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PDF 4066 Data sheet ( Hoja de datos )
| Número de pieza | 4066 | |
| Descripción | Quad Analog Switch/Multiplexer/Demultiplexer | |
| Fabricantes | Motorola Inc | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de 4066 (archivo pdf) en la parte inferior de esta página. Total 12 Páginas | ||
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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Quad Analog Switch/
Multiplexer/Demultiplexer
High–Performance Silicon–Gate CMOS
The MC54/74HC4066 utilizes silicon–gate CMOS technology to achieve
fast propagation delays, low ON resistances, and low OFF–channel leakage
current. This bilateral switch/multiplexer/demultiplexer controls analog and
digital voltages that may vary across the full power–supply range (from VCC
to GND).
The HC4066 is identical in pinout to the metal–gate CMOS MC14016 and
MC14066. Each device has four independent switches. The device has
been designed so that the ON resistances (RON) are much more linear over
input voltage than RON of metal–gate CMOS analog switches.
This device is identical in both function and pinout to the HC4016. The
ON/OFF control inputs are compatible with standard CMOS outputs; with
pullup resistors, they are compatible with LSTTL outputs. For analog
switches with voltage–level translators, see the HC4316.
• Fast Switching and Propagation Speeds
• High ON/OFF Output Voltage Ratio
• Low Crosstalk Between Switches
• Diode Protection on All Inputs/Outputs
• Wide Power–Supply Voltage Range (VCC – GND) = 2.0 to 12.0 Volts
• Analog Input Voltage Range (VCC – GND) = 2.0 to 12.0 Volts
• Improved Linearity and Lower ON Resistance over Input Voltage than
the MC14016 or MC14066 or HC4016
• Low Noise
• Chip Complexity: 44 FETs or 11 Equivalent Gates
LOGIC DIAGRAM
XA 1
A ON/OFF CONTROL 13
XB 4
B ON/OFF CONTROL 5
XC 8
C ON/OFF CONTROL 6
XD 11
D ON/OFF CONTROL 12
2 YA
3 YB
ANALOG
OUTPUTS/INPUTS
9 YC
10 YD
ANALOG INPUTS/OUTPUTS = XA, XB, XC, XD
PIN 14 = VCC
PIN 7 = GND
MC54/74HC4066
14
1
J SUFFIX
CERAMIC PACKAGE
CASE 632–08
14
1
14
1
N SUFFIX
PLASTIC PACKAGE
CASE 646–06
D SUFFIX
SOIC PACKAGE
CASE 751A–03
14
1
DT SUFFIX
TSSOP PACKAGE
CASE 948G–01
ORDERING INFORMATION
MC54HCXXXXJ
MC74HCXXXXN
MC74HCXXXXD
MC74HCXXXXDT
Ceramic
Plastic
SOIC
TSSOP
PIN ASSIGNMENT
XA
YA
YB
XB
B ON/OFF
CONTROL
C ON/OFF
CONTROL
GND
1
2
3
4
5
6
7
14 VCC
A ON/OFF
13 CONTROL
12 D ON/OFF
CONTROL
11 XD
10 YD
9 YC
8 XC
FUNCTION TABLE
On/Off Control
Input
L
H
State of
Analog Switch
Off
On
10/95
© Motorola, Inc. 1995
1 REV 6
1 page  
600
500
400
300
200
– 55°C
25°C
100 125°C
0
0 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00
Vin, INPUT VOLTAGE (VOLTS), REFERENCED TO GND
Figure 1a. Typical On Resistance, VCC = 2.0 V
MC54/74HC4066
120
125°C
100
80
25°C
60
– 55°C
40
20
0
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
Vin, INPUT VOLTAGE (VOLTS), REFERENCED TO GND
Figure 1b. Typical On Resistance, VCC = 4.5 V
80
70 125°C
60
25°C
50
40 – 55°C
30
20
10
0
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Vin, INPUT VOLTAGE (VOLTS), REFERENCED TO GND
Figure 1c. Typical On Resistance, VCC = 6.0 V
120
100
80
125°C
60
25°C
40
– 55°C
20
0
0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0
Vin, INPUT VOLTAGE (VOLTS), REFERENCED TO GND
Figure 1d. Typical On Resistance, VCC = 9.0 V
80
70
60 125°C
50
25°C
40
30 – 55°C
20
10
0
0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10 11 12
Vin, INPUT VOLTAGE (VOLTS), REFERENCED TO GND
Figure 1e. Typical On Resistance, VCC = 12 V
PLOTTER
PROGRAMMABLE
POWER
SUPPLY
–+
MINI COMPUTER
DC ANALYZER
DEVICE
UNDER TEST
VCC
ANALOG IN
COMMON OUT
GND
Figure 2. On Resistance Test Set–Up
High–Speed CMOS Logic Data
DL129 — Rev 6
5
MOTOROLA
5 Page 
MC54/74HC4066
–A–
14
1
G
OUTLINE DIMENSIONS
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751A–03
ISSUE F
8
–B–
7
P 7 PL
0.25 (0.010) M B M
C R X 45°
F
SEATING
PLANE
D 14 PL
K
0.25 (0.010) M T B S
AS
M
J
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 8.55 8.75 0.337 0.344
B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.054 0.068
D 0.35 0.49 0.014 0.019
F 0.40 1.25 0.016 0.049
G 1.27 BSC
0.050 BSC
J 0.19 0.25 0.008 0.009
K 0.10 0.25 0.004 0.009
M 0° 7°
0° 7°
P 5.80 6.20 0.228 0.244
R 0.25 0.50 0.010 0.019
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948G–01
ISSUE O
0.15 (0.006) T U S
2X L/2 14
L
PIN 1
IDENT.
1
0.15 (0.006) T U S
14X K REF
0.10 (0.004) M T U S V S
N 0.25 (0.010)
8
M
B
–U– N
F
7
A
–V–
J J1 DÇÇÇÇÉÉÉÉETAÇÇÇÇÉÉÉÉKIKL1EÇÇÇÇÉÉÉÉ
SECTION N–N
0.10 (0.004)
–T– SEATING
PLANE
D
C
G
H DETAIL E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
–W–
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 4.90 5.10 0.193 0.200
B 4.30 4.50 0.169 0.177
C ––– 1.20 ––– 0.047
D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030
G 0.65 BSC
0.026 BSC
H 0.50 0.60 0.020 0.024
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC
0.252 BSC
M 0_ 8_ 0_ 8_
High–Speed CMOS Logic Data
DL129 — Rev 6
11
MOTOROLA
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet 4066.PDF ] | |
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