MPC5674F PDF даташит

Спецификация MPC5674F изготовлена «Freescale Semiconductor» и имеет функцию, называемую «Microcontroller».

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Номер произв	MPC5674F
Описание	Microcontroller
Производители	Freescale Semiconductor
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30 Pages

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Freescale Semiconductor

Data Sheet: Advance Information

Document Number: MPC5674F

Rev. 9, 11/2012

MPC5674F Microcontroller

Data Sheet

Covers: MPC5674F and MPC5673F

MPC5674F

TEPBGA–416

27mm x 27mm

TEPBGA–516

27mm x 27mm

TEPBGA–324

23mm x 23mm

• Dual issue, 32-bit CPU core complex (e200z7)

– Compliant with the Power Architecture embedded

category

– 16 KB I-Cache and 16 KB D-Cache

– Includes an instruction set enhancement allowing

variable length encoding (VLE), optional encoding of

mixed 16-bit and 32-bit instructions, for code size

footprint reduction

– Includes signal processing extension (SPE2) instruction

support for digital signal processing (DSP) and

single-precision floating point operations

• 4 MB on-chip flash

– Supports read during program and erase operations, and

multiple blocks allowing EEPROM emulation

• 256 KB on-chip general-purpose SRAM including 32 KB

of standby RAM

• Two direct memory access controller (eDMA2) blocks

– One supporting 64 channels

– One supporting 32 channels

• Interrupt controller (INTC)

• Frequency modulated phase-locked loop (FMPLL)

• Crossbar switch architecture for concurrent access to

peripherals, flash, or RAM from multiple bus masters

• External bus interface (EBI) for calibration and application

development (not available on all packages)

• System integration unit (SIU)

• Error correction status module (ECSM)

• Boot assist module (BAM) supports serial bootload via

CAN or SCI

• Two second-generation enhanced time processor units

(eTPU2) that share code and data RAM.

– 32 standard channels per eTPU2

– 24 KB code RAM

– 6 KB parameter (data) RAM

• Enhanced modular input output system supporting 32

unified channels (eMIOS) with each channel capable of

single action, double action, pulse width modulation

(PWM) and modulus counter operation

• Four enhanced queued analog-to-digital converters

(eQADC)

– Support for 64 analog channels

– Includes one absolute reference ADC channel

– Includes eight decimation filters

• Four deserial serial peripheral interface (DSPI) modules

• Three enhanced serial communication interface (eSCI)

modules

• Four controller area network (FlexCAN) modules

• Dual-channel FlexRay controller

• Nexus development interface (NDI) per IEEE-ISTO

5001-2003/5001-2008 standard

• Device and board test support per Joint Test Action Group

(JTAG) (IEEE 1149.1)

