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PDF MSD1819A-ST1 Data sheet ( Hoja de datos )
| Número de pieza | MSD1819A-ST1 | |
| Descripción | General Purpose Amplifier Transistor | |
| Fabricantes | Motorola Semiconductors | |
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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Order this document
by MSD1819A–RT1/D
NPN Silicon General Purpose
Amplifier Transistor
This NPN Silicon Epitaxial Planar Transistor is designed for general purpose
amplifier applications. This device is housed in the SC-70/SOT-323 package
which is designed for low power surface mount applications.
• High hFE, 210 – 460
• Low VCE(sat), < 0.5 V
COLLECTOR
3
• Available in 8 mm, 7-inch/3000 Unit Tape and Reel
MSD1819A-RT1
MSD1819A-ST1
Motorola Preferred Devices
NPN GENERAL
PURPOSE AMPLIFIER
TRANSISTORS
SURFACE MOUNT
MAXIMUM RATINGS (TA = 25°C)
Rating
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current — Continuous
Collector Current — Peak
DEVICE MARKING
MSD1819A-RT1 = ZR
MSD1819A-ST1 = ZS
Symbol
V(BR)CBO
V(BR)CEO
V(BR)EBO
IC
IC(P)
1
BASE
2
EMITTER
Value
60
50
7.0
100
200
Unit
Vdc
Vdc
Vdc
mAdc
mAdc
3
1
2
CASE 419–02, STYLE 3
SC–70/SOT–323
THERMAL CHARACTERISTICS
Rating
Power Dissipation(1)
Junction Temperature
Storage Temperature Range
ELECTRICAL CHARACTERISTICS
Symbol
PD
TJ
Tstg
Max
150
150
– 55 ~ + 150
Unit
mW
°C
°C
Characteristic
Symbol Min Max Unit
Collector-Emitter Breakdown Voltage (IC = 2.0 mAdc, IB = 0)
V(BR)CEO
50
— Vdc
Collector-Base Breakdown Voltage (IC = 10 µAdc, IE = 0)
V(BR)CBO
60
— Vdc
Emitter-Base Breakdown Voltage (IE = 10 µAdc, IE = 0)
V(BR)EBO
7.0
—
Vdc
Collector-Base Cutoff Current (VCB = 20 Vdc, IE = 0)
ICBO
— 0.1 µA
Collector-Emitter Cutoff Current (VCE = 10 Vdc, IB = 0)
DC Current Gain(2)
(VCE = 10 Vdc, IC = 2.0 mAdc)
(VCE = 2.0 Vdc, IC = 100 mAdc)
MSD1819A-RT1
MSD1819A-ST1
Collector-Emitter Saturation Voltage(2)
(IC = 100 mAdc, IB = 10 mAdc)
ICEO
— 100 µA
hFE1
hFE2
210 340
290 460
90 —
—
VCE(sat)
—
0.5 Vdc
1. Device mounted on a FR-4 glass epoxy printed circuit board using the minimum recommended footprint.
2. Pulse Test: Pulse Width ≤ 300 µs, D.C. ≤ 2%.
Thermal Clad is a trademark of the Bergquist Company
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 1
©MMoototorroollaa, ISncm. 1a9l9l–6Signal Transistors, FETs and Diodes Device Data
1
1 page  
MSD1819A-RT1 MSD1819A-ST1
SOLDER STENCIL GUIDELINES
Prior to placing surface mount components onto a printed
circuit board, solder paste must be applied to the pads. A
solder stencil is required to screen the optimum amount of
solder paste onto the footprint. The stencil is made of brass
or stainless steel with a typical thickness of 0.008 inches.
The stencil opening size for the surface mounted package
should be the same as the pad size on the printed circuit
board, i.e., a 1:1 registration.
TYPICAL SOLDER HEATING PROFILE
For any given circuit board, there will be a group of control
settings that will give the desired heat pattern. The operator
must set temperatures for several heating zones, and a
figure for belt speed. Taken together, these control settings
make up a heating “profile” for that particular circuit board.
On machines controlled by a computer, the computer
remembers these profiles from one operating session to the
next. Figure 8 shows a typical heating profile for use when
soldering a surface mount device to a printed circuit board.
This profile will vary among soldering systems but it is a good
starting point. Factors that can affect the profile include the
type of soldering system in use, density and types of
components on the board, type of solder used, and the type
of board or substrate material being used. This profile shows
temperature versus time. The line on the graph shows the
actual temperature that might be experienced on the surface
of a test board at or near a central solder joint. The two
profiles are based on a high density and a low density board.
The Vitronics SMD310 convection/infrared reflow soldering
system was used to generate this profile. The type of solder
used was 62/36/2 Tin Lead Silver with a melting point
between 177 –189°C. When this type of furnace is used for
solder reflow work, the circuit boards and solder joints tend to
heat first. The components on the board are then heated by
conduction. The circuit board, because it has a large surface
area, absorbs the thermal energy more efficiently, then
distributes this energy to the components. Because of this
effect, the main body of a component may be up to 30
degrees cooler than the adjacent solder joints.
200°C
150°C
100°C
STEP 1
PREHEAT
ZONE 1
“RAMP”
STEP 2
VENT
“SOAK”
STEP 3
HEATING
ZONES 2 & 5
“RAMP”
STEP 4
STEP 5
HEATING HEATING
ZONES 3 & 6 ZONES 4 & 7
“SOAK”
“SPIKE”
DESIRED CURVE FOR HIGH
MASS ASSEMBLIES
160°C
170°C
150°C
STEP 6 STEP 7
VENT COOLING
205° TO 219°C
PEAK AT
SOLDER JOINT
100°C
140°C
SOLDER IS LIQUID FOR
40 TO 80 SECONDS
(DEPENDING ON
MASS OF ASSEMBLY)
DESIRED CURVE FOR LOW
MASS ASSEMBLIES
50°C
TIME (3 TO 7 MINUTES TOTAL)
TMAX
Figure 8. Typical Solder Heating Profile
Motorola Small–Signal Transistors, FETs and Diodes Device Data
5
5 Page | ||
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| PDF Descargar | [ Datasheet MSD1819A-ST1.PDF ] | |
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