|
|
PDF MMBZ5V6ALT1 Data sheet ( Hoja de datos )
| Número de pieza | MMBZ5V6ALT1 | |
| Descripción | SOT-23 COMMON ANODE DUAL ZENER OVERVOLTAGE TRANSIENT SUPPRESSORS 24 & 40 WATTS PEAK POWER | |
| Fabricantes | Motorola Semiconductors | |
| Logotipo |  |
|
Hay una vista previa y un enlace de descarga de MMBZ5V6ALT1 (archivo pdf) en la parte inferior de esta página. Total 6 Páginas | ||
|
No Preview Available !
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Order this document
by MMBZ5V6ALT1/D
5DA.nu6oa,dl6eM.2oZ1ne5onle&itrhs2ic0 CVoolmt mSOonT-23
Transient Voltage Suppressors
for ESD Protection
These dual monolithic silicon zener diodes are designed for applications
requiring transient overvoltage protection capability. They are intended for use
in voltage and ESD sensitive equipment such as computers, printers, business
machines, communication systems, medical equipment and other applications.
Their dual junction common anode design protects two separate lines using
only one package. These devices are ideal for situations where board space is
at a premium.
Specification Features:
• SOT–23 Package Allows Either Two Separate Unidirectional
Configurations or a Single Bidirectional Configuration
• Peak Power — 24 or 40 Watts @ 1.0 ms (Unidirectional),
per Figure 5 Waveform
• Maximum Clamping Voltage @ Peak Pulse Current
• Low Leakage < 5.0 µA
• ESD Rating of Class N (exceeding 16 kV) per the Human Body Model
Mechanical Characteristics:
• Void Free, Transfer–Molded, Thermosetting Plastic Case
• Corrosion Resistant Finish, Easily Solderable
• Package Designed for Optimal Automated Board Assembly
• Small Package Size for High Density Applications
• Available in 8 mm Tape and Reel
Use the Device Number to order the 7 inch/3,000 unit reel. Replace
the “T1” with “T3” in the Device Number to order the 13 inch/10,000 unit reel.
MMMMMMMMBBBBZZZZ5612VV50VV62AAAALLLLTTTT1111*
Motorola Preferred Devices
SOT–23 COMMON ANODE DUAL
ZENER OVERVOLTAGE
TRANSIENT SUPPRESSORS
24 & 40 WATTS
PEAK POWER
3
1
2
CASE 318–08
STYLE 12
LOW PROFILE SOT–23
PLASTIC
1
3
2
PIN 1. CATHODE
2. CATHODE
3. ANODE
THERMAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic
Symbol
Peak Power Dissipation @ 1.0 ms (1)
@ TA ≤ 25°C
MMBZ5V6ALT1, MMBZ6V2ALT1
MMBZ15VALT1, MMBZ20VALT1
Total Power Dissipation on FR–5 Board (2) @ TA = 25°C
Derate above 25°C
Ppk
°PD°
Thermal Resistance Junction to Ambient
Total Power Dissipation on Alumina Substrate (3) @ TA = 25°C
Derate above 25°C
RθJA
°PD°
Thermal Resistance Junction to Ambient
Junction and Storage Temperature Range
Lead Solder Temperature — Maximum (10 Second Duration)
(1) Non–repetitive current pulse per Figure 5 and derate above TA = 25°C per Figure 6.
(2) FR–5 = 1.0 x 0.75 x 0.62 in.
(3) Alumina = 0.4 x 0.3 x 0.024 in., 99.5% alumina
*Other voltages may be available upon request
Thermal Clad is a trademark of the Bergquist Company
Preferred devices are Motorola recommended choices for future use and best overall value.
