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FCPF9N60NT PDF даташит
Спецификация FCPF9N60NT изготовлена «Fairchild Semiconductor» и имеет функцию, называемую «N-Channel MOSFET». |
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Детали детали
Номер произв | FCPF9N60NT |
Описание | N-Channel MOSFET |
Производители | Fairchild Semiconductor |
логотип | ![]() |
10 Pages

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FCP9N60N / FCPF9N60NT
N-Channel MOSFET
600V, 9A, 0.385Ω
Features
• RDS(on) = 0.33Ω ( Typ.)@ VGS = 10V, ID = 4.5A
• Ultra low gate charge ( Typ. Qg = 22nC)
• Low effective output capacitance
• 100% avalanche tested
• RoHS compliant
August 2009
SupreMOSTM
tm
Description
The SupreMOS MOSFET, Fairchild’s next generation of high
voltage super-junction MOSFETs, employs a deep trench filling
process that differentiates it from preceding multi-epi based
technologies. By utilizing this advanced technology and precise
process control, SupreMOS provides world class Rsp, superior
switching performance and ruggedness.
This SupreMOS MOSFET fits the industry’s AC-DC SMPS
requirements for PFC, server/telecom power, FPD TV power,
ATX power, and industrial power applications.
D
GDS
TO-220
FCP Series
GD S
TO-220F
FCPF Series
G
S
MOSFET Maximum Ratings TC = 25oC unless otherwise noted*
Symbol
VDSS
www.DataSVheGeStS4U.com
ID
IDM
EAS
IAR
EAR
dv/dt
PD
Parameter
Drain to Source Voltage
Gate to Source Voltage
Drain Current
Drain Current
-Continuous (TC = 25oC)
-Continuous (TC = 100oC)
- Pulsed
Single Pulsed Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
MOSFET dv/dt Ruggedness
Peak Diode Recovery dv/dt
Power Dissipation
(TC = 25oC)
- Derate above 25oC
TJ, TSTG
TL
Operating and Storage Temperature Range
Maximum Lead Temperature for Soldering Purpose,
1/8” from Case for 5 Seconds
*Drain current limited by maximum junction temperature
Thermal Characteristics
(Note 1)
(Note 2)
(Note 3)
FCP9N60N FCPF9N60NT
600
±30
9.0 9.0*
5.7 5.7*
27 27*
135
3
0.83
100
20
83.3 29.8
0.67 0.24
-55 to +150
300
Symbol
RθJC
RθCS
RθJA
Parameter
Thermal Resistance, Junction to Case
Thermal Resistance, Case to Heat Sink (Typical)
Thermal Resistance, Junction to Ambient
FCP9N60N
1.5
0.5
62.5
FCPF9N60NT
4.2
0.5
62.5
Units
V
V
A
A
mJ
A
mJ
V/ns
V/ns
W
W/oC
oC
oC
Units
oC/W
©2009 Fairchild Semiconductor Corporation
FCP9N60N / FCPF9N60NT Rev. A
1
www.fairchildsemi.com

