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PDF SML0805-AG3K-TR Data sheet ( Hoja de datos )
| Número de pieza | SML0805-AG3K-TR | |
| Descripción | 0805 Profile Surface Mount LEDs | |
| Fabricantes | LEDTRONICS | |
| Logotipo |  |
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23105 Kashiwa Court, Torrance, CA 90505
Phone: (800) 579-4875 or (310) 534-1505 Fax: (310) 534-1424
E-mail: [email protected]
Website: http://www.ledtronics.com
SML0805-AG3K-TR
Aqua Green
0805 Profile Surface Mount LEDs
2.0×1.25×1.0mm
120° viewing angle
DWG BY:
BL / JG
11-14-06
CHK BY:
PL
11-21-06
QA:
__
__-__-__
MFG:
__
__-__-__
REVISION LTR: -
11-14-06
Part No.
SML0805-AG3K-TR
DWG NO.
DSTR0196
Page 1 of 5
1 page  
23105 Kashiwa Court, Torrance, CA 90505
Phone: (800) 579-4875 or (310) 534-1505 Fax: (310) 534-1424
E-mail: [email protected]
Website: http://www.ledtronics.com
RELIABILITY TEST
Classification
Test Item
Operation
Life
Endurance
Test
High Temperature,
High Humidity
Storage
Reference Standard
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
MIL-STD-202: 103B
JIS C 7021: B-11
Test Conditions
Connect with a power Ι = 20mAf
Ta = Under room temperature
Test time = 1,000hrs
T a = +65°C±5°C
RH = 90%-95%
Test time = 240hrs
Result
0/20
0/20
Environmental
Test
High Temperature
Storage
Low Temperature
Storage
Temperature
Cycling
Thermal Shock
Solder Resistance
MIL-STD-202: 1008
JIS C 7021: B-10
JIS C 7021: B-12
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1010
JIS C 7021: A-4
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
MIL-STD-202: 201A
MIL-STD-750: 2031
JIS C 7021: A-1
High Ta = +85°C±5°C
Test time = 1,000hrs
Low T a = -35°C±5°C
Test time = 1,000hrs
-35°C ~ +25°C ~ +85°C ~ +25°C
60min. 20min. 60min. 20min.
Test time = 5 cycles
-35°C±5°C ~ +85°C±5°C
20min. 20min.
Test time = 10 cycles
Preheating:
140°C - 160°C, within 2 minutes.
Operation heating:
235°C (Max.), within 10 seconds. (Max.)
0/20
0/20
0/20
0/20
0/20
JUDGEMENT CRITERIA OF FAILURE FOR THE RELIABILITY TEST
Measuring items
Symbol
Measuring conditions
Forward voltage
Reverse current
Luminous intensity
Vf (V)
Ι r (uA)
Ι v (mcd)
Ι f = 20mA
Vr = 5V
Ι f = 20mA
Note: 1. U means the upper limit of specific characteristics. S means initial value.
2. Measurement shall be taken between 2 hours and after the test pieces have been returned to
normal ambient conditions after completion of each test.
Judgment criteria for failure
Over Ux1.2
Over Ux2
Below Sx0.5
1. Soldering
Manual of Soldering
The temperature of the iron tip should not be higher than 300°C (572°F) and soldering within 3 seconds per solder-land is to be observed.
Reflow Soldering
Preheating: 140°C~160°C ±5°C, within 2 minutes.
Operation heating: 260°C (Max.) within 10
seconds. (Max.)
Gradual Cooling (Avoid quenching).
235°C
10 sec.
Max.
140~160°C
Over 2 min.
4°C/sec.
Max.
4°C/sec. Max.
DIP Soldering (Wave Soldering)
Preheating: 120°C~150°C, within 120~180 sec.
Operation heating: 245°C ±5°C within 5 sec.
260°C (Max.)
Gradual Cooling (Avoid quenching).
Soldering heat
Max. 260°C
120°~150°C
Preheat
120~180 sec.
245±5°C
within
5 sec.
Time →
Time →
2. Handling
Care must be taken not to cause damage to the epoxy resin portion of LEDs while it is exposed to high temperatures, or abrade the epoxy
resin portion of LEDs with hard or sharp items as from sand blasting and the use of sharp metallic objects.
3. Notes for designing
Care must be taken to provide the current limiting resistor in the circuit so as to drive the LEDs within the rated figures. Also, caution
should be taken not to overload LEDs with instantaneous voltage at the turning ON and OFF of the circuit. When using the pulse drive
care must be taken to keep the average current within the rated figures. Also, the circuit should be designed so as to be subjected to
reverse voltage when turning off the LEDs.
4. Storage:
In order to avoid the absorption of moisture, it is recommended to solder LEDs as soon as possible after unpacking the sealed envelope.
If the envelope is still packed, store it in the following environment:
(1) Temperature: 5°C-30°C (41°F-86°F) Humidity: RH 60% Max.
(2) After this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or equivalent soldering process must be:
a. Completed within 24 hours.
b. Stored at less than 30% RH
(3) Devices require baking before mounting if: (2)a or (2)b is not met.
(4) If baking is required, devices must be baked under below conditions:
12 hours at 60°C ±3°C
Part No. SML0805-AG3K-TR DWG NO. DSTR0196
Page 5 of 5
5 Page | ||
| Páginas | Total 5 Páginas | |
| PDF Descargar | [ Datasheet SML0805-AG3K-TR.PDF ] | |
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