|
|
Número de pieza | BV1LB085FJ-C | |
Descripción | 1ch Low Side Switch IC | |
Fabricantes | ROHM Semiconductor | |
Logotipo | ||
Hay una vista previa y un enlace de descarga de BV1LB085FJ-C (archivo pdf) en la parte inferior de esta página. Total 21 Páginas | ||
No Preview Available ! Datasheet
Automotive IPD Series
1ch Low Side Switch IC
BV1LB085FJ-C
Features
■ Built-in overcurrent limiting circuit(OCP)
■ Built-in thermal shutdown circuit(TSD)
■ Built-in active clamp circuit
■ Direct control enabled from CMOS logic IC, etc.
■ Low On resistance RON=85mΩ(Typ)
(when VIN5V, ID=0.5A, Tj25C)
■ Monolithic power management IC with the control
block (CMOS) and power MOS FET mounted on a
single chip
■ AEC-Q100 Qualified (Note 1)
(Note 1) Grade1
General Description
The BV1LB085FJ-C is an automotive 1ch low side
switch IC, which has built-in overcurrent limiting circuit,
thermal shutdown circuit, and overvoltage (active clamp)
protection circuit.
Product Summary
On-state resistance (Tj =25°C, Typ)
Overcurrent limit (Tj =25°C, Typ)
Output clamp voltage (Min)
Active clamp energy (Tj =25°C)
85mΩ
17.5A
42V
260mJ
Package
SOP-J8
W(Typ) x D(Typ) x H(Max)
4.90mm x 6.00mm x 1.65mm
Applications
1ch low side switch for driving resistive, Inductive load, Capacitive load
Block Diagram
○Product structure: Silicon monolithic integrated circuit
www.rohm.co.jp
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111・14・001
This product is not designed to protect it from radiation.
1/17
TSZ02201-0G3G0BD00090-1-2
17.Mar.2016 Rev.001
1 page BV1LB085FJ-C
■ PCB layout 2s2p (2layer)
Datasheet
Top Layer
Bottom Layer
Cross section
Top Layer
Bottom Layer
Figure 3. PCB layout 2s
Dimension
Board finish thickness
Board dimension
Board material
Copper thickness (Top/Bottom layers)
Value
1.60 mm ± 10%
76.2 mm x 114.3 mm
FR4
0.070mm (Cu + Plating)
■ PCB layout 2s2p (4layer)
Top Layer
2nd Layer
3rd Layer
Bottom Layer
Cross section
Top Layer
2nd/3rd/Bottom Layer
Figure 4. PCB layout 2s2p (4 layer)
Dimension
Board finish thickness
Board dimension
Board material
Copper thickness (Top/Bottom layers)
Copper thickness (Inner layers)
Value
1.60 mm ± 10%
76.2 mm x 114.3 mm
FR4
0.070mm (Cu + Plating)
0.035mm
www.rohm.co.jp
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
5/17
TSZ02201-0G3G0BD00090-1-2
17.Mar.2016 Rev.001
5 Page BV1LB085FJ-C
Typical Performance Curves (Unless otherwise specified, Tj=25°C, VIN=5.0V) - continued
Datasheet
250
200
150
100
50
0
-40
-10 20 50 80 110 140 170
Channel Temperature Tj [℃]
Figure 17. Figure 17. Input Current Characteristics
(Temperature Characteristics)
25
VIN=7V
20
6V
5V
4V
15
3V
10
5
0
0
12345
Output Voltage VDS[V]
6
Figure 18. Overcurrent Detection Current Characteristics
(Input Voltage Characteristics)
25
20
15
10
5
0
-40
-10 20 50 80 110 140 170
Channel Temperature Tj [℃]
Figure 19. Overcurrent Detection Current Characteristics
(Temperature Characteristics)
www.rohm.co.jp
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
11/17
TSZ02201-0G3G0BD00090-1-2
17.Mar.2016 Rev.001
11 Page |
Páginas | Total 21 Páginas | |
PDF Descargar | [ Datasheet BV1LB085FJ-C.PDF ] |
Número de pieza | Descripción | Fabricantes |
BV1LB085FJ-C | 1ch Low Side Switch IC | ROHM Semiconductor |
Número de pieza | Descripción | Fabricantes |
SLA6805M | High Voltage 3 phase Motor Driver IC. |
Sanken |
SDC1742 | 12- and 14-Bit Hybrid Synchro / Resolver-to-Digital Converters. |
Analog Devices |
DataSheet.es es una pagina web que funciona como un repositorio de manuales o hoja de datos de muchos de los productos más populares, |
DataSheet.es | 2020 | Privacy Policy | Contacto | Buscar |