RθJA
TJ
Tstg
TL
Value
24
40
225
1.8
556
300
2.4
417
– 55 to +150
260
Unit
Watts
°mW°
mW/°C
°C/W
°mW
mW/°C
°C/W
°C
°C
Rev 1
©MMMotBorZol5a,VIn6cA. 1L9T961 MMBZ6V2ALT1 MMBZ15VALT1 MMBZ20VALT1
MOTOROLA
1
1 page  
INFORMATION FOR USING THE SOT–23 SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor packages must
be the correct size to insure proper solder connection
interface between the board and the package. With the
correct pad geometry, the packages will self align when
subjected to a solder reflow process.
0.037
0.95
0.037
0.95
0.035
0.9
0.079
2.0
0.031
0.8
inches
mm
SOT–23
SOT–23 POWER DISSIPATION
The power dissipation of the SOT–23 is a function of the
drain pad size. This can vary from the minimum pad size for
soldering to a pad size given for maximum power dissipation.
Power dissipation for a surface mount device is determined
by TJ(max), the maximum rated junction temperature of the
die, RθJA, the thermal resistance from the device junction to
ambient, and the operating temperature, TA. Using the
values provided on the data sheet for the SOT–23 package,
PD can be calculated as follows:
PD =
TJ(max) – TA
RθJA
The values for the equation are found in the maximum
ratings table on the data sheet. Substituting these values into
the equation for an ambient temperature TA of 25°C, one can
calculate the power dissipation of the device which in this
case is 225 milliwatts.
PD =
150°C – 25°C
556°C/W
= 225 milliwatts
The 556°C/W for the SOT–23 package assumes the use
of the recommended footprint on a glass epoxy printed circuit
board to achieve a power dissipation of 225 milliwatts. There
are other alternatives to achieving higher power dissipation
from the SOT–23 package. Another alternative would be to
use a ceramic substrate or an aluminum core board such as
Thermal Clad™. Using a board material such as Thermal
Clad, an aluminum core board, the power dissipation can be
doubled using the same footprint.
SOLDERING PRECAUTIONS
The melting temperature of solder is higher than the rated
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within a
short time could result in device failure. Therefore, the
following items should always be observed in order to
minimize the thermal stress to which the devices are
subjected.
• Always preheat the device.
• The delta temperature between the preheat and soldering
should be 100°C or less.*
• When preheating and soldering, the temperature of the
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering method,
the difference shall be a maximum of 10°C.
• The soldering temperature and time shall not exceed
260°C for more than 10 seconds.
• When shifting from preheating to soldering, the maximum
temperature gradient shall be 5°C or less.
• After soldering has been completed, the device should be
allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and result
in latent failure due to mechanical stress.
• Mechanical stress or shock should not be applied during
cooling.
* Soldering a device without preheating can cause excessive
thermal shock and stress which can result in damage to the
device.
MMBZ5V6ALT1 MMBZ6V2ALT1 MMBZ15VALT1 MMBZ20VALT1
MOTOROLA
5
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet MMBZ5V6ALT1.PDF ] | |
Hoja de datos destacado
| Número de pieza | Descripción | Fabricantes |
| MMBZ5V6ALT1 | SOT-23 COMMON ANODE DUAL ZENER OVERVOLTAGE TRANSIENT SUPPRESSORS 24 & 40 WATTS PEAK POWER | Motorola Semiconductors |
| MMBZ5V6ALT1 | 24 and 40 Watt Peak Power Zener Transient Voltage Suppressors |  ON |
| MMBZ5V6ALT1G | 24 and 40 Watt Peak Power Zener Transient Voltage Suppressors | ON |
| MMBZ5V6ALT1G | (MMBZxxxALT1G) 24 and 40 Watt Peak Power Zener Transient Voltage Suppressors |  ON Semiconductor |
| Número de pieza | Descripción | Fabricantes |
| SLA6805M | High Voltage 3 phase Motor Driver IC. |
 Sanken |
| SDC1742 | 12- and 14-Bit Hybrid Synchro / Resolver-to-Digital Converters. |
 Analog Devices |
|
DataSheet.es es una pagina web que funciona como un repositorio de manuales o hoja de datos de muchos de los productos más populares, |
| DataSheet.es | 2020 | Privacy Policy | Contacto | Buscar |