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Número de pieza | TDA8350 | |
Descripción | DC-coupled vertical deflection and East-West output circuit | |
Fabricantes | NXP Semiconductors | |
Logotipo | ||
Hay una vista previa y un enlace de descarga de TDA8350 (archivo pdf) en la parte inferior de esta página. Total 16 Páginas | ||
No Preview Available ! INTEGRATED CIRCUITS
DATA SHEET
TDA8350Q
DC-coupled vertical deflection and
East-West output circuit
Preliminary specification
Supersedes data of September 1991
File under Integrated Circuits, IC02
January 1995
Philips Semiconductors
1 page Philips Semiconductors
DC-coupled vertical deflection and
East-West output circuit
Preliminary specification
TDA8350Q
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
MIN. MAX. UNIT
DC supply
VP
VFB
supply voltage
flyback supply voltage
non-operating
note 1
− 40 V
− 25 V
− 50 V
60 V
Vertical circuit
IO
VO(A)
output current (peak-to-peak value)
output voltage (pin 9)
note 2
note 1
−3A
− 52 V
62 V
Flyback switch
IM peak output current
East-West amplifier
VO(sink)
IO(sink)
output voltage
output current
Thermal data (in accordance with IEC 747-1)
Tstg
Tamb
Tvj
Rth vj-c
Rth vj-a
tsc
storage temperature
operating ambient temperature
virtual junction temperature
resistance vj-case
resistance vj-ambient in free air
short-circuiting time
− ±1.5 A
IO(sink) = 10 µA; note 3
VO(sink) = 2 V; note 3
−
−
40 V
500 mA
note 4
−65 150 °C
−25 +75 °C
− 150 °C
− 4 K/W
− 40 K/W
− 1 hr
Notes
1. A flyback supply voltage of >50 V up to 60 V is allowed in application. A 220 nF capacitor in series with a 22 Ω resistor
(dependent on IO and the inductance of the coil) has to be connected between pin 7 and ground. The decoupling
capacitor of VFB has to be connected between pin 8 and pin 4. This supply voltage line must have a resistance of
33 Ω (see application circuit Fig.5).
2. IO maximum determined by current protection.
3. The operating area is limited by a straight line between the points VO(sink) = 40 V; IO(sink) = 10 µA and VO(sink) = 2 V;
IO(sink) = 500 mA.
4. Up to Vp = 18 V.
January 1995
5
5 Page Philips Semiconductors
DC-coupled vertical deflection and
East-West output circuit
PACKAGE OUTLINE
Preliminary specification
TDA8350Q
handbook, full pagewidth
0.05 convex
24.4
23.6
20.0
19.6
10
12.4 3.4
11.6 3.1
mounting
base
6
13 12 11 10 9 8 7 6 5 4 3 2 1
2.4
1.6
4.7
4.1
A
17.0
15.5
13
11
2.20
1.45
Dimensions in mm.
0.75
0.60
0.25 M
(13x)
1.7
3.4 (12x)
0.55
0.35
5.08
2.1
1.8
0.8 M A
(13x)
4.3 MBC369
Fig.6 Plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm); (DBS13P; SOT141-6).
January 1995
11
11 Page |
Páginas | Total 16 Páginas | |
PDF Descargar | [ Datasheet TDA8350.PDF ] |
Número de pieza | Descripción | Fabricantes |
TDA8350 | DC-coupled vertical deflection and East-West output circuit | NXP Semiconductors |
TDA8350Q | DC-coupled vertical deflection and East-West output circuit | NXP Semiconductors |
TDA8351 | DC-coupled vertical deflection circuit | NXP Semiconductors |
TDA8351A | DC-coupled vertical deflection output circuit | NXP Semiconductors |
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