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PDF MIC2076 Data sheet ( Hoja de datos )
| Número de pieza | MIC2076 | |
| Descripción | Dual-Channel Power Distribution Switch | |
| Fabricantes | Micrel Semiconductor | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de MIC2076 (archivo pdf) en la parte inferior de esta página. Total 16 Páginas | ||
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MIC2026/2076
Dual-Channel Power Distribution Switch
General Description
Features
The MIC2026 and MIC2076 are high-side MOSFET
switches optimized for general-purpose power distribution
requiring circuit protection.
The MIC2026/76 are internally current limited and have
thermal shutdown that protects the device and load.
The MIC2076 offers “smart” thermal shutdown that
reduces current consumption in fault modes. When a
thermal shutdown fault occurs, the output is latched off
until the faulty load is removed. Removing the load or
• 140mΩ maximum on-resistance per channel
• 2.7V to 5.5V operating range
• 500mA minimum continuous current per channel
• Shortcircuit protection with thermal shutdown
• Thermally isolated channels
• Fault status flag with 3ms filter eliminates false
assertions
• Undervoltage lockout
toggling the enable input will reset the device output.
• Reverse current flow blocking (no “body diode”)
Both devices employ soft-start circuitry that minimizes
inrush current in applications where highly capacitive loads
are employed.
A fault status output flag is asserted during overcurrent
and thermal shutdown conditions. Transient faults are
internally filtered.
• Circuit breaker mode (MIC2076)
• Logic-compatible inputs
• Soft-start circuit
• Low quiescent current
• Pin compatible with MIC2526
The MIC2026/76 are available in 8-pin DIP or 8-pin SOIC. • UL File # E179633
All support documentation can be found on Micrel’s web
site at www.micrel.com.
Applications
• USB peripherals
• General purpose power switching
• ACPI power distribution
• Notebook PCs
• PDAs
• PC card hot swap
___________________________________________________________________________________________________________
Typical Application
VCONT.
10k
10k
Logic Controller
VIN ON/OFF
OVERCURRENT
OVERCURRENT
ON/OFF
VCC
2.7V to 5.5V
MIC2026-2
ENA
FLGAI
FLGB
ENB
OUTA
N
GND
OUTB
Load
0.1µF
Load
UL Recognized Component
Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel +1 (408) 944-0800 • fax + 1 (408) 474-1000 • http://www.micrel.com
June 2010
M9999-060410-B
1 page  
Micrel, Inc.
Test Circuit
Device
Under
Test
OUT
RL CL
VOUT
MIC2026/2076
Timing Diagrams
VOUT
VEN
VOUT
tR
90%
10%
90%
10%
Output Rise and Fall Times
tF
50%
tOFF
tON
90%
10%
Active-Low Switch Delay Times (MIC20x6-2)
VEN
VOUT
June 2010
50%
tON
90%
tOFF
10%
Active-High Switch Delay Time (MIC20x6-1)
5
M9999-060410-B
5 Page 
Micrel, Inc.
Block Diagram
MIC2026/2076
FLGA
ENA
CHARGE
PUMP
REFSLPAOGNSE
DELAY
GATE
CONTROL
CURRENT
LIMIT
OUTA
OSC.
THERMAL
SHUTDOWN
UVLO
1.2V
REFERENCE
IN
ENB
CHARGE
PUMP
GATE
CONTROL
CURRENT
LIMIT
REDFSELPLAOAGNYSE
MIC2026/2076
GND
MIC2026/2076 Block Diagram
OUTB
FLGB
Functional Description
Input and Output
IN is the power supply connection to the logic circuitry
and the drain of the output MOSFET. OUT is the source
of the output MOSFET. In a typical circuit, current flows
from IN to OUT toward the load. If VOUT is greater than
VIN, current will flow from OUT to IN, since the switch is
bidirectional when enabled. The output MOSFET and
driver circuitry are also designed to allow the MOSFET
source to be externally forced to a higher voltage than
the drain (VOUT > VIN) when the switch is disabled. In this
situation, the MIC2026/76 prevents undesirable current
flow from OUT to IN.
Thermal Shutdown
Thermal shutdown is employed to protect the device
from damage should the die temperature exceed safe
margins due mainly to short circuit faults. Each channel
employs its own thermal sensor. Thermal shutdown
shuts off the output MOSFET and asserts the FLG
output if the die temperature reaches 140°C and the
overheated channel is in current limit. The other channel
is not affected. If however, the die temperature exceeds
160°C, both channels will be shut off. Upon determining
a thermal shutdown condition, the MIC2076 will latch the
output off. In this case, a pull-up current source is
activated. This allows the output latch to automatically
reset when the load (such as a USB device) is removed.
The output can also be reset by toggling EN. Refer to
Figure 1 for timing details.
The MIC2026 will automatically reset its output when the
die temperature cools down to 120°C. The MIC2026
output and FLG signal will continue to cycle on and off
until the device is disabled or the fault is removed.
Figure 2 depicts typical timing.
Depending on PCB layout, package, ambient
temperature, etc., it may take several hundred
milliseconds from the incidence of the fault to the output
MOSFET being shut off. This time will be shortest in the
case of a dead short on the output.
Power Dissipation
The device’s junction temperature depends on several
factors such as the load, PCB layout, ambient
temperature, and package type. Equations that can be
used to calculate power dissipation of each channel and
junction temperature are found below:
PD = RDS(on) × IOUT2
Total power dissipation of the device will be the
summation of PD for both channels. To relate this to
junction temperature, the following equation can be
used:
June 2010
11 M9999-060410-B
11 Page | ||
| Páginas | Total 16 Páginas | |
| PDF Descargar | [ Datasheet MIC2076.PDF ] | |
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