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PDF CPC1998 Data sheet ( Hoja de datos )
| Número de pieza | CPC1998 | |
| Descripción | AC Power Switch | |
| Fabricantes | IXYS | |
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INTEGRATED CIRCUITS DIVISION
Characteristics
Parameter
AC Operating Voltage
Load Current
With 5°C/W Heat Sink
No Heat Sink
On-State Voltage Drop
Blocking Voltage
Thermal Resistance,
Junction-to-Case, JC
Rating
20-240
20
5
1.1
800
0.35
Units
Vrms
Arms
VP (at IL=2AP)
VP
°C/W
Features
• Load Current up to 20Arms with 5°C/W Heat Sink
• 800VP Blocking Voltage
• 5mA Control Current
• Zero-Cross Switching
• Isolated, Low Thermal Impedance Ceramic Pad for
Heat Sink Applications
• 2500Vrms Isolation, Input to Output
• DC Control, AC Output
• Optically Isolated
• TTL and CMOS Compatible
• Low EMI and RFI Generation
• High Noise Immunity
• Machine Insertable, Wave Solderable
Applications
• Programmable Control
• Process Control
• Power Control Panels
• Remote Switching
• Gas Pump Electronics
• Contactors
• Large Relays
• Solenoids
• Motors
• Heaters
Approvals
• UL 508 Recognized Component: File E69938
CPC1998
AC Power Switch
Description
CPC1998J is an AC Solid State Switch utilizing dual
power SCR outputs. This device also includes
zero-cross turn-on circuitry and is specified with an
800VP blocking voltage.
Tightly controlled zero-cross circuitry ensures low
noise switching of AC loads by minimizing the
generation of transients. The optically coupled input
and output circuits provide exceptional noise immunity
and 2500Vrms of isolation between the control and the
output. As a result, the CPC1998 is well suited for
industrial environments where electromagnetic
interference would disrupt the operation of plant facility
communications and control systems.
The unique i4-PAC package pioneered by IXYS allows
Solid State Relays to achieve the highest load current
and power ratings. This package features a unique
IXYS process in which the silicon chips are soft
soldered onto the Direct Copper Bond (DCB)
substrate instead of the traditional copper leadframe.
The DCB ceramic, the same substrate used in high
power modules, not only provides 2500Vrms isolation
but also very low junction-to-case thermal resistance
(0.35 °C/W).
Ordering Information
Part
CPC1998J
Description
i4-PAC Package (25 per tube)
Pin Configuration
ZC
12
AC Load
34
+ LED – LED
DS-CPC1998-R05
e3
www.ixysic.com
1
1 page  
INTEGRATED CIRCUITS DIVISION
CPC1998
Zero-Cross Voltage vs. Temperature
7.4 (IF=5mA, RL=120Ω)
7.2
7.0
6.8
6.6
6.4
6.2
6.0
-40 -20
0 20 40 60
Temperature (ºC)
80 100
Output Voltage vs. Output Current
15 (IF=5mA)
TA=-40ºC
10 TA=25ºC
TA=85ºC
5
0
-5
-10
-15
-1.5 -1.0 -0.5 0.0 0.5 1.0 1.5
Voltage (V)
1.10 VON vs. Temperature
1.05
1.00
0.95
0.90
0.85
0.80
0.75
0.70
IL=3A
IL=2A
IL=1A
-40 -20
0 20 40 60
Temperature (ºC)
IL=10A
IL=5A
80 100
Holding Current vs. Temperature
80 (RL=1.9Ω)
70
60
50
40
30
20
-40 -20
0 20 40 60
Temperature (ºC)
80 100
Total Heat Sinking Required
vs. Temperature
30
I =5A
L rms
25 IL=7.5Arms
IL=10Arms
20 IL=15Arms
IL=20Arms
15
10
5
0
0 10 20 30 40 50 60 70 80 90 100
Temperature (ºC)
Breakdown Voltage vs. Temperature
1000
(IF=0mA)
950
900
850
800
-40 -20
0 20 40 60
Temperature (ºC)
80 100
Leakage Current vs. Temperature
Maximum Surge Current
Measured Across Pins 1&2
Non-Repetitive, Free Air
100 1000
10
VL=800V
VL=600V
VL=400V
100
1
0.1
10
0.01
0.001
-40 -20
0 20 40 60
Temperature (ºC)
80 100
1
100μs
1ms
10ms 100ms
Time
1s
10s
* The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not
indicated in the written specifications, please contact our application department.
5
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R05
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| Páginas | Total 7 Páginas | |
| PDF Descargar | [ Datasheet CPC1998.PDF ] | |
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