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FDD5N53 PDF даташит
Спецификация FDD5N53 изготовлена «Fairchild Semiconductor» и имеет функцию, называемую «N-Channel MOSFET». |
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Детали детали
Номер произв | FDD5N53 |
Описание | N-Channel MOSFET |
Производители | Fairchild Semiconductor |
логотип | ![]() |
9 Pages

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FDD5N53/FDU5N53
N-Channel MOSFET
530V, 4A, 1.5Ω
Features
• RDS(on) = 1.25Ω ( Typ.)@ VGS = 10V, ID = 2A
• Low gate charge ( Typ. 11nC)
• Low Crss ( Typ. 5pF)
• Fast switching
• 100% avalanche tested
• Improved dv/dt capability
• RoHS compliant
January 2009
UniFETTM
tm
Description
These N-Channel enhancement mode power field effect
transistors are produced using Fairchild’s proprietary, planar
stripe, DMOS technology.
This advanced technology has been especially tailored to
minimize on-state resistance, provide superior switching
performance, and withstand high energy pluse in the avalanche
and commutation mode. These devices are well suited for high
efficient switched mode power suppliesand active power
factor correction.
D
D
G
S
D-PAK
FDD Series
G D S I-PAK
FDU Series
MOSFET Maximum Ratings TC = 25oC unless otherwise noted*
Symbol
VDSS
www.DataSVheGeStS4U.com
ID
IDM
EAS
IAR
EAR
dv/dt
PD
Parameter
Drain to Source Voltage
Gate to Source Voltage
Drain Current
Drain Current
-Continuous (TC = 25oC)
-Continuous (TC = 100oC)
- Pulsed
Single Pulsed Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Power Dissipation
(TC = 25oC)
- Derate above 25oC
TJ, TSTG
TL
Operating and Storage Temperature Range
Maximum Lead Temperature for Soldering Purpose,
1/8” from Case for 5 Seconds
(Note 1)
(Note 2)
(Note 1)
(Note 1)
(Note 3)
Thermal Characteristics
Symbol
RθJC
RθJA
Parameter
Thermal Resistance, Junction to Case
Thermal Resistance, Junction to Ambient
G
S
FDD5N53/FDU5N53
530
±30
4
2.4
16
256
4
4
4.5
40
0.3
-55 to +150
300
Ratings
1.4
110
Units
V
V
A
A
mJ
A
mJ
V/ns
W
W/oC
oC
oC
Units
oC/W
©2009 Fairchild Semiconductor Corporation
FDD5N53/FDU5N53 Rev. A
1
www.fairchildsemi.com

