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PDF BD6968FVM Data sheet ( Hoja de datos )

Número de pieza BD6968FVM
Descripción Standard Single-phase Full wave Fan motor driver
Fabricantes ROHM Semiconductor 
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Datasheet
DC Brushless Fan Motor Driver
Standard Single-phase Full wave
Fan motor driver
BD6968FVM
Description
This is the summary of application for BD6968FVM. BD6968FVM can drive FAN motor silently by BTL soft switching, and it
can control rotational speed by direct PWM and DC voltage speed control.
Features
Small package (MSOP10)
BTL soft switching drive
PWM speed control
Direct PWM and DC voltage control available
Low duty start up function
Quick start function
Constant voltage output for hall element
Lock protection and auto restart
(without external capacitor)
Lock alarm signal (AL) outputt
Applications
PC, PC peripheral component
(Power supply, VGA card, case FAN etc.)
BD player, Projector etc.
Package(s)
MSOP10
W(Typ.) x D(Typ.) x H(Max.)
2.90mm x 4.00mm x 0.90mm
MSOP10
Absolute maximum ratings
Parameter
Symbol
Limit
Supply voltage
Vcc 15
Power dissipation
Pd 585*
Operating temperature
Topr
-40 to +105
Storage temperature
Tstg -55 to +150
Output voltage
Vomax
15
Output current
Iomax
800**
Hall input terminal voltage
Vhall
7
PWM terminal voltage
Vpwm
7
AL signal output voltage
Val
15
AL signal output current
Ial
10
HB output current Ihb 10
REF output current
Iref
10
Junction temperature
Tjmax
150
* Reduce by 4.68mW/over Ta=25ºC(On 70mm×70mm×1.6mm glass epoxy board)
** This value is not to exceed Pd
Operating conditions
Parameter
Operating supply voltage range
Hall input voltage range
Symbol
Vcc
Vh
Limit
3.3 to 14
0.4 to Vcc/3
Unit
V
mW
V
mA
V
V
V
mA
mA
mA
Unit
V
V
Product structureSilicon monolithic integrated circuit This product is not designed protection against radioactive rays
.www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ2211114001
1/12
TSZ02201-0H1H0B100050-1-2
21.Mar.2013 Rev.002

1 page




BD6968FVM pdf
BD6968FVM
Datasheet
3) Rotational speed adjusting application
This application circuit can set the FAN rotational speed without the change of motor coil by changing resistor value of
PCB. The adjusting range of rotational speed is slower than full speed of the motor.
GN D
1
OU T2
2
HALL
0Ω to
5 00 Ω
H+
3
HB
4
H-
5
M
L oc k
Prot ectio n
+
-
TSD
Hall
Bias
OSC
+
-
-
+
Cont ro l
+
-
OUT1
10
Vcc
9
REF
8
PWM
7
AL
6
0 .1 u F
to 1uF
R1
0. 0 1u F
to 0.1uF
Drive duty can be
R2 adjusted by the value
of R1 and R2.
P.7
R1,R2 1kΩ to 100kΩ
*If you use only full speed, connect the PWM terminal to REF terminal.
Description of operations
1) Lock protection and automatic restart circuit
Motor rotation is detected by hall signal, and lock detection ON time (Ton) and lock detection OFF time (Toff) are set
by IC internal counter. External part (C or R) is not required. Timing chart is shown in Fig.13.
Idling
H+
OUT1
OUT2
AL
Toff Ton
OutputTr OFF ON
Ton
Motor Lock
locking detection
Lock Recovers
release normal
operation
Fig.13 Lock protection timing chart
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ2211115001
5/12
TSZ02201-0H1H0B100050-1-2
21.Mar.2013 Rev.002

5 Page





BD6968FVM arduino
BD6968FVM
Datasheet
Notes for use
1) Absolute maximum ratings
Devices may be destroyed when supply voltage or operating temperature exceeds the absolute maximum ratings.
Because the cause of this damage cannot be identified as a short circuit or an open circuit, if any over rated values
will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses.
2) Connecting the power supply connector backward
Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power
supply lines. An external direction diode can be added.
3) Power supply line
Back electromotive force causes regenerated current to power supply line, therefore take a measure such as placing
a capacitor between power supply and GND for routing regenerated current. And fully ensure that the capacitor
characteristics have no problem before determine a capacitor value. (when applying electrolytic capacitors,
capacitance characteristic values are reduced at low temperatures)
4) GND potential
It is possible that the motor output terminal may deflect below GND terminal because of influence by back
electromotive force of motor. The potential of GND terminal must be minimum potential in all operating conditions,
except that the levels of the motor outputs terminals are under GND level by the back electromotive force of the
motor coil. Also ensure that all terminals except GND and motor output terminals do not fall below GND voltage
including transient characteristics. Malfunction may possibly occur depending on use condition, environment, and
property of individual motor. Please make fully confirmation that no problem is found on operation of IC.
5) Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation(Pd) in actual operating
conditions.
6) Inter-pin shorts and mounting errors
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any
connection error or if pins are shorted together.
7) Actions in strong electromagnetic field
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to
malfunction.
8) ASO
When using the IC, set the output transistor so that it does not exceed absolute maximum rations or ASO.
9) Thermal shut down circuit
The IC incorporates a built-in thermal shutdown circuit (TSD circuit). Operation temperature is 175ºC (typ.) and has a
hysteresis width of 25ºC (typ.). When IC chip temperature rises and TSD circuit works, the output terminal becomes
an open state. TSD circuit is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect
the IC or guarantee its operation. Do not continue to use the IC after operation this circuit or use the IC in an
environment where the operation of this circuit is assumed.
10) Testing on application boards
When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to
stress. Always discharge capacitors after each process or step. Always turn the IC’s power supply off before
connecting it to or removing it from a jig or fixture during the inspection process. Ground the IC during assembly
steps as an antistatic measure. Use similar precaution when transporting or storing the IC.
11) GND wiring pattern
When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns,
placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage
variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to
change the GND wiring pattern of any external components, either.
12) Capacitor between output and GND
When a large capacitor is connected between output and GND, if Vcc is shorted with 0V or GND for some cause, it
is possible that the current charged in the capacitor may flow into the output resulting in destruction. Keep the
capacitor between output and GND below 100uF.
13) IC terminal input
When Vcc voltage is not applied to IC, do not apply voltage to each input terminal. When voltage above Vcc or below
GND is applied to the input terminal, parasitic element is actuated due to the structure of IC. Operation of parasitic
element causes mutual interference between circuits, resulting in malfunction as well as destruction in the last. Do
not use in a manner where parasitic element is actuated.
14) In use
We are sure that the example of application circuit is preferable, but please check the character further more in
application to a part which requires high precision. In using the unit with external circuit constant changed, consider
the variation of externally equipped parts and our IC including not only static character but also transient character
and allow sufficient margin in determining.
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ2211115001
11/12
TSZ02201-0H1H0B100050-1-2
21.Mar.2013 Rev.002

11 Page







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