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PDF MT36KSF2G72PZ Data sheet ( Hoja de datos )
| Número de pieza | MT36KSF2G72PZ | |
| Descripción | 16GB 1.35V DDR3L SDRAM RDIMM | |
| Fabricantes | Micron | |
| Logotipo |  |
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16GB (x72, ECC, DR) 240-Pin 1.35V DDR3L RDIMM
Features
1.35V DDR3L SDRAM RDIMM
MT36KSF2G72PZ – 16GB
Features
• DDR3L functionality and operations supported as
defined in the component data sheet
• 240-pin, registered dual in-line memory module
(RDIMM)
• Fast data transfer rates: PC3-12800 or PC3-10600
• 16GB (2 Gig x 72)
• VDD = 1.35V (1.283–1.45V)
• VDD = 1.5V (1.425–1.575V)
• VDDSPD = 3.0–3.6V
• Backward compatible with standard 1.5V DDR3
systems
• Supports ECC error detection and correction
• Nominal and dynamic on-die termination (ODT) for
data, strobe, and mask signals
• Dual-rank
• On-board I2C temperature sensor with integrated
serial presence-detect (SPD) EEPROM
• 8 internal device banks
• Fixed burst chop (BC) of 4 and burst length (BL) of 8
via the mode register set (MRS)
• Selectable BC4 or BL8 on-the-fly (OTF)
• Gold edge contacts
• Halogen-free
• Fly-by topology
• Terminated control, command, and address bus
Figure 1: 240-Pin RDIMM (MO-269 R/C E2)
Module height: 30mm (1.181in)
Options
• Operating temperature1
– Commercial (0°C ≤ TA ≤ 70°C)
• Package
– 240-pin DIMM (halogen-free)
• Frequency/CAS latency
– 1.25ns @ CL = 11 (DDR3-1600)
– 1.5ns @ CL = 9 (DDR3-1333)
Marking
None
Z
-1G6
-1G4
Note: 1. Contact Micron for industrial temperature
module offerings.
Table 1: Key Timing Parameters
Speed
Grade
-1G6
-1G4
-1G1
-1G0
-80B
Industry
Nomenclature
PC3-12800
PC3-10600
PC3-8500
PC3-8500
PC3-6400
CL = 11 CL = 10
1600 1333
– 1333
––
––
––
Data Rate (MT/s)
CL = 9 CL = 8 CL = 7
1333 1066 1066
1333 1066 1066
– 1066 1066
– 1066 –
–––
CL = 6
800
800
800
800
800
CL = 5
667
667
667
667
667
tRCD
(ns)
13.125
13.125
13.125
15
15
tRP
(ns)
13.125
13.125
13.125
15
15
tRC
(ns)
48.125
49.125
50.625
52.5
52.5
PDF: 09005aef8479a029
ksf36c2gx72pz.pdf - Rev. I 7/15
1 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2011 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.
1 page  
16GB (x72, ECC, DR) 240-Pin 1.35V DDR3L RDIMM
Pin Descriptions
Table 5: Pin Descriptions (Continued)
Symbol
SDA
TDQSx,
TDQSx#
Err_Out#
EVENT#
VDD
VDDSPD
VREFCA
VREFDQ
VSS
VTT
NC
NF
Type
I/O
Output
Output
(open drain)
Output
(open drain)
Supply
Supply
Supply
Supply
Supply
Supply
–
–
Description
Serial data: Used to transfer addresses and data into and out of the temperature sen-
sor/SPD EEPROM on the I2C bus.
Redundant data strobe (x8 devices only): TDQS is enabled/disabled via the LOAD
MODE command to the extended mode register (EMR). When TDQS is enabled, DM is
disabled and TDQS and TDQS# provide termination resistance; otherwise, TDQS# are
no function.
Parity error output: Parity error found on the command and address bus.
Temperature event: The EVENT# pin is asserted by the temperature sensor when crit-
ical temperature thresholds have been exceeded.
Power supply: 1.5V ±0.075V. The component VDD and VDDQ are connected to the
module VDD.
Temperature sensor/SPD EEPROM power supply: 3.0–3.6V.
Reference voltage: Control, command, and address VDD/2.
Reference voltage: DQ, DM VDD/2.
Ground.
Termination voltage: Used for control, command, and address VDD/2.
No connect: These pins are not connected on the module.
No function: These pins are connected within the module, but provide no functional-
ity.
PDF: 09005aef8479a029
ksf36c2gx72pz.pdf - Rev. I 7/15
5 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2011 Micron Technology, Inc. All rights reserved.
5 Page 
16GB (x72, ECC, DR) 240-Pin 1.35V DDR3L RDIMM
Temperature Sensor with Serial Presence-Detect EEPROM
Temperature Sensor with Serial Presence-Detect EEPROM
Thermal Sensor Operations
The temperature from the integrated thermal sensor is monitored and converts into a
digital word via the I2C bus. System designers can use the user-programmable registers
to create a custom temperature-sensing solution based on system requirements. Pro-
gramming and configuration details comply with JEDEC standard No. 21-C page 4.7-1,
"Definition of the TSE2002av, Serial Presence Detect with Temperature Sensor."
Serial Presence-Detect EEPROM Operation
DDR3 SDRAM modules incorporate serial presence-detect. The SPD data is stored in a
256-byte EEPROM. The first 128 bytes are programmed by Micron to comply with JE-
DEC standard JC-45, "Appendix X: Serial Presence Detect (SPD) for DDR3 SDRAM Mod-
ules." These bytes identify module-specific timing parameters, configuration informa-
tion, and physical attributes. The remaining 128 bytes of storage are available for use by
the customer. System READ/WRITE operations between the master (system logic) and
the slave EEPROM device occur via a standard I2C bus using the DIMM’s SCL (clock)
SDA (data), and SA (address) pins. Write protect (WP) is connected to V SS, permanently
disabling hardware write protection. For further information refer to Micron technical
note TN-04-42, "Memory Module Serial Presence-Detect."
PDF: 09005aef8479a029
ksf36c2gx72pz.pdf - Rev. I 7/15
11
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2011 Micron Technology, Inc. All rights reserved.
11 Page | ||
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