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PDF TDA2615 Data sheet ( Hoja de datos )
| Número de pieza | TDA2615 | |
| Descripción | 2 x 6 W hi-fi audio power amplifier | |
| Fabricantes | NXP Semiconductors | |
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INTEGRATED CIRCUITS
DATA SHEET
TDA2615
2 × 6 W hi-fi audio power amplifier
Product specification
Supersedes data of July 1994
File under Integrated Circuits, IC01
1995 May 08
Philips Semiconductors
1 page  
Philips Semiconductors
2 × 6 W hi-fi audio power amplifier
Product specification
TDA2615
LIMITING VALUES
In accordance with the Absolute maximum System (IEC 134).
SYMBOL
PARAMETER
±VP
IOSM
Ptot
Tstg
Txtal
Tamb
tsc
supply voltage
non-repetitive peak output current
total power dissipation
storage temperature range
crystal temperature
ambient operating temperature range
short-circuit time
CONDITIONS
see Fig.3
short-circuit to ground; note 1
MIN.
−
−
−
−55
−
−25
−
MAX. UNIT
21
4
15
+150
+150
+150
1
V
A
W
°C
°C
°C
h
Note
1. For asymmetrical power supplies (with the load short-circuited), the maximum unloaded supply voltage is limited to
VP = 28 V and with an internal supply resistance of RS ≥ 4 Ω, the maximum unloaded supply voltage is limited to 32 V
(with the load short-circuited). For symmetrical power supplies the circuit is short-circuit-proof up to VP = 21 V.
THERMAL CHARACTERISTICS
SYMBOL
Rth j-c
PARAMETER
thermal resistance from junction to case
VALUE
6
UNIT
K/W
16
Ptot
(W)
12
MCD368 - 2
infinite heatsink
8
R th-hs = 5.5 K/W
4
0
– 25
0
50 100 150
Tamb ( oC)
Fig.3 Power derating curve.
1995 May 08
5
5 Page 
Philips Semiconductors
2 × 6 W hi-fi audio power amplifier
Product specification
TDA2615
SOLDERING
Plastic single in-line packages
BY DIP OR WAVE
The maximum permissible temperature of the solder is
260 °C; this temperature must not be in contact with the
joint for more than 5 s. The total contact time of successive
solder waves must not exceed 5 s.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified storage maximum. If the printed-circuit board has
been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within
the permissible limit.
REPAIRING SOLDERED JOINTS
Apply the soldering iron below the seating plane (or not
more than 2 mm above it). If its temperature is below
300 °C, it must not be in contact for more than 10 s; if
between 300 and 400 °C, for not more than 5 s.
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1995 May 08
11
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet TDA2615.PDF ] | |
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