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PDF STM32F101R4 Data sheet ( Hoja de datos )
| Número de pieza | STM32F101R4 | |
| Descripción | 32 bit MCU | |
| Fabricantes | STMicroelectronics | |
| Logotipo |  |
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STM32F101x4
STM32F101x6
Low-density access line, ARM®-based 32 bit MCU with
16 or 32 KB Flash, 5 timers, ADC and 4 communication interfaces
Datasheet - production data
Features
• Core: ARM® 32-bit Cortex®-M3 CPU
– 36 MHz maximum frequency,
1.25 DMIPS/MHz (Dhrystone 2.1)
performance at 0 wait state memory
access
– Single-cycle multiplication and hardware
division
• Memories
– 16 to 32 Kbytes of Flash memory
– 4 to 6 Kbytes of SRAM
• Clock, reset and supply management
– 2.0 to 3.6 V application supply and I/Os
– POR, PDR and programmable voltage
detector (PVD)
– 4-to-16 MHz crystal oscillator
– Internal 8 MHz factory-trimmed RC
– Internal 40 kHz RC
– PLL for CPU clock
– 32 kHz oscillator for RTC with calibration
• Low power
– Sleep, Stop and Standby modes
– VBAT supply for RTC and backup registers
• Debug mode
– Serial wire debug (SWD) and JTAG
interfaces
• DMA
– 7-channel DMA controller
– Peripherals supported: timers, ADC, SPIs,
I2Cs and USARTs
• 1 × 12-bit, 1 µs A/D converter (up to 16
channels)
– Conversion range: 0 to 3.6 V
– Temperature sensor
• Up to 51 fast I/O ports
– 26/37/51 I/Os, all mappable on 16 external
interrupt vectors and almost all 5 V-tolerant
LQFP64
10 x 10 mm
LQFP48
7 x 7 mm
VFQFPN36
6 × 6 mm
• Up to 5 timers
– Up to two16-bit timers, each with up to 4
IC/OC/PWM or pulse counter
– 2 watchdog timers (Independent and
Window)
– SysTick timer: 24-bit downcounter
• Up to 4 communication interfaces
– 1 x I2C interface (SMBus/PMBus)
– Up to 2 USARTs (ISO 7816 interface, LIN,
IrDA capability, modem control)
– 1 × SPI (18 Mbit/s)
• CRC calculation unit, 96-bit unique ID
• ECOPACK® packages
Table 1. Device summary
Reference
Part number
STM32F101x4
STM32F101x6
STM32F101C4,
STM32F101R4,
STM32F101T4
STM32F101C6,
STM32F101R6,
STM32F101T6
September 2015
This is information on a product in full production.
DocID15058 Rev 6
1/87
www.st.com
1 page  
STM32F101x4, STM32F101x6
List of Tables
List of Tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Table 18.
Table 19.
Table 20.
Table 21.
Table 22.
Table 23.
Table 24.
Table 25.
Table 26.
Table 27.
Table 28.
Table 29.
Table 30.
Table 31.
Table 32.
Table 33.
Table 34.
Table 35.
Table 36.
Table 37.
Table 38.
Table 39.
Table 40.
Table 41.
Table 42.
Table 43.
Table 44.
Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Low-density STM32F101xx device features and peripheral counts . . . . . . . . . . . . . . . . . . 11
STM32F101xx family . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Low-density STM32F101xx pin definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Voltage characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Thermal characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Operating conditions at power-up / power-down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Embedded reset and power control block characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 33
Embedded internal reference voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Maximum current consumption in Run mode, code with data processing
running from Flash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Maximum current consumption in Run mode, code with data processing
running from RAM. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Maximum current consumption in Sleep mode, code running from Flash
or RAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Typical and maximum current consumptions in Stop and Standby modes . . . . . . . . . . . . 37
Typical current consumption in Run mode, code with data processing
running from Flash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Typical current consumption in Sleep mode, code running from Flash or RAM . . . . . . . . . 41
Peripheral current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
High-speed external user clock characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Low-speed external user clock characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
HSE 4-16 MHz oscillator characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
LSE oscillator characteristics (fLSE = 32.768 kHz) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
HSI oscillator characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
LSI oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Low-power mode wakeup timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
PLL characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Flash memory characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
EMS characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
EMI characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
ESD absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Electrical sensitivities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
I/O current injection susceptibility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
I/O static characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Output voltage characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
I/O AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
NRST pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
TIMx characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
I2C characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
SCL frequency (fPCLK1= MHz, VDD_I2C = 3.3 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
SPI characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
ADC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
RAIN max for fADC = 14 MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
ADC accuracy - limited test conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
ADC accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
DocID15058 Rev 6
5/87
6
5 Page 
STM32F101x4, STM32F101x6
Description
2.1 Device overview
Figure 1 shows the general block diagram of the device family.
Table 2. Low-density STM32F101xx device features and peripheral counts
Peripheral
STM32F101Tx
STM32F101Cx
STM32F101Rx
Flash - Kbytes
16 32 16 32 16 32
SRAM - Kbytes
464646
General-purpose
2
2
2
2
2
2
SPI 1 1 1 1 1 1
I2C 1 1 1 1 1 1
USART
222222
12-bit synchronized ADC
number of channels
GPIOs
CPU frequency
Operating voltage
Operating temperatures
Packages
1
10 channels
1
10 channels
1
16 channels
26 37 51
36 MHz
2.0 to 3.6 V
Ambient temperature: –40 to +85 °C (see Table 8)
Junction temperature: –40 to +105 °C (see Table 8)
VFQFPN36
LQFP48
LQFP64
DocID15058 Rev 6
11/87
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11 Page | ||
| Páginas | Total 30 Páginas | |
| PDF Descargar | [ Datasheet STM32F101R4.PDF ] | |
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