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PDF TPCF8B01 Data sheet ( Hoja de datos )

Número de pieza TPCF8B01
Descripción Multi-Chip Device Silicon P Channel MOS Type
Fabricantes Toshiba Semiconductor 
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TPCF8B01
TOSHIBA Multi-Chip Device Silicon P Channel MOS Type (U-MOS III) / Schottky Barrier Diode
TPCF8B01
Notebook PC Applications
Portable Equipment Applications
Unit: mm
Low drain-source ON resistance: RDS (ON) = 72 mÙ (typ.)
High forward transfer admittance: |Yfs| = 4.7 S (typ.)
Low leakage current: IDSS = 10 ìA (max) (VDS = 20 V)
Enhancement-model: Vth = 0.5 to 1.2 V(VDS =10 V, ID = 200 ìA)
Low forward voltage: VFM = 0.46V(typ.)
Maximum Ratings
MOSFET (Ta = 25°C)
Characteristics
Drain-source voltage
Drain-gate voltage (RGS = 20 k)
Gate-source voltage
Drain current
DC
Pulse
(Note 1)
(Note 1)
Single pulse avalanche energy (Note 4)
Avalanche current
Repetitive avalanche energy
Single-device value at dual operation
(Note 2a, 3b, 5)
Symbol
VDSS
VDGR
VGSS
ID
IDP
EAS
IAR
EAR
SBD (Ta = 25°C)
Characteristics
Repetitive peak reverse voltage
Average forward current (Note 2a, 6)
Peak one cycle surge forward current
(non-repetitive)
Symbol
VRRM
IF(AV)
IFSM
Rating
20
20
±8
2.7
10.8
1.2
1.35
0.11
Unit
V
V
V
A
mJ
A
mJ
Rating
20
1.0
7(50Hz)
Unit
V
A
A
1. Anode
2. Anode
3.Source
4. Gate
5. Drain
6. Drain
7. Cathode
8. Cathode
JEDEC
JEITA
TOSHIBA
Weight: 0.011 g (typ.)
Circuit Configuration
87 6 5
Maximum Ratings for MOSFET and SBD (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Single-device operation
Drain power
(Note 3a)
dissipation
(t = 5 s) (Note 2a) Single-device value at
dual operation (Note 3b)
Single-device operation
Drain power
(Note 3a)
dissipation
(t = 5 s) (Note 2b) Single-device value at
dual operation (Note 3b)
Channel temperature
Storage temperature range
PD (1)
PD (2)
PD (1)
PD (2)
Tch
Tstg
1.35
1.12
0.53
0.33
150
55~150
W
°C
°C
12 3 4
Marking (Note 7)
85
F8A
14
Note: For (Note 1), (Note 2), (Note 3), (Note 4), (Note 5), (Note 6) and (Note 7), please refer to the next page.
1 2003-04-08

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