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FCA35N60 PDF даташит
Спецификация FCA35N60 изготовлена «Fairchild Semiconductor» и имеет функцию, называемую «600V N-Channel MOSFET». |
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Детали детали
Номер произв | FCA35N60 |
Описание | 600V N-Channel MOSFET |
Производители | Fairchild Semiconductor |
логотип | ![]() |
8 Pages

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FCA35N60
600V N-Channel MOSFET
Features
• 650V @ TJ = 150°C
• Typ.RDS(on) = 0.079Ω
• Ultra low gate charge ( Typ. Qg = 139nC )
• Low effective output capacitance ( Typ. Coss.eff = 340pF )
• 100% avalanche tested
March 2009
SuperFETTM
Description
SuperFETTM is Farichild’s proprietary, new generation of high
voltage MOSFET family that is utilizing an advanced charge bal-
ance mechanism for outstanding low on-resistance and lower
gate charge performance.
This advanced technology has been tailored to minimize
conduction loss, provide superior switching performance, and
withstand extreme dv/dt rate and higher avalanche energy.
Consequently, SuperFET is very suitable for various AC/DC
power conversion in switching mode operation for system
miniaturization and higher efficiency.
D
G DS
TO-3PN
MOSFET Maximum Ratings TC = 25oC unless otherwise noted*
Symbol
VDSS
www.DataSVheGeStS4U.com
ID
IDM
EAS
IAR
EAR
dv/dt
PD
Parameter
Drain to Source Voltage
Gate-Soure voltage
Drain Current
Drain Current
-Continuous (TC = 25oC)
-Continuous (TC = 100oC)
- Pulsed
Single Pulsed Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Power Dissipation
(TC = 25oC)
- Derate above 25oC
TJ, TSTG
Operating and Storage Temperature Range
TL
Maximum Lead Temperature for Soldering Purpose,
1/8” from Case for 5 Seconds
*Drain current limited by maximum junction temperature
Thermal Characteristics
Symbol
RθJC
RθCS
RθJA
Parameter
Thermal Resistance, Junction to Case
Thermal Resistance, Case-to-Heat Sink
Thermal Resistance, Junction to Ambient
G
(Note 1)
(Note 2)
(Note 1)
(Note 1)
(Note 3)
S
Ratings
600
±30
35
22.2
105
1455
35
31.25
20
312.5
2.5
-55 to +150
300
Typ.
-
0.24
-
Max.
0.4
-
42
Units
V
V
A
A
mJ
A
mJ
V/ns
W
W/oC
oC
oC
Units
oC/W
©2009 Fairchild Semiconductor Corporation
FCA35N60 Rev. A
1
www.fairchildsemi.com

