип |  |
13 Pages
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May 2007
FDMF6700
Driver plus FET Multi-chip Module
tm
Benefits
Fully optimized system efficiency. Higher efficiency levels
are achievable compared with conventional discrete
components.
Space savings of up to 50% PCB versus discrete solutions.
Higher frequency of operation.
Simpler system design and board layout. Reduced time in
component selection and optimization.
Features
12V typical Input Voltage
Output current up to 25A
500KHz switching frequency capable
Internal adaptive gate drive
Integrated bootstrap diode
Peak Efficiency >85%
Under-voltage Lockout
Output disable for lost phase shutdown
Low profile SMD package
RoHS Compliant
General Description
The FDMF6700 is a fully optimized integrated 12V Driver plus
MOSFET power stage solution for high current synchronous
buck DC-DC applications. The device integrates a driver IC and
two Power MOSFETs into a space saving, 6mm x 6mm, 40-pin
Power66™ package. Fairchild Semiconductor’s integrated
approach optimizes the complete switching power stage with
regards to driver to FET dynamic performance, system
inductance and overall solution ON resistance. Package
parasitics and problematical layouts associated with
conventional discrete solutions are greatly reduced. This
integrated approach results in significant board space saving,
therefore maximizing footprint power density. This solution is
based on the Intel™ DrMOS specification.
Applications
Desktop and server VR11.x V-core and non V-core buck
converters.
CPU/GPU power train in game consoles and high end
desktop systems.
High-current DC-DC Point of Load (POL) converters
Networking and telecom microprocessor voltage regulators
Small form factor voltage regulator modules
Powertrain Application Circuit
www.DataSheet4U.com
12V
CVCC
DISB
PWM
Input
VCIN
DISB
VIN
BOOT
PWM
VSWH
CGND PGND
CBOOT
OUTPUT
COUT
Figure 1. Powertrain Application Circuit
Ordering Information
Part
FDMF6700
Current Rating
Max
[A]
25
Input Voltage
Typical
[V]
12
Frequency
Max
[KHz]
500
©2007 Fairchild Semiconductor Corporation
FDMF6700 Rev. B
1
Device
Marking
FDMF6700
www.fairchildsemi.com
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Functional Block Diagram
DISB
PWM
BOOT VCIN HDRV VIN
2.2 1.2
VCIN
1.2
VSWH
Pin Configuration
CGND
LDRV PGND
Figure 2. Functional Block Diagram
www.DataSheet4U.com
FDMF6700 Rev. B
1 10
PWM
DISB
TEST PAD2
CGND
VSWH
PGND
PGND
PGND
PGND
PGND
40
31
(CGND)
(VIN)
(VSWH)
11 VIN
VIN
VIN
VIN
VSWH
VSWH
VSWH
VSWH
VSWH
20 VSWH
30 21
Figure 3. Power66 40L Bottom View
2
www.fairchildsemi.com
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Pin Description
Pin
1,5,37,A
2,7
3
4
Name
CGND
NC
VCIN
BOOT
6,15-21,36,C
VSWH
9-4,B
8
VIN
TEST PAD 1
22-35
38
PGND
TEST PAD 2
39 DISB
40 PWM
Function
IC Ground. Ground return for driver IC.
No connect
IC Supply. +12V chip bias power. Bypass with a 1µF ceramic capacitor.
Bootstrap Supply Input. Provides voltage supply to high-side MOSFET driver. Connect
bootstrap capacitor.
Switch Node Input. SW Provides return for high-side bootstrapped driver and acts as a
sense point for the adaptive shoot-thru protection.
Power Input. Output stage supply voltage.
For manufacturing test only. HDRV pin. This pin must be floated. Must not be connected to
any pin.
Power ground. Output stage ground. Source pin of low side MOSFET(s).
For manufacturing test only. LDRV pin. This pin must be floated. Must not be connected to
any pin.
Output Disable. When low, this pin disable FET switching (HDRV and LDRV are held low).
PWM Signal Input. This pin accepts a logic-level PWM signal from the controller.
Absolute Maximum Rating
Parameter
VCIN to PGND
VIN to PGND
PWM, DSIB to GND
VSWH to PGND
BOOT to VSWH
Continuous
Transient (t = 100ns, fsw = 500KHz)
BOOT to PGND
Continuous
Transient (t = 100ns, fsw = 500KHz)
IO(AV)
VIN = 12V, VO = 1.3V, fsw = 500KHz, TPCB = 100°C
www.DataShIeOe(tP4KU) .com
RθJPCB
VIN = 12V, tPULSE = 10µs
Junction to PCB Thermal Resistance (note 1)
PD TPCB = 100°C (note 1)
Operating and Storage Junction Temperature Range
Min.
-0.5
-0.5
-0.3
-1
-5
-0.3
-0.3
-0.3
-55
Max.
15
15
5.5
15
25
15
30
33
25
65
6.5
7.7
150
Units
V
V
V
V
V
V
V
V
A
A
°C/W
W
°C
Recommended Operating Range
Parameter
VCIN
VIN
Control Circuit Supply Voltage
Output Stage Supply Voltage
Min.
6.4
6.4
Typ.
12
12
Max.
13.5
14
Units
V
V
Electrical Characteristics
VIN = 12V, TA = 25°C unless otherwise noted.
Parameter
Symbol
Conditions
Control Circuit Supply Current
Undervoltage lockout threshold
ICIN
VTH(UVLO)(2)
fSW = 0Hz, VDISB = 0V
fSW = 500KHz, VDISB = 5V
Turn-on
Turn-off
PWM Input High Voltage
VIH(PWM)
Min.
3.5
Typ.
3.5
18
6
5.25
Max. Units
8
mA
V
V
V
FDMF6700 Rev. B
3 www.fairchildsemi.com
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