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PDF MX857 Data sheet ( Hoja de datos )
| Número de pieza | MX857 | |
| Descripción | Single Driver for GaAs FET Switches and Attenuators | |
| Fabricantes | Micronix | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de MX857 (archivo pdf) en la parte inferior de esta página. Total 7 Páginas | ||
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MX856 / MX857
Single Driver for GaAs FET
Switches and Attenuators
Features:
• CMOS Technology
• TTL/CMOS compatible inputs
• Low switching noise
• 5nS typical true / complement output skew
• 5nS typical output rise and fall times
• Up to 20V output voltage
• Output high voltage programmable via VOPT
• Output low voltage programmable via VEE
Applications
• Digital control of analog circuits
• Level shifting and amplification
• Circuit applications requiring complementary
signal generation with low skew
• Bias control for PIN diode drivers in a
microwave switch
Ordering Information – MX856
Part No. Description
19202
MX856 Die / Wafer Form
19201
MX856 Die / Waffle Pack
19200-00 MX856 8 Lead SOIC
19241-00 MX856 SOIC on Tape & Reel
General Description
The MX856 and MX857 are high speed single
channel level shifters with complimentary output
drivers. The MX856 features a 5.0V VCC positive
supply, and the MX857 features a 3.3V VCC
positive supply.
The input buffers accept digital TTL or CMOS level
signals, amplifies them to the VCC and GND supply
rails, and generates complementary outputs. The
translator level shifts these output signals by
amplifying them to the VCC and VEE supply rails.
The output drivers then buffer the signals to VOPT
and VEE. VOPT may be set within the range of VCC
and GND. The output drivers also adjust the
complimentary signals for minimized skew error.
The MX856 and MX857 are designed to operate
over a temperature range of -40°C to +85°C, and
are available as die in wafer form, die in waffle
pack, 8 lead SOIC package, and SOIC on Tape
and Reel.
Ordering Information – MX857
Part No. Description
19302
MX857 Die / Wafer Form
19301
MX857 Die / Waffle Pack
19300-00 MX857 8 Lead SOIC
19341-00 MX857 SOIC on Tape & Reel
Functional Block Diagram
input buffer
VCC VCC
translator output buffer
VCC
VOPT
IN
GND GND
VEE
VEE
OUT
OUT_B
8 Lead SOIC Configuration
OUT 1
GND 2
VCC 3
IN 4
8 OUT_B
7 GND
6 VOPT
5 VEE
MX856 / MX857
Drawing No. 19209
1 4/11/06
www.claremicronix.com
1 page  
MX856 / MX857
Pad Locations (in µm)
PAD NAME
OUT
OUT_B
GND
VOPT
VEE
IN
VCC
GND
X
89.1
489.1
579.1
579.3
406
165.4
0
49.9
Y
556.4
556.4
306.3
126.8
0
0
74.3
306.3
Pad location is the pad center point in microns. The origin of the coordinates is located as shown.
MX856 / MX857
Drawing No. 19209
Die Size: 1095 µm X 930 µm
(Not Drawn To Scale)
5
4/11/06
www.claremicronix.com
5 Page | ||
| Páginas | Total 7 Páginas | |
| PDF Descargar | [ Datasheet MX857.PDF ] | |
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