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HSMN-C150 PDF даташит

Спецификация HSMN-C150 изготовлена ​​​​«Agilent Technologies» и имеет функцию, называемую «(HSMx-C110/170/190/191/150) SMT Chip LED».

Детали детали

Номер произв HSMN-C150
Описание (HSMx-C110/170/190/191/150) SMT Chip LED
Производители Agilent Technologies
логотип Agilent Technologies логотип 

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HSMN-C150 Даташит, Описание, Даташиты
www.DataSheet4U.comACSDa1Mg7tialT0e,SCnChthe1Hi9ep0StL,MECDM1s9/1Me, aNtn-4dCC1U1105,0.comDescription
These small chip-type LEDs utilize
ehigh efficient InGaN/SiC material to
deliver competitively priced high
hperformance blue and green. These
S525 nm green and 470 nm blue are
unique hues which provide color
tadifferentiation to a product.
These ChipLEDs come in either top
aemitting packages (HSMx-C170,
C190, C191, and C150) or in a side
.Demitting package (HSMx-C110).
The side emitting package is
especially suitable for LCD
backlighting application. The top
emitting packages with their wide
viewing angle are suitable for
direct backlighting application or
being used with light pipes. In
order to facilitate pick and place
operation, these ChipLEDs are
shipped in tape and reel with 4000
units per reel for HSMx-C170,
C190, and C191 packages, and
3000 units per reel for
HSMx-C110 and C150 packages.
All packages are compatible with
IR soldering and binned by both
color and intensity.
Features
• High brightness
• Small size
• Industrial standard footprint
• Diffused optics
• Top emitting or right angle
emitting
• Compatible with IR soldering
• Compatible for use with light
piping
• Available in 8 mm tape on
7" diameter reel
• Reel sealed in zip locked moisture
barrier bags
Applications
• LCD backlighting
• Pushbutton backlighting
• Front panel indicator
• Symbol indicator
• Microdisplays
• Small message panel signage
wwDevice Selection Guide
mPackage Dimension (mm) [1], [2]
Ingan Green
Ingan Blue
w o1.6 (L) x 0.8 (W) x 0.6 (H)
HSMM-C191
HSMN-C191
.c1.6 (L) x 0.8 (W) x 0.8 (H)
HSMM-C190
HSMN-C190
t4U2.0 (L) x 1.25 (W) x 0.8 (H)
HSMM-C170
HSMN-C170
e3.2 (L) x 1.0 (W) x 1.5 (H)
HSMM-C110
HSMN-C110
he3.2 (L) x 1.6 (W) x 1.1 (H)
HSMM-C150
HSMN-C150
SNotes: 1. Dimensions in mm. 2. Tolerance ± 0.1 mm unless otherwise noted.
Package Description
Untinted, Diffused
Untinted, Diffused
Untinted, Diffused
Untinted, Nondiffused
Untinted, Diffused
ataCAUTION: HSMM-C1xx and HSMN-C1xx are Class 1 ESD sensitive per MIL-STD-1686. Please observe appropriate
www.Dprecautions during handling and processing. Refer to Agilent Technologies Application Note AN-1142 for additional details.









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HSMN-C150 Даташит, Описание, Даташиты
Package Dimensions
LED DIE
CATHODE
MARK
1.0 (0.039)
CLEAR
EPOXY
PC BOARD
0.9 (0.035)
2.6 (0.102 )
3.2 (0.126 )
POLARITY
1.5 (0.059)
1.6 (0.063 )
3.2 (0.126 )
3.2 (0.126 )
0.5 (0.020)
1.0 (0.039)
SOLDERING
TERMINAL
HSMx-C110
CATHODE LINE
LED DIE
CATHODE
MARK
1.25 (0.049)
2.0 (0.079 )
0.62 (0.024)
DIFFUSED
EPOXY
0.3 (0.012)
PC BOARD
1.4
(0.055)
CATHODE LINE
0.4 ± 0.15
(0.016 ± 0.006)
POLARITY
0.8 (0.031)
0.3 (0.012)
0.4 ± 0.15
(0.016 ± 0.006)
SOLDERING
TERMINAL
HSMx-C170
LED DIE
CATHODE
MARK
1.6
(0.063 )
0.8 (0.031)
0.4 (0.016)
0.3 (0.012)
DIFFUSED EPOXY
1.0
(0.039)
POLARITY
PC BOARD
CATHODE LINE
0.3 ± 0.15
(0.012 ± 0.006)
0.8 (0.031)
0.3 (0.012)
0.3 ± 0.15
(0.012 ± 0.006)
0.7 (0.028) MIN.
SOLDERING
TERMINAL
HSMx-C190
2
LED DIE
CATHODE
MARK
1.6
(0.063 )
0.8 (0.031)
0.4 (0.016)
0.3 (0.012)
1.0
(0.039)
POLARITY
DIFFUSED EPOXY
PC BOARD
CATHODE LINE
0.3 ± 0.15
(0.012 ± 0.006)
0.6 (0.023)
0.3 (0.012)
0.3 ± 0.15
(0.012 ± 0.006)
0.7 (0.028) MIN.
SOLDERING
TERMINAL
HSMx-C191









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HSMN-C150 Даташит, Описание, Даташиты
Package Dimensions, continued
LED DIE
CATHODE
MARK
3.2 (0.126 )
DIFFUSED
EPOXY
0.6 (0.024)
2.0 (0.079)
PC BOARD
CATHODE LINE
0.50 ± 0.2
(0.020 ± 0.008)
1.6 (0.063)
0.8 (0.031)
POLARITY
1.1 (0.043)
0.5 (0.020)
0.50 ± 0.2
(0.020 ± 0.008)
SOLDERING
TERMINAL
HSMx-C150
NOTES:
1. All dimensions in millimeters (inches).
2. Tolerance is ± 0.1 mm (± 0.004 in.) unless otherwise specified.
Absolute Maximum Ratings at TA = 25˚C
Parameter
DC Forward Current [1]
Power Dissipation
Reverse Voltage (IR = 100 µA)
Led Junction Temperature
Operating Temperature Range
Storage Temperature Range
Soldering Temperature
Note:
1. Derate linearly as shown in Figure 4.
HSMM-C110/C170/C190/C191/C150
HSMN-C110/C170/C190/C191/C150
20
78
5
95
–30 to +85
–40 to +85
See IR soldering profile (Figure 7)
Units
mA
mW
V
˚C
˚C
˚C
Electrical Characteristics at TA = 25˚C
Part Number
Forward Voltage
VF (Volts)
@ IF = 20 mA
Typ. Max.
HSMM-C110/C150
3.3 3.9
HSMN-C110/C150
3.3 3.9
HSMM-C170/C190/C191 3.3
3.9
HSMN-C170/C190/C191 3.3
3.9
VF Tolerance: ±0.1 V.
3
Reverse Breakdown
VR (Volts)
@ IR = 100 µA
Min.
5
5
5
5
Capacitance C
(pF), VF = 0,
f = 1 MHz
Typ.
70
70
70
70
Thermal
Resistance
RθJ–PIN (˚C/W)
Typ.
450
450
300
300










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HSMN-C150(HSMx-C110/170/190/191/150) SMT Chip LEDAgilent Technologies
Agilent Technologies

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