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FDI040N06 PDF даташит
Спецификация FDI040N06 изготовлена «Fairchild Semiconductor» и имеет функцию, называемую «N-Channel MOSFET». |
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Детали детали
Номер произв | FDI040N06 |
Описание | N-Channel MOSFET |
Производители | Fairchild Semiconductor |
логотип | ![]() |
8 Pages

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June 2009
FDI040N06
N-Channel PowerTrench® MOSFET
60V, 168A, 4.0mΩ
tm
Features
• RDS(on) = 3.2mΩ ( Typ.) @ VGS = 10V, ID = 75A
• Fast Switching Speed
• Low Gate Charge
• High Performance Trench Technology for Extremely Low
RDS(on)
• High Power and Current Handling Capability
• RoHS Compliant
General Description
This N-Channel MOSFET is produced using Fairchild
Semiconductor’s advanced PowerTrench process that has been
especially tailored to minimize the on-state resistance and yet
maintain superior switching performance.
Application
• DC to DC convertors / Synchronous Rectification
D
GDS
I2-PAK
FDI Series
G
S
MOSFET Maximum Ratings TC = 25oC unless otherwise noted
Symbol
Parameter
www.DataVSDhSeSet4U.com Drain to Source Voltage
VGSS
ID
Gate to Source Voltage
Drain Current
-Continuous (TC = 25oC, Silicion Limited)
-Continuous (TC = 100oC, Silicion Limited)
-Continuous (TC = 25oC, Package Limited)
IDM Drain Current
- Pulsed
(Note 1)
EAS Single Pulsed Avalanche Energy
(Note 2)
dv/dt
Peak Diode Recovery dv/dt
(Note 3)
PD Power Dissipation
(TC = 25oC)
- Derate above 25oC
Ratings
60
±20
168*
118*
120
672
872
7.0
231
1.54
TJ, TSTG
Operating and Storage Temperature Range
-55 to +175
TL
Maximum Lead Temperature for Soldering Purpose,
1/8” from Case for 5 Seconds
300
*Calculated continuous current based on maximum allowable junction temperature. Package limitation current is 120A.
Thermal Characteristics
Symbol
RθJC
RθJA
Parameter
Thermal Resistance, Junction to Case
Thermal Resistance, Junction to Ambient
Ratings
0.65
62.5
Units
V
V
A
A
mJ
V/ns
W
W/oC
oC
oC
Units
oC/W
©2009 Fairchild Semiconductor Corporation
FDI040N06 Rev. A
1
www.fairchildsemi.com

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Package Marking and Ordering Information
Device Marking
FDI038N06
Device
FDI038N06
Package
TO-262
Reel Size
Tube
Tape Width
-
Quantity
50
Electrical Characteristics TC = 25oC unless otherwise noted
Symbol
Parameter
Test Conditions
Min.
Off Characteristics
BVDSS
∆BVDSS
∆TJ
Drain to Source Breakdown Voltage
Breakdown Voltage Temperature
Coefficient
IDSS
Zero Gate Voltage Drain Current
IGSS
Gate to Body Leakage Current
ID = 250µA, VGS = 0V, TC= 25oC
ID = 250µA, Referenced to 25oC
VDS = 60V, VGS = 0V
VDS = 60V, VGS = 0V, TC = 150oC
VGS = ±20V, VDS = 0V
60
-
-
-
-
On Characteristics
VGS(th)
RDS(on)
gFS
Gate Threshold Voltage
Static Drain to Source On Resistance
Forward Transconductance
VGS = VDS, ID = 250µA
VGS = 10V, ID = 75A
VDS = 10V, ID = 75A
(Note 4)
2.5
-
-
Dynamic Characteristics
Ciss
Coss
Crss
Qg(tot)
Qgs
Qgd
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge at 10V
Gate to Source Gate Charge
Gate to Drain “Miller” Charge
VDS = 25V, VGS = 0V
f = 1MHz
VDS = 48V, ID = 75A
VGS = 10V
(Note 4, 5)
-
-
-
-
-
-
Switching Characteristics
td(on)
tr
td(off)
tf
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
VDD = 30V, ID = 75A
VGS = 10V, RGEN = 4.7Ω
(Note 4, 5)
-
-
-
-
Drain-Source Diode Characteristics
www.DataSheet4U.com
IS Maximum Continuous Drain to Source Diode Forward Current
ISM Maximum Pulsed Drain to Source Diode Forward Current
VSD
Drain to Source Diode Forward Voltage
VGS = 0V, ISD = 75A
trr Reverse Recovery Time
Qrr Reverse Recovery Charge
VGS = 0V, ISD = 75A
dIF/dt = 100A/µs
(Note 4)
-
-
-
-
-
Notes:
1: Repetitive Rating: Pulse width limited by maximum junction temperature
2: L = 0.31mH, IAS = 75A, VDD = 50V, RG = 25Ω, Starting TJ = 25°C
3: ISD ≤ 75A, di/dt ≤ 200A/µs, VDD ≤ BVDSS, Starting TJ = 25°C
4: Pulse Test: Pulse width ≤ 300µs, Duty Cycle ≤ 2%
5: Essentially Independent of Operating Temperature Typical Characteristics
Typ.
-
0.04
-
-
-
3.5
3.2
169
6190
900
385
102
32
32
30
40
55
24
-
-
-
41
47
Max. Units
-
-
1
500
±100
V
V/oC
µA
nA
4.5 V
4.0 mΩ
-S
8235
1195
580
133
-
-
pF
pF
pF
nC
nC
nC
70 ns
90 ns
120 ns
58 ns
168 A
672 A
1.3 V
- ns
- nC
FDI040N06 Rev. A
2 www.fairchildsemi.com

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Typical Performance Characteristics
Figure 1. On-Region Characteristics
1000
100
VGS = 15.0V
10.0V
8.0 V
7.0 V
6.5 V
6.0 V
5.5 V
10
1
0.1
0.01
*Notes:
1. 250µs Pulse Test
2. TC = 25oC
0.1 1
VDS,Drain-Source Voltage[V]
6
Figure 3. On-Resistance Variation vs.
Drain Current and Gate Voltage
4.0
Figure 2. Transfer Characteristics
1000
*Notes:
1. VDS = 10V
2. 250µs Pulse Test
100
175oC
25oC
10
-55oC
1
2345678
VGS,Gate-Source Voltage[V]
Figure 4. Body Diode Forward Voltage
Variation vs. Source Current
and Temperature
1000
3.5 VGS = 10V
3.0 VGS = 20V
www.DataSheet4U.c2o.5m
0
*Note: TC = 25oC
60 120 180 240 300 360
ID, Drain Current [A]
Figure 5. Capacitance Characteristics
10000
Ciss
1000
*Note:
1. VGS = 0V
2. f = 1MHz
Coss
Crss
Ciss = Cgs + Cgd (Cds = shorted)
Coss = Cds + Cgd
Crss = Cgd
100
0.1
1
10
VDS, Drain-Source Voltage [V]
30
175oC
100
25oC
10
*Notes:
1. VGS = 0V
2. 250µs Pulse Test
1
0.2 0.4 0.6 0.8 1.0 1.2
VSD, Body Diode Forward Voltage [V]
Figure 6. Gate Charge Characteristics
10
VDS = 12V
8 VDS = 30V
VDS = 48V
6
4
2
*Note: ID = 75A
0
0 20 40 60 80 100 120
Qg, Total Gate Charge [nC]
FDI040N06 Rev. A
3 www.fairchildsemi.com

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