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Package Marking and Ordering Information TC = 25oC unless otherwise noted
Device Marking
FCA35N60
Device
FCA35N60
Package
TO-3PN
Reel Size
-
Tape Width
-
Quantity
30
Electrical Characteristics
Symbol
Parameter
Off Characteristics
BVDSS
∆BVDSS
/ ∆TJ
BVDS
Drain to Source Breakdown Voltage
Breakdown Voltage Temperature
Coefficient
Drain-Source Avalanche Breakdown
Voltage
IDSS
IGSS
Zero Gate Voltage Drain Current
Gate to Body Leakage Current
On Characteristics
VGS(th)
RDS(on)
gFS
Gate Threshold Voltage
Static Drain to Source On Resistance
Forward Transconductance
Dynamic Characteristics
Ciss
Coss
Crss
Coss
Coss eff.
Qg
Qgs
Qgd
ESR
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Output Capacitance
Effective Output Capacitance
Total Gate Charge at 10V
Gate to Source Gate Charge
Gate to Drain “Miller” Charge
Equivalent Series Resistance (G-S)
Test Conditions
Min.
ID = 250µA, VGS = 0V, TJ = 25oC
ID = 250µA, VGS = 0V, TJ = 150oC
ID = 250µA, Referenced to 25oC
VGS = 0V, ID = 16A
VDS = 600V, VGS = 0V
VDS = 480V, TC = 125oC
VGS = ±30V, VDS = 0V
600
-
-
-
-
-
-
VGS = VDS, ID = 250µA
VGS = 10V, ID = 17.5A
VDS = 40V, ID = 17.5A
3.0
-
-
VDS = 25V, VGS = 0V
f = 1MHz
VDS = 480V, VGS = 0V, f = 1.0MHz
VDS = 0V to 480V, VGS = 0V
VDS = 480V, ID = 35A
VGS = 10V
Drain Open, F= 1MHZ
(Note 4)
-
-
-
-
-
-
-
-
-
www.DataSShweeitt4cUh.cinomg Characteristics
td(on)
Turn-On Delay Time
tr Turn-On Rise Time
td(off)
Turn-Off Delay Time
tf Turn-Off Fall Time
VDD = 300V, ID = 35A
RG = 4.7Ω
Drain-Source Diode Characteristics
IS Maximum Continuous Drain to Source Diode Forward Current
ISM Maximum Pulsed Drain to Source Diode Forward Current
VSD
Drain to Source Diode Forward Voltage
VGS = 0V, ISD = 35A
trr Reverse Recovery Time
Qrr Reverse Recovery Charge
VGS = 0V, ISD = 35A
dIF/dt = 100A/µs
(Note 4)
-
-
-
-
-
-
-
-
-
Notes:
1: Repetitive Rating: Pulse width limited by maximum junction temperature
2: IAS = 17.5A, VDD = 50V, RG = 25Ω, Starting TJ = 25°C
3: ISD ≤ 35A, di/dt ≤ 200A/µs, VDD ≤ BVDSS, Starting TJ = 25°C
4: Essentially Independent of Operating Temperature Typical Characteristics
Typ. Max. Units
- -V
650 - V
0.6 - V/oC
700 - V
-
-
1
10
µA
- ±100 nA
-
0.079
28.8
5.0
0.098
-
V
Ω
S
4990
2380
140
113
340
139
31
69
1.4
6640
3170
-
-
-
181
-
-
-
pF
pF
pF
pF
pF
nC
nC
nC
Ω
34 78 ns
120 250 ns
105 220 ns
73 155 ns
- 35 A
- 105 A
- 1.4 V
614 - ns
16.3 - µC
FCA35N60 Rev. A
2 www.fairchildsemi.com

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Typical Performance Characteristics
Figure 1. On-Region Characteristics
200
VGS = 15.0 V
100 10.0 V
8.0 V
7.0 V
6.5 V
6.0 V
5.5 V
10
1
0.3
0.1
*Notes:
1. 250µs Pulse Test
2. TC = 25oC
1 10 20
VDS, Drain-Source Voltage[V]
Figure 3. On-Resistance Variation vs.
Drain Current and Gate Voltage
0.24
0.20
0.16
0.12
0.08
www.DataSheet4U.co0.m04
0
VGS = 10V
VGS = 20V
*Note: TC = 25oC
25 50 75 100
ID, Drain Current [A]
125
Figure 5. Capacitance Characteristics
50000
10000
Ciss
1000
*Note:
1. VGS = 0V
100 2. f = 1MHz
Ciss = Cgs + Cgd (Cds = shorted)
Coss = Cds + Cgd
Crss = Cgd
10
0.1 1
10 100
VDS, Drain-Source Voltage [V]
Coss
Crss
600
Figure 2. Transfer Characteristics
200
100
150oC
10
-55oC
25oC
*Notes:
1. VDS = 20V
2. 250µs Pulse Test
1
456789
VGS, Gate-Source Voltage[V]
Figure 4. Body Diode Forward Voltage
Variation vs. Source Current
and Temperature
500
100
150oC
25oC
10
*Notes:
1. VGS = 0V
1
0.2 0.4
2. 250µs Pulse Test
0.8 1.2 1.6
VSD, Body Diode Forward Voltage [V]
Figure 6. Gate Charge Characteristics
10
VDS = 100V
VDS = 250V
8 VDS = 400V
6
4
2
0 *Note: ID = 35A
0 40 80 120 160
Qg, Total Gate Charge [nC]
FCA35N60 Rev. A
3 www.fairchildsemi.com

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