• On-chip voltage regulator controller regulates supply

voltage down to 1.2 V for core logic

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Table of Contents

1 Ordering Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3

1.1 Orderable Parts. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3

1.2 MPC567xF Family Differences . . . . . . . . . . . . . . . . . . . .4

2 MPC5674F Blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5

2.1 Block Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5

3 Pin Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5

3.1 324-ball TEPBGA Pin Assignments . . . . . . . . . . . . . . . .6

3.2 416-ball TEPBGA Pin Assignments . . . . . . . . . . . . . . . .9

3.3 516-ball TEPBGA Pin Assignments . . . . . . . . . . . . . . .14

3.4 Signal Properties and Muxing . . . . . . . . . . . . . . . . . . . .19

4 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .20

4.1 Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20

4.2 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . .21

4.2.1 General Notes for Specifications at Maximum

Junction Temperature . . . . . . . . . . . . . . . . . . . .23

4.3 EMI (Electromagnetic Interference) Characteristics . . .24

4.4 ESD Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .25

4.5 PMC/POR/LVI Electrical Specifications . . . . . . . . . . . .25

4.6 Power Up/Down Sequencing . . . . . . . . . . . . . . . . . . . .29

4.6.1 Power-Up. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29

4.6.2 Power-Down . . . . . . . . . . . . . . . . . . . . . . . . . . .30

4.6.3 Power Sequencing and POR Dependent on VDDA

4.7 DC Electrical Specifications . . . . . . . . . . . . . . . . . . . . .30

4.7.1 I/O Pad Current Specifications . . . . . . . . . . . . .33

4.7.2 LVDS Pad Specifications . . . . . . . . . . . . . . . . . .35

4.8 Oscillator and FMPLL Electrical Characteristics . . . . . 35

4.9 eQADC Electrical Characteristics . . . . . . . . . . . . . . . . 37

4.9.1 ADC Internal Resource Measurements . . . . . . 39

4.10 C90 Flash Memory Electrical Characteristics . . . . . . . 40

4.11 AC Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

4.11.1 Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

4.11.2 Pad AC Specifications . . . . . . . . . . . . . . . . . . . 44

4.12 AC Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

4.12.1 Generic Timing Diagrams. . . . . . . . . . . . . . . . . 45

4.12.2 Reset and Configuration Pin Timing. . . . . . . . . 46

4.12.3 IEEE 1149.1 Interface Timing. . . . . . . . . . . . . . 47

4.12.4 Nexus Timing . . . . . . . . . . . . . . . . . . . . . . . . . . 50

4.12.5 External Bus Interface (EBI) Timing . . . . . . . . . 53

4.12.6 External Interrupt Timing (IRQ Pin) . . . . . . . . . 57

4.12.7 eTPU Timing . . . . . . . . . . . . . . . . . . . . . . . . . . 57

4.12.8 eMIOS Timing . . . . . . . . . . . . . . . . . . . . . . . . . 58

4.12.9 DSPI Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . 59

5 Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65

5.1 324-Pin Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66

5.2 416-Pin Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68

5.3 516-Pin Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70

6 Product Documentation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72

Appendix ASignal Properties and Muxing . . . . . . . . . . . . . . . . . . 73

Appendix BRevision History . . . . . . . . . . . . . . . . . . . . . . . . . . . 127

MPC5674F Microcontroller Data Sheet, Rev. 9

2 Freescale Semiconductor

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1 Ordering Information

Ordering Information

1.1 Orderable Parts

Figure 1 and Table 1 describe and list the orderable part numbers for the MPC5674F.

Note: Not all options are

available on all

devices. Refer to

Table 1.

Qualification status

Core code

Device number

Fab Revision ID

Revision of Silicon

Temperature range

Package identifier

M PC 5674F F 3 M VR 3 R

Operating frequency (MHz)

Tape and reel status

Temperature Range

M = –40 °C to 125 °C

Package Identifier

VZ = 324 BGA Pb-free

VR = 416 BGA Pb-free

VY = 516 BGA Pb-free

VV = 516 BGA SnPb

Operating Frequency

2 = 200 MHz

3 = 264 MHz

Tape and Reel Status

R = Tape and reel

(blank) = Trays

Qualification Status

P = Pre qualification

M = Fully spec. qualified, general market flow

S = Fully spec. qualified, automotive flow

Revision of Silicon

3 = Rev 3

Fab Revision ID

F = ATMC

Figure 1. MPC5674F Orderable Part Number Description

Table 1. Orderable Part Numbers

Freescale Part Number

Package Description

Speed (MHz)1

Nominal

Max3 (fMAX)

Operating Temperature2

Min (TL)

Max (TH)

SPC5673FF3MVR3

416 PBGA, no EBI, Pb-free

264

270

–40 °C

125 °C

SPC5673FF3MVY3

516 PBGA, w/EBI, Pb-free

264

270

–40 °C

125 °C

SPC5673FF3MVV2

516 PBGA, w/EBI, SnPb

264

270

–40 °C

125 °C

SPC5674FF3MVR3

416 PBGA, no EBI, Pb-free

264

270

–40 °C

125 °C

SPC5673FF3MVY2

516 PBGA, w/EBI, Pb-free

200

–40 °C

125 °C

SPC5674FF3MVY3

516 PBGA, w/EBI, Pb-free

264

270

–40 °C

125 °C

SPC5674FF3MVV3

516 PBGA, w/EBI, SnPb

264

270

–40 °C

125 °C

SPC5674FF3MVZ2

324 PBGA, no EBI, Pb-free

200

–40 °C

125 °C

1 For the operating mode frequency of various blocks on the device, see Table 27.

2 The lowest ambient operating temperature is referenced by TL; the highest ambient operating temperature is referenced by TH.

3 Speed is the nominal maximum frequency. Max speed is the maximum speed allowed including frequency modulation (FM).

270 MHz parts allow for 264 MHz system clock + 2% FM.

Freescale Semiconductor

MPC5674F Microcontroller Data Sheet, Rev. 9

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Номер в каталоге	Описание	Производители
MPC5674F	Microcontroller	Freescale Semiconductor

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