|
|
PDF BD11670GWL Data sheet ( Hoja de datos )
| Número de pieza | BD11670GWL | |
| Descripción | USB Switch IC | |
| Fabricantes | ROHM Semiconductor | |
| Logotipo |  |
|
Hay una vista previa y un enlace de descarga de BD11670GWL (archivo pdf) en la parte inferior de esta página. Total 16 Páginas | ||
|
No Preview Available !
USB Switch IC
DPDT Type
(Double Pole Double Throw)
BD11670GWL
General Description
BD11670GWL is a DPDT analog switch that supports
USB2.0 high-speed and has both a low resistance and a
low capacitance.
It supports input of dual power supplies from VBUS and
VCC. VBUS of up to 28V is supported.
All terminals have electrostatic discharge protection
circuit built-in.
Features
Dual Power-Supply Architecture, VCC and VBUS.
Power Supply Range (VBUS) : 3.8V to 28V.
Power Supply Range (VCC) : 3.0V to 5.5V.
5Ωswitches between the input and the output.
Low Capacity 2ch Analog SW.
Applications
Mobile phones, Tablet PC, Digital Still Cameras, Digital
Video Camcorders, Potable Navigation Devices, TV,
Portable DVD Players, Portable Game Systems,
Personal Computers, PDA,
Key Specifications
Power Supply Range (VCC):
Power Supply Range (VBUS):
Switch ON Resistance:
Operating Temperature Range:
3.0V to 5.5V
3.8V to 28V
5Ω(Typ)
-40°C to +85°C
Package(s)
WLCSP
W(Typ) x D(Typ) x H(Max)
1.20mm x 1.60mm x 0.57mm
UCSP50L1C
Typical Application Circuit
CVCC
1uF
VSYS or
VBAT CVBUS
1uF
VBUS
CVCCIN
0.1uF
VCC
VBUS
VCCIN
PMIC
USB_X
USB_Y
Selector
signal
UNC1_X
UNC2_X
UNC1_Y
UNC2_Y
SEL
GND
COM1
COM2
Figure 1. Application circuit
〇Product structure : Silicon monolithic integrated circuit
.www.rohm.com
© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 14 • 001
〇This product was not designed with protection against radioactive rays
1/12
TSZ02201-0232AH300120-1-2
15.Feb.2016 Rev.003
1 page  
BD11670GWL
Typical Performance Curves (Unless otherwise specified, Ta=25℃, VCC=5V)
(Equipment used to plot eye pattern: Tektronix DPO7254 Oscilloscope, Tektronix TDSUBF USB Test Fixture)
6
5
4
3
2
1
0
012345
Input Voltage VIN[V]
Figure 4. Eye Pattern at Full Speed
6
6
5
4
3
2
1
0
0123456
Input Voltage VIN[V]
Figure 5. Eye Pattern at High Speed
65
60
55
50
45
40
35
30
25
20
15
10
5
0
0.0
Ta=105℃
Ta=25℃
Ta=-60℃
VCC=0→5V
SEL=0V
1.0 2.0 3.0 4.0 5.0
V_VCC [V]
Figure 6. ICC vs Input Voltage(VCC)
600
550
500
450
400
350
300
250
200
150
100
50
0
0.0
Ta=105℃
Ta=25℃
Ta=-60℃
VBUS=0→28V
SEL=0V
5.0 10.0 15.0 20.0 25.0
V_VBUS [V]
Figure 7. ICC vs Input Voltage(VBUS)
www.rohm.com
© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
5/12
TSZ02201-0232AH300120-1-2
15.Feb.2016 Rev.003
5 Page 
BD11670GWL
Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating,
increase the board size and copper area to prevent exceeding the Pd rating.
6. Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush
current may flow instantaneously due to the internal powering sequence and delays, especially if the IC
has more than one power supply. Therefore, give special consideration to power coupling capacitance,
power wiring, width of ground wiring, and routing of connections.
8. Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
www.rohm.com
© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
11/12
TSZ02201-0232AH300120-1-2
15.Feb.2016 Rev.003
11 Page | ||
| Páginas | Total 16 Páginas | |
| PDF Descargar | [ Datasheet BD11670GWL.PDF ] | |
Hoja de datos destacado
| Número de pieza | Descripción | Fabricantes |
| BD11670GWL | USB Switch IC | ROHM Semiconductor |
| Número de pieza | Descripción | Fabricantes |
| SLA6805M | High Voltage 3 phase Motor Driver IC. |
 Sanken |
| SDC1742 | 12- and 14-Bit Hybrid Synchro / Resolver-to-Digital Converters. |
 Analog Devices |
|
DataSheet.es es una pagina web que funciona como un repositorio de manuales o hoja de datos de muchos de los productos más populares, |
| DataSheet.es | 2020 | Privacy Policy | Contacto | Buscar |