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Package Marking and Ordering Information TC = 25oC unless otherwise noted
Device Marking
FDD5N53
Device
FDD5N53TM
Package
D-PAK
Reel Size
380mm
Tape Width
16mm
FDD5N53
FDD5N53TF
D-PAK
380mm
16mm
FDU5N53
FDU5N53TU
I-PAK
-
-
Quantity
2500
2000
70
Electrical Characteristics
Symbol
Parameter
Test Conditions
Min.
Off Characteristics
BVDSS
ΔBVDSS
ΔTJ
Drain to Source Breakdown Voltage
Breakdown Voltage Temperature
Coefficient
IDSS Zero Gate Voltage Drain Current
IGSS
Gate to Body Leakage Current
ID = 250μA, VGS = 0V, TJ = 25oC
ID = 250μA, Referenced to 25oC
VDS = 530V, VGS = 0V
VDS = 424V, TC = 125oC
VGS = ±30V, VDS = 0V
530
-
-
-
-
On Characteristics
VGS(th)
RDS(on)
gFS
Gate Threshold Voltage
Static Drain to Source On Resistance
Forward Transconductance
VGS = VDS, ID = 250μA
VGS = 10V, ID = 2A
VDS = 40V, ID = 2A
(Note 4)
3.0
-
-
Dynamic Characteristics
Ciss
Coss
Crss
Qg(tot)
Qgs
Qgd
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge at 10V
Gate to Source Gate Charge
Gate to Drain “Miller” Charge
VDS = 25V, VGS = 0V
f = 1MHz
VDS = 400V, ID = 5A
VGS = 10V
(Note 4, 5)
-
-
-
-
-
-
Switching Characteristics
td(on)
tr
td(off)
www.DataSthf eet4U.com
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
VDD = 250V, ID = 5A
RG = 25Ω
(Note 4, 5)
-
-
-
-
Drain-Source Diode Characteristics
IS Maximum Continuous Drain to Source Diode Forward Current
ISM Maximum Pulsed Drain to Source Diode Forward Current
VSD
Drain to Source Diode Forward Voltage
VGS = 0V, ISD = 4A
trr Reverse Recovery Time
Qrr Reverse Recovery Charge
VGS = 0V, ISD = 5A
dIF/dt = 100A/μs
(Note 4)
-
-
-
-
-
Notes:
1: Repetitive Rating: Pulse width limited by maximum junction temperature
2: L = 32mH, IAS = 4A, VDD = 50V, RG = 25Ω, Starting TJ = 25°C
3: ISD ≤ 4A, di/dt ≤ 200A/μs, VDD ≤ BVDSS, Starting TJ = 25°C
4: Pulse Test: Pulse width ≤ 300μs, Duty Cycle ≤ 2%
5: Essentially Independent of Operating Temperature Typical Characteristics
Typ.
-
0.6
-
-
-
-
1.25
4.3
480
66
5
11
3
5
13
22
28
20
-
-
-
300
1.8
Max. Units
-
-
1
10
±100
V
V/oC
μA
nA
5.0 V
1.5 Ω
-S
640 pF
88 pF
8 pF
15 nC
- nC
- nC
36 ns
54 ns
66 ns
50 ns
4A
16 A
1.4 V
- ns
- μC
FDD5N53/FDU5N53 Rev. A
2 www.fairchildsemi.com

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Typical Performance Characteristics
Figure 1. On-Region Characteristics
20 VGS = 15.0V
10 10.0V
8.0 V
7.0 V
6.5 V
6.0 V
5.5 V
1
0.1
0.04
0.1
*Notes:
1. 250μs Pulse Test
2. TC = 25oC
1 10
VDS,Drain-Source Voltage[V]
30
Figure 3. On-Resistance Variation vs.
Drain Current and Gate Voltage
3.0
2.5
2.0 VGS = 10V
1.5 VGS = 20V
www.DataSheet4U.c1o.0m
0
*Note: TJ = 25oC
369
ID, Drain Current [A]
12
Figure 5. Capacitance Characteristics
1000
750
500
Ciss = Cgs + Cgd (Cds = shorted)
Coss = Cds + Cgd
Crss = Cgd
*Note:
1. VGS = 0V
2. f = 1MHz
Ciss
Coss
250
Crss
0
0.1 1 10
VDS, Drain-Source Voltage [V]
30
Figure 2. Transfer Characteristics
20
10
150oC
25oC
1
-55oC
0.1
4
*Notes:
1. VDS = 20V
2. 250μs Pulse Test
567
VGS,Gate-Source Voltage[V]
8
Figure 4. Body Diode Forward Voltage
Variation vs. Source Current
and Temperature
70
150oC
10
25oC
*Notes:
1. VGS = 0V
2. 250μs Pulse Test
1
0.4 0.8 1.2 1.6
VSD, Body Diode Forward Voltage [V]
Figure 6. Gate Charge Characteristics
10
VDS = 100V
VDS = 250V
8 VDS = 400V
6
4
2
*Note: ID = 5A
0
0 4 8 12
Qg, Total Gate Charge [nC]
FDD5N53/FDU5N53 Rev. A
3 www.fairchildsemi.com

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