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PDF 74F574PC Data sheet ( Hoja de datos )

Número de pieza 74F574PC
Descripción Octal D-Type Flip-Flop with TRI-STATE Outputs
Fabricantes National 
Logotipo National Logotipo



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No Preview Available ! 74F574PC Hoja de datos, Descripción, Manual

May 1995
54F 74F574
Octal D-Type Flip-Flop with TRI-STATE Outputs
General Description
The ’F574 is a high-speed low power octal flip-flop with a
buffered common Clock (CP) and a buffered common Out-
put Enable (OE) The information presented to the D inputs
is stored in the flip-flops on the LOW-to-HIGH Clock (CP)
transition
This device is functionally identical to the ’F374 except for
the pinouts
Features
Y Inputs and outputs on opposite sides of package
allowing easy interface with microprocessors
Y Useful as input or output port for microprocessors
Y Functionally identical to ’F374
Y TRI-STATE outputs for bus-oriented applications
Commercial
74F574PC
74F574SC (Note 1)
74F574SJ (Note 1)
Military
54F574DM (Note 2)
54F574FM (Note 2)
54F574LM (Note 2)
Package
Number
N20A
J20A
M20B
M20D
W20A
E20A
Package Description
20-Lead (0 300 Wide) Molded Dual-In-Line
20-Lead Ceramic Dual-In-Line
20-Lead (0 300 Wide) Molded Small Outline JEDEC
20-Lead (0 300 Wide) Molded Small Outline EIAJ
20-Lead Cerpack
20-Lead Ceramic Leadless Chip Carrier Type C
Note 1 Devices also available in 13 reel Use suffix e SCX and SJX
Note 2 Military grade device with environmental and burn-in processing Use suffix e DMQB FMQB and LMQB
Logic Symbols
IEEE IEC
TL F 9567 – 1
Unit Loading Fan Out
Pin Names
D0 – D7
CP
OE
O0 – O7
Description
Data Inputs
Clock Pulse Input (Active LOW)
TRI-STATE Output Enable Input (Active LOW)
TRI-STATE Outputs
54F 74F
UL
HIGH LOW
10 10
10 10
10 10
150 40 (33 3)
Input IIH IIL
Output IOH IOL
20 mA b0 6 mA
20 mA b0 6 mA
20 mA b0 6 mA
b3 mA 24 mA (20 mA)
TL F 9567 – 4
TRI-STATE is a registered trademark of National Semiconductor Corporation
C1995 National Semiconductor Corporation TL F 9567
RRD-B30M75 Printed in U S A

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74F574PC pdf
Ordering Information
The device number is used to form part of a simplified purchasing code where the package type and temperature range are
defined as follows
74F 574 S C X
Temperature Range Family
74FeCommercial
54FeMilitary
Device Type
Package Code
P e Plastic DIP
D e Ceramic DIP
F e Flatpak
L e Leadless Chip Carrier (LCC)
S e Small Outline JEDEC
SJ e Small Outline SOIC EIAJ
Special Variations
QB e Military grade device with
environmental and burn-in
processing
Temperature Range
CeCommercial (0 C to a70 C)
MeMilitary (b55 C to a125 C)
Physical Dimensions inches (millimeters)
20-Lead Ceramic Leadless Chip Carrier (L)
NS Package Number E20A
5

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