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Package Marking and Ordering Information
Device Marking
FCP9N60N
FCPF9N60NT
Device
FCP9N60N
FCPF9N60NT
Package
TO-220
TO-220F
Reel Size
-
-
Tape Width
-
-
Electrical Characteristics TC = 25oC unless otherwise noted
Symbol
Parameter
Test Conditions
Off Characteristics
BVDSS
ΔBVDSS
ΔTJ
Drain to Source Breakdown Voltage
Breakdown Voltage Temperature
Coefficient
IDSS Zero Gate Voltage Drain Current
IGSS
Gate to Body Leakage Current
ID = 1mA, VGS = 0V, TC = 25oC
ID = 1mA, Referenced to 25oC
VDS = 480V, VGS = 0V
VDS = 480V, VGS = 0V, TC = 125oC
VGS = ±30V, VDS = 0V
On Characteristics
VGS(th)
RDS(on)
gFS
Gate Threshold Voltage
Static Drain to Source On Resistance
Forward Transconductance
VGS = VDS, ID = 250μA
VGS = 10V, ID = 4.5A
VDS = 40V, ID = 4.5A
Dynamic Characteristics
Ciss
Coss
Crss
Coss
Cosseff.
Qg(tot)
Qgs
Qgd
ESR
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Output Capacitance
Effective Output Capacitance
Total Gate Charge at 10V
Gate to Source Gate Charge
Gate to Drain “Miller” Charge
Equivalent Series Resistance (G-S)
VDS = 100V, VGS = 0V
f = 1MHz
VDS = 380V, VGS = 0V, f = 1MHz
VDS = 0V to 480V, VGS = 0V
VDS = 380V, ID = 4.5A,
VGS = 10V
Drain Open
(Note 4)
Min.
600
-
-
-
-
2.0
-
-
-
-
-
-
-
-
-
-
Switching Characteristics
td(on)
www.DataSthr eet4U.com
td(off)
tf
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
VDD = 380V, ID = 4.5A
RG = 4.7Ω
Drain-Source Diode Characteristics
IS Maximum Continuous Drain to Source Diode Forward Current
ISM Maximum Pulsed Drain to Source Diode Forward Current
VSD
Drain to Source Diode Forward Voltage
VGS = 0V, ISD = 4.5A
trr Reverse Recovery Time
Qrr Reverse Recovery Charge
VGS = 0V, ISD = 4.5A
dIF/dt = 100A/μs
(Note 4)
-
-
-
-
-
-
-
-
-
Typ.
-
0.72
-
-
-
-
0.33
7.5
930
35
2
20
106
22.0
4.1
7.1
2.9
12.7
8.7
36.9
10.2
-
-
-
213
2.2
Quantity
50
50
Max. Units
-
-
10
100
±100
V
V/oC
μA
nA
4.0
0.385
-
V
Ω
S
1240
50
4
-
-
29
-
-
pF
pF
pF
pF
pF
nC
nC
nC
Ω
35.4
27.4
83.8
30.4
ns
ns
ns
ns
9.0 A
27 A
1.2 V
- ns
- μC
Notes:
1. Repetitive Rating: Pulse width limited by maximum junction temperature
2. IAS = 3A, RG = 25Ω, Starting TJ = 25°C
3. ISD ≤ 9A, di/dt ≤ 200A/μs, VDD = 380V, Starting TJ = 25°C
4. Essentially Independent of Operating Temperature Typical Characteristics
FCP9N60N / FCPF9N60NT Rev. A
2
www.fairchildsemi.com

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Typical Performance Characteristics
Figure 1. On-Region Characteristics
100
VGS = 15.0 V
10.0 V
8.0 V
7.0 V
6.5 V
10 6.0 V
5.5 V
5.0 V
1
0.1
0.1
*Notes:
1. 250μs Pulse Test
2. TC = 25oC
1 10 20
VDS, Drain-Source Voltage[V]
Figure 3. On-Resistance Variation vs.
Drain Current and Gate Voltage
1.2
1.0
0.8
0.6 VGS = 10V
VGS = 20V
0.4
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0.2
0
*Notes: TC = 25oC
5 10 15 20 25
ID, Drain Current [A]
Figure 5. Capacitance Characteristics
5000
4000
Ciss = Cgs + Cgd (Cds = shorted)
Coss = Cds + Cgd
Crss = Cgd
3000
Coss
*Notes:
1. VGS = 0V
2. f = 1MHz
2000
1000
0
0.1
Ciss
Crss
1 10 100
VDS, Drain-Source Voltage [V]
600
Figure 2. Transfer Characteristics
60
10
150oC
25oC
-55oC
1
0.1
2
*Notes:
1. VDS = 20V
2. 250μs Pulse Test
46
VGS, Gate-Source Voltage[V]
8
Figure 4. Body Diode Forward Voltage
Variation vs. Source Current
and Temperature
100
150oC
25oC
10
*Notes:
1. VGS = 0V
1 2. 250μs Pulse Test
0.4 0.6 0.8 1.0 1.2 1.4
VSD, Body Diode Forward Voltage [V]
Figure 6. Gate Charge Characteristics
10
VDS = 120V
8
VDS = 300V
VDS = 480V
6
4
2
0 *Notes: ID = 4.5A
0 5 10 15 20 25
Qg, Total Gate Charge [nC]
FCP9N60N / FCPF9N60NT Rev. A
3
www.fairchildsemi.com

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