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PDF BD63000MUV Data sheet ( Hoja de datos )
| Número de pieza | BD63000MUV | |
| Descripción | 3-phase brushless motor pre-driver | |
| Fabricantes | ROHM Semiconductor | |
| Logotipo |  |
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3-phase brushless motor
pre-driver
BD63000MUV
●General Description
BD63000MUV is pre-driver of 3-phase brushless motor.
It generates a driving signal from the Hall sensor and
drives PWM through the input control signal. Since there
is a built-in booster circuit, Nch-Nch MOS transistors can
be used on the external power transistor. In addition, the
power supply can use 12V or 24V and it has various
controls and protection functions built-in, making it useful
for a variety of purposes. Because it adopts small
packages, it can also be used on small diameter motors.
●Features
Built-in 120° commutation logic circuit.
Driving with Nch-Nch MOS transistors.
PWM control mode (low side arm switching).
Built-in power-saving circuit.
CW/CCW function.
Short brake function.
FG output (Open drain).
Built-in protection circuit for current limiting,
overheating, under voltage, over voltage, motor lock.
●Applications
OA machines.
Other general civil equipments.
●Key Specifications
Power supply voltage rating:
Operating temperature range:
Stand-by current:
Range of in-phase input voltage
for hall input:
Current limit detect voltage:
UVLO Lock out voltage:
OVLO Lock out voltage 1:
OVLO Lock out voltage 2:
30V
-40°C to +85°C
1.2mA(Max.)
VREG-1.7V(Max.)
0.2V±10%
6.0V(Typ.)
16.0V(Typ.)
28.5V(Typ.)
●Package
VQFN028V5050
W(Typ.) x D(Typ.) x H(Max.)
5.00mm x 5.00mm x 1.00mm
●Typical Application Circuit
VREG 23
0.1µF
HUP 17
HU 0.01µF HUN 18
HVP 19
HV 0.01µF HVN 20
HWP 21
HW 0.01µF HWN 22
ENB 4
CW 3
VCC 28
0.1µF
27 VG
VQFN028V5050
0.1µF
47µF
26 CP2
25 CP1
8 UH
6 UL
9 VH
11 VL
14 WH
12 WL
7U
V
10
W
13
15 RCL
FG
1
0.1µF
200Ω
200Ω
200Ω
10kΩ
0.1µF 0.1µF
1kΩ
470pF 0.1Ω
0.1µF
M
BRKB 5
PWMB 2
16
GND
24 LPE
Fig.1 Application circuit
○Product structure：Silicon monolithic integrated circuit
.www.rohm.co
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・14・001
○This product is not designed protection against radioactive rays
1/14 TSZ02201-0P2P0B000130-1-2
1 page  
BD63000MUV
Datasheet
14) Pre-driver output
Driving signal is output to external output power transistor through drive signal generated from internal logic output
drive signal is output for external power supply transistor. Driving voltage of upper gate is VG voltage (Vcc+7V(Typ.))
and driving voltage of lower gate is VREG voltage (5V(Typ.)). In addition, a dead time (1µs ~ 2µs(Typ.)) is designed
between driving signals of upper gate and lower gate in order to prevent upper and lower FET from being set to ON
synchronously when PWM is rectified synchronously. Due to the influence of the motor’s counter electromotive force,
the output feedback terminal might swing under GND potential. When excessive current occurs (about over 30mA),
incorrect action or even damage might be caused. Therefore, please insert a resistor of about 100Ω ~ 510 Ω before
putting into use. Moreover, we recommend you to use output feedback terminal with a slow rate of over 50ns.
15) Control signal sequence
Though we recommend you input control signals of ENB, CW, PWMB, BRKB and LPE terminals after inputting VCC,
if input control signals before inputting VCC, there won’t be any problem. If LPE terminal is set to "H" or "M" when
being started, please be informed that if motor rotation cannot be detected within the set time (edge of FG signal
cannot be input), then the MLP circuit starts and motor fails to start. Moreover, the order of priority is set to control
signal and IC internal signal. Please refer to the following table.
Priority of control signal
Priority
1st
2nd
3rd
4th
5th
6th
7th
8th
Input / Internal signals
ENB, UVLO
BRKB,CW,PWMB↓
TSD, MLP, HALLERR
OVLO
VG_UVLO
BRKB
CL
PWMB, CW
Note） means rising and falling edges of signal.
For signal name, please see state transition diagram.
www.rohm.co
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
5/14
TSZ02201-0P2P0B000130-1-2
5 Page 
BD63000MUV
Datasheet
●Operational Notes
1) Absolute maximum ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc.,
can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open
circuit. If any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection
devices, such as fuses.
2) Connecting the power supply connector backward
Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power
supply lines. An external direction diode can be added.
3) Power supply Lines
Design PCB layout pattern to provide low impedance GND and supply lines. To obtain a low noise ground and supply
line, separate the ground section and supply lines of the digital and analog blocks. Furthermore, for all power supply
terminals to ICs, connect a capacitor between the power supply and the GND terminal. When applying electrolytic
capacitors in the circuit, not that capacitance characteristic values are reduced at low temperatures.
4) GND
The potential of GND pin must be minimum potential in all operating conditions. When using both small signal and
large current GND patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the
application's reference point so that the pattern wiring resistance and voltage variations caused by large currents do
not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern potential of
any external components, either.
5) Metal on the backside (Define the side where product markings are printed as front)
The metal on the backside is shorted with the backside of IC chip therefore it should be connected to GND. Be aware
that there is a possibility of malfunction or destruction if it is shorted with any potential other than GND.
6) Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating
conditions.
7) Inter-pin shorts and mounting errors
When attaching to a printed circuit board, pay close attention to the direction of the IC and displacement. Improper
attachment may lead to destruction of the IC. There is also possibility of destruction from short circuits which can be
caused by foreign matter entering between outputs or an output and the power supply or GND.
8) Operation in a strong electric field
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to
malfunction.
9) Thermal shutdown circuit
The IC has a built-in thermal shutdown circuit (TSD circuit). If the chip temperature becomes Tjmax=150°C, and higher,
coil output to the motor will be open. The TSD circuit is designed only to shut the IC off to prevent runaway thermal
operation. It is not designed to protect or indemnify peripheral equipment. Do not use the TSD function to protect
peripheral equipment.
TSD ON temperature
[°C] (Typ.)
175
Hysteresis temperature
[°C] (Typ.)
25
10) Inspection of the application board
During inspection of the application board, if a capacitor is connected to a pin with low impedance there is a possibility
that it could cause stress to the IC, therefore an electrical discharge should be performed after each process. Also, as a
measure again electrostatic discharge, it should be earthed during the assembly process and special care should be
taken during transport or storage. Furthermore, when connecting to the jig during the inspection process, the power
supply should first be turned off and then removed before the inspection.
www.rohm.co
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
11/14
TSZ02201-0P2P0B000130-1-2
11 Page | ||
| Páginas | Total 17 Páginas | |
| PDF Descargar | [ Datasheet BD63000MUV.PDF ] | |
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