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PDF MBRS360BT3G Data sheet ( Hoja de datos )
| Número de pieza | MBRS360BT3G | |
| Descripción | Surface Mount Schottky Power Rectifier | |
| Fabricantes | ON Semiconductor | |
| Logotipo |  |
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MBRS360T3G,
MBRS360BT3G,
NRVBS360T3G,
NRVBS360BT3G
Surface Mount
Schottky Power Rectifier
This device employs the Schottky Barrier principle in a large area
metal−to−silicon power diode. State−of−the−art geometry features
epitaxial construction with oxide passivation and metal overlay
contact. Ideally suited for low voltage, high frequency rectification, or
as free wheeling and polarity protection diodes, in surface mount
applications where compact size and weight are critical to the system.
Features
• Small Compact Surface Mountable Package with J−Bend Leads
• Rectangular Package for Automated Handling
• Highly Stable Oxide Passivated Junction
• Excellent Ability to Withstand Reverse Avalanche Energy Transients
• Guard−Ring for Stress Protection
• NRVBS Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
• These are Pb−Free Devices
Mechanical Characteristics
• Case: Epoxy, Molded, Epoxy Meets UL 94 V−0
• Weight: 217 mg (Approximately), SMC
95 mg (Approximately), SMB
• Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
• Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
• Polarity: Notch in Plastic Body Indicates Cathode Lead
• Device Meets MSL 1 Requirements
• ESD Ratings:
♦ Machine Model, C
♦ Human Body Model, 3B
http://onsemi.com
SCHOTTKY BARRIER
RECTIFIERS
3.0 AMPERES, 60 VOLTS
SMC
CASE 403
SMB
CASE 403A
MARKING DIAGRAMS
AYWW
B36G
G
AYWW
B36G
G
B36 = Specific Device Code
A = Assembly Location
Y = Year
WW = Work Week
G = Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
MBRS360T3G
NRVBS360T3G
MBRS360BT3G
Package
SMC
(Pb−Free)
SMC
(Pb−Free)
SMB
(Pb−Free)
Shipping†
2,500 /
Tape & Reel
2,500 /
Tape & Reel
2,500 /
Tape & Reel
NRVBS360BT3G
SMB
(Pb−Free)
2,500 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2014
February, 2014 − Rev. 9
1
Publication Order Number:
MBRS360T3/D
1 page  
MBRS360T3G, MBRS360BT3G, NRVBS360T3G, NRVBS360BT3G
100
D = 0.5
0.2
10
0.1
0.05 P(pk)
1
0.01
SINGLE PULSE
0.1
0.00001
0.0001
t1
t2
DUTY CYCLE, D = t1/t2
0.001
0.01
0.1
1
10
t, TIME (s)
Figure 8. Thermal Response, Junction−to−Ambient, SMC Package
Test Type > min pad 1 oz
RqJC = min pad 1 oz C/W
100 1000
100
50% Duty Cycle
20%
10 10%
5%
2%
1
1%
0.1
Single Pulse
0.01
0.000001
0.00001
0.0001
0.001
P(pk)
0.01 0.1
PULSE TIME (s)
t1
t2
DUTY CYCLE, D = t1/t2
Test Type > min pad 1 oz
RqJC = min pad 1 oz C/W
1 10 100 1000
Figure 9. Typical Thermal Response, Junction−to−Ambient, SMB Package
http://onsemi.com
5
5 Page | ||
| Páginas | Total 7 Páginas | |
| PDF Descargar | [ Datasheet MBRS360BT3G.PDF ] | |
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